Adhesives technology for electronic applications: materials, processes, reliability
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Norwich, NY
William Andrew Pub.
c2005
|
| Schriftenreihe: | Materials and processes for electronic applications series
|
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Beschreibung: | Includes bibliographical references and index This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references |
| Beschreibung: | 1 Online-Ressource (xvi, 459 p.) |
| ISBN: | 0815515138 9780815515135 1591249422 9781591249429 9780080947167 0080947166 |
Internformat
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV042317148 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 150129s2005 |||| o||u| ||||||eng d | ||
| 020 | |a 0815515138 |9 0-8155-1513-8 | ||
| 020 | |a 9780815515135 |9 978-0-8155-1513-5 | ||
| 020 | |a 1591249422 |c electronic bk. |9 1-59124-942-2 | ||
| 020 | |a 9781591249429 |c electronic bk. |9 978-1-59124-942-9 | ||
| 020 | |a 9780080947167 |c ebook |9 978-0-08-094716-7 | ||
| 020 | |a 0080947166 |c ebook |9 0-08-094716-6 | ||
| 035 | |a (OCoLC)468750627 | ||
| 035 | |a (DE-599)BVBBV042317148 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-1046 | ||
| 082 | 0 | |a 621.381 |2 22 | |
| 100 | 1 | |a Licari, James J. |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Adhesives technology for electronic applications |b materials, processes, reliability |c by James J. Licari and Dale W. Swanson |
| 264 | 1 | |a Norwich, NY |b William Andrew Pub. |c c2005 | |
| 300 | |a 1 Online-Ressource (xvi, 459 p.) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 490 | 0 | |a Materials and processes for electronic applications series | |
| 500 | |a Includes bibliographical references and index | ||
| 500 | |a This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references | ||
| 650 | 4 | |a Handbooks | |
| 650 | 7 | |a Adhesives |2 fast | |
| 650 | 7 | |a Electronic packaging |2 fast | |
| 650 | 7 | |a Electronics / Materials |2 fast | |
| 650 | 4 | |a Electronics |x Materials | |
| 650 | 4 | |a Adhesives | |
| 650 | 4 | |a Electronic packaging | |
| 650 | 0 | 7 | |a Adhäsion |0 (DE-588)4000493-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Elektroniktechnologie |0 (DE-588)4402723-0 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Elektroniktechnologie |0 (DE-588)4402723-0 |D s |
| 689 | 0 | 1 | |a Adhäsion |0 (DE-588)4000493-4 |D s |
| 689 | 0 | |8 1\p |5 DE-604 | |
| 700 | 1 | |a Swanson, Dale W. |e Sonstige |4 oth | |
| 856 | 4 | 0 | |u http://www.sciencedirect.com/science/book/9780815515135 |x Verlag |3 Volltext |
| 912 | |a ZDB-33-ESD |a ZDB-33-EBS | ||
| 940 | 1 | |q FAW_PDA_ESD | |
| 940 | 1 | |q FLA_PDA_ESD | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-027754139 | ||
| 883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
Datensatz im Suchindex
| _version_ | 1804152913275125760 |
|---|---|
| any_adam_object | |
| author | Licari, James J. |
| author_facet | Licari, James J. |
| author_role | aut |
| author_sort | Licari, James J. |
| author_variant | j j l jj jjl |
| building | Verbundindex |
| bvnumber | BV042317148 |
| collection | ZDB-33-ESD ZDB-33-EBS |
| ctrlnum | (OCoLC)468750627 (DE-599)BVBBV042317148 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02849nmm a2200577zc 4500</leader><controlfield tag="001">BV042317148</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">150129s2005 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0815515138</subfield><subfield code="9">0-8155-1513-8</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780815515135</subfield><subfield code="9">978-0-8155-1513-5</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">1591249422</subfield><subfield code="c">electronic bk.</subfield><subfield code="9">1-59124-942-2</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781591249429</subfield><subfield code="c">electronic bk.</subfield><subfield code="9">978-1-59124-942-9</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780080947167</subfield><subfield code="c">ebook</subfield><subfield code="9">978-0-08-094716-7</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0080947166</subfield><subfield code="c">ebook</subfield><subfield code="9">0-08-094716-6</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)468750627</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV042317148</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-1046</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381</subfield><subfield code="2">22</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Licari, James J.</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Adhesives technology for electronic applications</subfield><subfield code="b">materials, processes, reliability</subfield><subfield code="c">by James J. Licari and Dale W. Swanson</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Norwich, NY</subfield><subfield code="b">William Andrew Pub.</subfield><subfield code="c">c2005</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (xvi, 459 p.)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Materials and processes for electronic applications series</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and index</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Handbooks</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Adhesives</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Electronic packaging</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Electronics / Materials</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics</subfield><subfield code="x">Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Adhesives</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic packaging</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Adhäsion</subfield><subfield code="0">(DE-588)4000493-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Elektroniktechnologie</subfield><subfield code="0">(DE-588)4402723-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Elektroniktechnologie</subfield><subfield code="0">(DE-588)4402723-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Adhäsion</subfield><subfield code="0">(DE-588)4000493-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="8">1\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Swanson, Dale W.</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">http://www.sciencedirect.com/science/book/9780815515135</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-33-ESD</subfield><subfield code="a">ZDB-33-EBS</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">FAW_PDA_ESD</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">FLA_PDA_ESD</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-027754139</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield></record></collection> |
| id | DE-604.BV042317148 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T01:18:16Z |
| institution | BVB |
| isbn | 0815515138 9780815515135 1591249422 9781591249429 9780080947167 0080947166 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-027754139 |
| oclc_num | 468750627 |
| open_access_boolean | |
| owner | DE-1046 |
| owner_facet | DE-1046 |
| physical | 1 Online-Ressource (xvi, 459 p.) |
| psigel | ZDB-33-ESD ZDB-33-EBS FAW_PDA_ESD FLA_PDA_ESD |
| publishDate | 2005 |
| publishDateSearch | 2005 |
| publishDateSort | 2005 |
| publisher | William Andrew Pub. |
| record_format | marc |
| series2 | Materials and processes for electronic applications series |
| spelling | Licari, James J. Verfasser aut Adhesives technology for electronic applications materials, processes, reliability by James J. Licari and Dale W. Swanson Norwich, NY William Andrew Pub. c2005 1 Online-Ressource (xvi, 459 p.) txt rdacontent c rdamedia cr rdacarrier Materials and processes for electronic applications series Includes bibliographical references and index This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references Handbooks Adhesives fast Electronic packaging fast Electronics / Materials fast Electronics Materials Adhesives Electronic packaging Adhäsion (DE-588)4000493-4 gnd rswk-swf Elektroniktechnologie (DE-588)4402723-0 gnd rswk-swf Elektroniktechnologie (DE-588)4402723-0 s Adhäsion (DE-588)4000493-4 s 1\p DE-604 Swanson, Dale W. Sonstige oth http://www.sciencedirect.com/science/book/9780815515135 Verlag Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Licari, James J. Adhesives technology for electronic applications materials, processes, reliability Handbooks Adhesives fast Electronic packaging fast Electronics / Materials fast Electronics Materials Adhesives Electronic packaging Adhäsion (DE-588)4000493-4 gnd Elektroniktechnologie (DE-588)4402723-0 gnd |
| subject_GND | (DE-588)4000493-4 (DE-588)4402723-0 |
| title | Adhesives technology for electronic applications materials, processes, reliability |
| title_auth | Adhesives technology for electronic applications materials, processes, reliability |
| title_exact_search | Adhesives technology for electronic applications materials, processes, reliability |
| title_full | Adhesives technology for electronic applications materials, processes, reliability by James J. Licari and Dale W. Swanson |
| title_fullStr | Adhesives technology for electronic applications materials, processes, reliability by James J. Licari and Dale W. Swanson |
| title_full_unstemmed | Adhesives technology for electronic applications materials, processes, reliability by James J. Licari and Dale W. Swanson |
| title_short | Adhesives technology for electronic applications |
| title_sort | adhesives technology for electronic applications materials processes reliability |
| title_sub | materials, processes, reliability |
| topic | Handbooks Adhesives fast Electronic packaging fast Electronics / Materials fast Electronics Materials Adhesives Electronic packaging Adhäsion (DE-588)4000493-4 gnd Elektroniktechnologie (DE-588)4402723-0 gnd |
| topic_facet | Handbooks Adhesives Electronic packaging Electronics / Materials Electronics Materials Adhäsion Elektroniktechnologie |
| url | http://www.sciencedirect.com/science/book/9780815515135 |
| work_keys_str_mv | AT licarijamesj adhesivestechnologyforelectronicapplicationsmaterialsprocessesreliability AT swansondalew adhesivestechnologyforelectronicapplicationsmaterialsprocessesreliability |