Advances in electronic packaging 1999: proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference ; presented at the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference ; June 13-19, 1999 ; Maui, Hawaii
Gespeichert in:
Format: | Tagungsbericht Buch |
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Sprache: | English |
Veröffentlicht: |
New York, NY
ASME
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Schlagworte: | |
ISBN: | 0791816125 |
Internformat
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Datensatz im Suchindex
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discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
format | Conference Proceeding Book |
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spelling | Advances in electronic packaging 1999 proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference ; presented at the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference ; June 13-19, 1999 ; Maui, Hawaii ed. by Dereje Agonafer ... InterPACK '99 New York, NY ASME txt rdacontent n rdamedia nc rdacarrier Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf (DE-588)1071861417 Konferenzschrift gnd-content Elektronisches Bauelement (DE-588)4014360-0 s DE-604 Agonafer, Dereje Sonstige oth American Society of Mechanical Engineers Electrical and Electronic Packaging Division Sonstige (DE-588)5084881-1 oth Pacific Rim Electronic and Photonic Packaging Conference 1999 Sonstige (DE-588)5349195-6 oth |
spellingShingle | Advances in electronic packaging 1999 proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference ; presented at the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference ; June 13-19, 1999 ; Maui, Hawaii Elektronisches Bauelement (DE-588)4014360-0 gnd |
subject_GND | (DE-588)4014360-0 (DE-588)1071861417 |
title | Advances in electronic packaging 1999 proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference ; presented at the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference ; June 13-19, 1999 ; Maui, Hawaii |
title_alt | InterPACK '99 |
title_auth | Advances in electronic packaging 1999 proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference ; presented at the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference ; June 13-19, 1999 ; Maui, Hawaii |
title_exact_search | Advances in electronic packaging 1999 proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference ; presented at the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference ; June 13-19, 1999 ; Maui, Hawaii |
title_full | Advances in electronic packaging 1999 proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference ; presented at the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference ; June 13-19, 1999 ; Maui, Hawaii ed. by Dereje Agonafer ... |
title_fullStr | Advances in electronic packaging 1999 proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference ; presented at the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference ; June 13-19, 1999 ; Maui, Hawaii ed. by Dereje Agonafer ... |
title_full_unstemmed | Advances in electronic packaging 1999 proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference ; presented at the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference ; June 13-19, 1999 ; Maui, Hawaii ed. by Dereje Agonafer ... |
title_short | Advances in electronic packaging 1999 |
title_sort | advances in electronic packaging 1999 proceedings of the pacific rim asme international intersociety electronic photonic packaging conference presented at the pacific rim asme international intersociety electronic photonic packaging conference june 13 19 1999 maui hawaii |
title_sub | proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference ; presented at the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference ; June 13-19, 1999 ; Maui, Hawaii |
topic | Elektronisches Bauelement (DE-588)4014360-0 gnd |
topic_facet | Elektronisches Bauelement Konferenzschrift |
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