Process-dependent microstructure changes in solid liquid interdiffusion interconnects for 3D integration:
Gespeichert in:
1. Verfasser: | |
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Format: | Abschlussarbeit Buch |
Sprache: | English |
Veröffentlicht: |
Templin
Detert
2014
|
Ausgabe: | 1. Aufl. |
Schriftenreihe: | System integration in electronic packaging
20 |
Schlagworte: | |
Beschreibung: | XI, 138 S. Ill., graph. Darst. |
ISBN: | 9783934142657 |
Internformat
MARC
LEADER | 00000nam a2200000 cb4500 | ||
---|---|---|---|
001 | BV042338484 | ||
003 | DE-604 | ||
005 | 20150310 | ||
007 | t | ||
008 | 150211s2014 ad|| m||| 00||| eng d | ||
020 | |a 9783934142657 |c : kart. : EUR 35.00 (DE) |9 978-3-934142-65-7 | ||
035 | |a (OCoLC)894758827 | ||
035 | |a (DE-599)BVBBV042338484 | ||
040 | |a DE-604 |b ger | ||
041 | 0 | |a eng | |
049 | |a DE-29T |a DE-83 | ||
084 | |a ZN 4192 |0 (DE-625)157372: |2 rvk | ||
100 | 1 | |a Panchenko, Iuliana |d 1986- |e Verfasser |0 (DE-588)1059890755 |4 aut | |
245 | 1 | 0 | |a Process-dependent microstructure changes in solid liquid interdiffusion interconnects for 3D integration |c Iuliana Panchenko |
250 | |a 1. Aufl. | ||
264 | 1 | |a Templin |b Detert |c 2014 | |
300 | |a XI, 138 S. |b Ill., graph. Darst. | ||
336 | |b txt |2 rdacontent | ||
337 | |b n |2 rdamedia | ||
338 | |b nc |2 rdacarrier | ||
490 | 1 | |a System integration in electronic packaging |v 20 | |
502 | |a Zugl.: Dresden, Techn. Univ., Diss., 2013 | ||
546 | |a Zsfassung in dt. Sprache | ||
650 | 0 | 7 | |a Mikrolöten |0 (DE-588)4265455-5 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Intermetallische Verbindungen |0 (DE-588)4162028-8 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Mikrostruktur |0 (DE-588)4131028-7 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Kontaktieren |0 (DE-588)4165128-5 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Dreidimensionale Integration |0 (DE-588)4218841-6 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Diffusionslöten |0 (DE-588)4724923-7 |2 gnd |9 rswk-swf |
655 | 7 | |0 (DE-588)4113937-9 |a Hochschulschrift |2 gnd-content | |
689 | 0 | 0 | |a Dreidimensionale Integration |0 (DE-588)4218841-6 |D s |
689 | 0 | 1 | |a Diffusionslöten |0 (DE-588)4724923-7 |D s |
689 | 0 | 2 | |a Mikrolöten |0 (DE-588)4265455-5 |D s |
689 | 0 | 3 | |a Kontaktieren |0 (DE-588)4165128-5 |D s |
689 | 0 | 4 | |a Mikrostruktur |0 (DE-588)4131028-7 |D s |
689 | 0 | 5 | |a Intermetallische Verbindungen |0 (DE-588)4162028-8 |D s |
689 | 0 | |5 DE-604 | |
830 | 0 | |a System integration in electronic packaging |v 20 |w (DE-604)BV035217133 |9 20 | |
999 | |a oai:aleph.bib-bvb.de:BVB01-027775065 |
Datensatz im Suchindex
_version_ | 1804152947935805440 |
---|---|
any_adam_object | |
author | Panchenko, Iuliana 1986- |
author_GND | (DE-588)1059890755 |
author_facet | Panchenko, Iuliana 1986- |
author_role | aut |
author_sort | Panchenko, Iuliana 1986- |
author_variant | i p ip |
building | Verbundindex |
bvnumber | BV042338484 |
classification_rvk | ZN 4192 |
ctrlnum | (OCoLC)894758827 (DE-599)BVBBV042338484 |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
edition | 1. Aufl. |
format | Thesis Book |
fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02005nam a2200493 cb4500</leader><controlfield tag="001">BV042338484</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20150310 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">150211s2014 ad|| m||| 00||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783934142657</subfield><subfield code="c">: kart. : EUR 35.00 (DE)</subfield><subfield code="9">978-3-934142-65-7</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)894758827</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV042338484</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-29T</subfield><subfield code="a">DE-83</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4192</subfield><subfield code="0">(DE-625)157372:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Panchenko, Iuliana</subfield><subfield code="d">1986-</subfield><subfield code="e">Verfasser</subfield><subfield code="0">(DE-588)1059890755</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Process-dependent microstructure changes in solid liquid interdiffusion interconnects for 3D integration</subfield><subfield code="c">Iuliana Panchenko</subfield></datafield><datafield tag="250" ind1=" " ind2=" "><subfield code="a">1. Aufl.</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Templin</subfield><subfield code="b">Detert</subfield><subfield code="c">2014</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">XI, 138 S.</subfield><subfield code="b">Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="1" ind2=" "><subfield code="a">System integration in electronic packaging</subfield><subfield code="v">20</subfield></datafield><datafield tag="502" ind1=" " ind2=" "><subfield code="a">Zugl.: Dresden, Techn. Univ., Diss., 2013</subfield></datafield><datafield tag="546" ind1=" " ind2=" "><subfield code="a">Zsfassung in dt. Sprache</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Mikrolöten</subfield><subfield code="0">(DE-588)4265455-5</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Intermetallische Verbindungen</subfield><subfield code="0">(DE-588)4162028-8</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Mikrostruktur</subfield><subfield code="0">(DE-588)4131028-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Kontaktieren</subfield><subfield code="0">(DE-588)4165128-5</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Dreidimensionale Integration</subfield><subfield code="0">(DE-588)4218841-6</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Diffusionslöten</subfield><subfield code="0">(DE-588)4724923-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)4113937-9</subfield><subfield code="a">Hochschulschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Dreidimensionale Integration</subfield><subfield code="0">(DE-588)4218841-6</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Diffusionslöten</subfield><subfield code="0">(DE-588)4724923-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Mikrolöten</subfield><subfield code="0">(DE-588)4265455-5</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="3"><subfield code="a">Kontaktieren</subfield><subfield code="0">(DE-588)4165128-5</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="4"><subfield code="a">Mikrostruktur</subfield><subfield code="0">(DE-588)4131028-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="5"><subfield code="a">Intermetallische Verbindungen</subfield><subfield code="0">(DE-588)4162028-8</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="830" ind1=" " ind2="0"><subfield code="a">System integration in electronic packaging</subfield><subfield code="v">20</subfield><subfield code="w">(DE-604)BV035217133</subfield><subfield code="9">20</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-027775065</subfield></datafield></record></collection> |
genre | (DE-588)4113937-9 Hochschulschrift gnd-content |
genre_facet | Hochschulschrift |
id | DE-604.BV042338484 |
illustrated | Illustrated |
indexdate | 2024-07-10T01:18:49Z |
institution | BVB |
isbn | 9783934142657 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-027775065 |
oclc_num | 894758827 |
open_access_boolean | |
owner | DE-29T DE-83 |
owner_facet | DE-29T DE-83 |
physical | XI, 138 S. Ill., graph. Darst. |
publishDate | 2014 |
publishDateSearch | 2014 |
publishDateSort | 2014 |
publisher | Detert |
record_format | marc |
series | System integration in electronic packaging |
series2 | System integration in electronic packaging |
spelling | Panchenko, Iuliana 1986- Verfasser (DE-588)1059890755 aut Process-dependent microstructure changes in solid liquid interdiffusion interconnects for 3D integration Iuliana Panchenko 1. Aufl. Templin Detert 2014 XI, 138 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier System integration in electronic packaging 20 Zugl.: Dresden, Techn. Univ., Diss., 2013 Zsfassung in dt. Sprache Mikrolöten (DE-588)4265455-5 gnd rswk-swf Intermetallische Verbindungen (DE-588)4162028-8 gnd rswk-swf Mikrostruktur (DE-588)4131028-7 gnd rswk-swf Kontaktieren (DE-588)4165128-5 gnd rswk-swf Dreidimensionale Integration (DE-588)4218841-6 gnd rswk-swf Diffusionslöten (DE-588)4724923-7 gnd rswk-swf (DE-588)4113937-9 Hochschulschrift gnd-content Dreidimensionale Integration (DE-588)4218841-6 s Diffusionslöten (DE-588)4724923-7 s Mikrolöten (DE-588)4265455-5 s Kontaktieren (DE-588)4165128-5 s Mikrostruktur (DE-588)4131028-7 s Intermetallische Verbindungen (DE-588)4162028-8 s DE-604 System integration in electronic packaging 20 (DE-604)BV035217133 20 |
spellingShingle | Panchenko, Iuliana 1986- Process-dependent microstructure changes in solid liquid interdiffusion interconnects for 3D integration System integration in electronic packaging Mikrolöten (DE-588)4265455-5 gnd Intermetallische Verbindungen (DE-588)4162028-8 gnd Mikrostruktur (DE-588)4131028-7 gnd Kontaktieren (DE-588)4165128-5 gnd Dreidimensionale Integration (DE-588)4218841-6 gnd Diffusionslöten (DE-588)4724923-7 gnd |
subject_GND | (DE-588)4265455-5 (DE-588)4162028-8 (DE-588)4131028-7 (DE-588)4165128-5 (DE-588)4218841-6 (DE-588)4724923-7 (DE-588)4113937-9 |
title | Process-dependent microstructure changes in solid liquid interdiffusion interconnects for 3D integration |
title_auth | Process-dependent microstructure changes in solid liquid interdiffusion interconnects for 3D integration |
title_exact_search | Process-dependent microstructure changes in solid liquid interdiffusion interconnects for 3D integration |
title_full | Process-dependent microstructure changes in solid liquid interdiffusion interconnects for 3D integration Iuliana Panchenko |
title_fullStr | Process-dependent microstructure changes in solid liquid interdiffusion interconnects for 3D integration Iuliana Panchenko |
title_full_unstemmed | Process-dependent microstructure changes in solid liquid interdiffusion interconnects for 3D integration Iuliana Panchenko |
title_short | Process-dependent microstructure changes in solid liquid interdiffusion interconnects for 3D integration |
title_sort | process dependent microstructure changes in solid liquid interdiffusion interconnects for 3d integration |
topic | Mikrolöten (DE-588)4265455-5 gnd Intermetallische Verbindungen (DE-588)4162028-8 gnd Mikrostruktur (DE-588)4131028-7 gnd Kontaktieren (DE-588)4165128-5 gnd Dreidimensionale Integration (DE-588)4218841-6 gnd Diffusionslöten (DE-588)4724923-7 gnd |
topic_facet | Mikrolöten Intermetallische Verbindungen Mikrostruktur Kontaktieren Dreidimensionale Integration Diffusionslöten Hochschulschrift |
volume_link | (DE-604)BV035217133 |
work_keys_str_mv | AT panchenkoiuliana processdependentmicrostructurechangesinsolidliquidinterdiffusioninterconnectsfor3dintegration |