Reliability and failure of electronic materials and devices:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
San Diego
Academic Press
c1998
|
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Beschreibung: | Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects--their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed. The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise. Key Features * Discusses reliability and failure on both the chip and packaging levels * Handles the role of defects in yield and reliability * Includes a tutorial chapter on the mathematics of reliability * Focuses on electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of packages, contacts, and solder joints * Considers defect detection methods and failure analysis techniques Includes bibliographical references and index |
| Beschreibung: | 1 Online-Ressource (xxi, 692 p.) |
| ISBN: | 9780125249850 0125249853 9780080516073 0080516076 1281984108 9781281984104 |
Internformat
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV042316974 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 150129s1998 |||| o||u| ||||||eng d | ||
| 020 | |a 9780125249850 |9 978-0-12-524985-0 | ||
| 020 | |a 0125249853 |9 0-12-524985-3 | ||
| 020 | |a 9780080516073 |c electronic bk. |9 978-0-08-051607-3 | ||
| 020 | |a 0080516076 |c electronic bk. |9 0-08-051607-6 | ||
| 020 | |a 1281984108 |9 1-281-98410-8 | ||
| 020 | |a 9781281984104 |9 978-1-281-98410-4 | ||
| 035 | |a (OCoLC)162128641 | ||
| 035 | |a (DE-599)BVBBV042316974 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-1046 | ||
| 082 | 0 | |a 621.381 |2 22 | |
| 100 | 1 | |a Ohring, Milton |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Reliability and failure of electronic materials and devices |c Milton Ohring |
| 246 | 1 | 3 | |a Electronic materials and devices |
| 264 | 1 | |a San Diego |b Academic Press |c c1998 | |
| 300 | |a 1 Online-Ressource (xxi, 692 p.) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 500 | |a Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects--their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed. The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise. Key Features * Discusses reliability and failure on both the chip and packaging levels * Handles the role of defects in yield and reliability * Includes a tutorial chapter on the mathematics of reliability * Focuses on electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of packages, contacts, and solder joints * Considers defect detection methods and failure analysis techniques | ||
| 500 | |a Includes bibliographical references and index | ||
| 650 | 7 | |a TECHNOLOGY & ENGINEERING / Electronics / Microelectronics |2 bisacsh | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING / Electronics / Digital |2 bisacsh | |
| 650 | 7 | |a Electronic apparatus and appliances / Reliability |2 fast | |
| 650 | 7 | |a System failures (Engineering) |2 fast | |
| 650 | 4 | |a Electronic apparatus and appliances |x Reliability | |
| 650 | 4 | |a System failures (Engineering) | |
| 650 | 0 | 7 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Zuverlässigkeit |0 (DE-588)4059245-5 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |D s |
| 689 | 0 | 1 | |a Zuverlässigkeit |0 (DE-588)4059245-5 |D s |
| 689 | 0 | |8 1\p |5 DE-604 | |
| 856 | 4 | 0 | |u http://www.sciencedirect.com/science/book/9780125249850 |x Verlag |3 Volltext |
| 912 | |a ZDB-33-ESD |a ZDB-33-EBS | ||
| 940 | 1 | |q FAW_PDA_ESD | |
| 940 | 1 | |q FLA_PDA_ESD | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-027753965 | ||
| 883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
Datensatz im Suchindex
| _version_ | 1804152912919658496 |
|---|---|
| any_adam_object | |
| author | Ohring, Milton |
| author_facet | Ohring, Milton |
| author_role | aut |
| author_sort | Ohring, Milton |
| author_variant | m o mo |
| building | Verbundindex |
| bvnumber | BV042316974 |
| collection | ZDB-33-ESD ZDB-33-EBS |
| ctrlnum | (OCoLC)162128641 (DE-599)BVBBV042316974 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03682nmm a2200553zc 4500</leader><controlfield tag="001">BV042316974</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">150129s1998 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780125249850</subfield><subfield code="9">978-0-12-524985-0</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0125249853</subfield><subfield code="9">0-12-524985-3</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780080516073</subfield><subfield code="c">electronic bk.</subfield><subfield code="9">978-0-08-051607-3</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0080516076</subfield><subfield code="c">electronic bk.</subfield><subfield code="9">0-08-051607-6</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">1281984108</subfield><subfield code="9">1-281-98410-8</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781281984104</subfield><subfield code="9">978-1-281-98410-4</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)162128641</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV042316974</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-1046</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381</subfield><subfield code="2">22</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Ohring, Milton</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Reliability and failure of electronic materials and devices</subfield><subfield code="c">Milton Ohring</subfield></datafield><datafield tag="246" ind1="1" ind2="3"><subfield code="a">Electronic materials and devices</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">San Diego</subfield><subfield code="b">Academic Press</subfield><subfield code="c">c1998</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (xxi, 692 p.)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects--their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed. The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise. Key Features * Discusses reliability and failure on both the chip and packaging levels * Handles the role of defects in yield and reliability * Includes a tutorial chapter on the mathematics of reliability * Focuses on electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of packages, contacts, and solder joints * Considers defect detection methods and failure analysis techniques</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and index</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Electronics / Microelectronics</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Electronics / Digital</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Electronic apparatus and appliances / Reliability</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">System failures (Engineering)</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic apparatus and appliances</subfield><subfield code="x">Reliability</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">System failures (Engineering)</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Elektronisches Bauelement</subfield><subfield code="0">(DE-588)4014360-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Zuverlässigkeit</subfield><subfield code="0">(DE-588)4059245-5</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Elektronisches Bauelement</subfield><subfield code="0">(DE-588)4014360-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Zuverlässigkeit</subfield><subfield code="0">(DE-588)4059245-5</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="8">1\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">http://www.sciencedirect.com/science/book/9780125249850</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-33-ESD</subfield><subfield code="a">ZDB-33-EBS</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">FAW_PDA_ESD</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">FLA_PDA_ESD</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-027753965</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield></record></collection> |
| id | DE-604.BV042316974 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T01:18:15Z |
| institution | BVB |
| isbn | 9780125249850 0125249853 9780080516073 0080516076 1281984108 9781281984104 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-027753965 |
| oclc_num | 162128641 |
| open_access_boolean | |
| owner | DE-1046 |
| owner_facet | DE-1046 |
| physical | 1 Online-Ressource (xxi, 692 p.) |
| psigel | ZDB-33-ESD ZDB-33-EBS FAW_PDA_ESD FLA_PDA_ESD |
| publishDate | 1998 |
| publishDateSearch | 1998 |
| publishDateSort | 1998 |
| publisher | Academic Press |
| record_format | marc |
| spelling | Ohring, Milton Verfasser aut Reliability and failure of electronic materials and devices Milton Ohring Electronic materials and devices San Diego Academic Press c1998 1 Online-Ressource (xxi, 692 p.) txt rdacontent c rdamedia cr rdacarrier Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects--their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed. The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise. Key Features * Discusses reliability and failure on both the chip and packaging levels * Handles the role of defects in yield and reliability * Includes a tutorial chapter on the mathematics of reliability * Focuses on electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of packages, contacts, and solder joints * Considers defect detection methods and failure analysis techniques Includes bibliographical references and index TECHNOLOGY & ENGINEERING / Electronics / Microelectronics bisacsh TECHNOLOGY & ENGINEERING / Electronics / Digital bisacsh Electronic apparatus and appliances / Reliability fast System failures (Engineering) fast Electronic apparatus and appliances Reliability System failures (Engineering) Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Zuverlässigkeit (DE-588)4059245-5 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 s Zuverlässigkeit (DE-588)4059245-5 s 1\p DE-604 http://www.sciencedirect.com/science/book/9780125249850 Verlag Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Ohring, Milton Reliability and failure of electronic materials and devices TECHNOLOGY & ENGINEERING / Electronics / Microelectronics bisacsh TECHNOLOGY & ENGINEERING / Electronics / Digital bisacsh Electronic apparatus and appliances / Reliability fast System failures (Engineering) fast Electronic apparatus and appliances Reliability System failures (Engineering) Elektronisches Bauelement (DE-588)4014360-0 gnd Zuverlässigkeit (DE-588)4059245-5 gnd |
| subject_GND | (DE-588)4014360-0 (DE-588)4059245-5 |
| title | Reliability and failure of electronic materials and devices |
| title_alt | Electronic materials and devices |
| title_auth | Reliability and failure of electronic materials and devices |
| title_exact_search | Reliability and failure of electronic materials and devices |
| title_full | Reliability and failure of electronic materials and devices Milton Ohring |
| title_fullStr | Reliability and failure of electronic materials and devices Milton Ohring |
| title_full_unstemmed | Reliability and failure of electronic materials and devices Milton Ohring |
| title_short | Reliability and failure of electronic materials and devices |
| title_sort | reliability and failure of electronic materials and devices |
| topic | TECHNOLOGY & ENGINEERING / Electronics / Microelectronics bisacsh TECHNOLOGY & ENGINEERING / Electronics / Digital bisacsh Electronic apparatus and appliances / Reliability fast System failures (Engineering) fast Electronic apparatus and appliances Reliability System failures (Engineering) Elektronisches Bauelement (DE-588)4014360-0 gnd Zuverlässigkeit (DE-588)4059245-5 gnd |
| topic_facet | TECHNOLOGY & ENGINEERING / Electronics / Microelectronics TECHNOLOGY & ENGINEERING / Electronics / Digital Electronic apparatus and appliances / Reliability System failures (Engineering) Electronic apparatus and appliances Reliability Elektronisches Bauelement Zuverlässigkeit |
| url | http://www.sciencedirect.com/science/book/9780125249850 |
| work_keys_str_mv | AT ohringmilton reliabilityandfailureofelectronicmaterialsanddevices AT ohringmilton electronicmaterialsanddevices |