Reflow soldering processes: SMT, BGA, CSP and flip chip technologies
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Boston
Newnes
c2002
|
| Schlagworte: | |
| Online-Zugang: | FHI01 Volltext |
| Beschreibung: | Includes bibliographical references and index Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process, --and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process |
| Beschreibung: | 1 Online-Ressource (ix, 270 p.) |
| ISBN: | 9780080492247 008049224X 0750672188 9780750672184 |
| DOI: | 10.1016/B978-0-7506-7218-4.X5000-3 |
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Datensatz im Suchindex
| _version_ | 1804152912916512768 |
|---|---|
| any_adam_object | |
| author | Lee, Ning-Cheng |
| author_facet | Lee, Ning-Cheng |
| author_role | aut |
| author_sort | Lee, Ning-Cheng |
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| dewey-full | 621.381/046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik Werkstoffwissenschaften / Fertigungstechnik |
| doi_str_mv | 10.1016/B978-0-7506-7218-4.X5000-3 |
| format | Electronic eBook |
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| id | DE-604.BV042316973 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T01:18:15Z |
| institution | BVB |
| isbn | 9780080492247 008049224X 0750672188 9780750672184 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-027753964 |
| oclc_num | 159936926 |
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| owner | DE-1046 DE-573 |
| owner_facet | DE-1046 DE-573 |
| physical | 1 Online-Ressource (ix, 270 p.) |
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| publishDate | 2002 |
| publishDateSearch | 2002 |
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| publisher | Newnes |
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| spelling | Lee, Ning-Cheng Verfasser aut Reflow soldering processes SMT, BGA, CSP and flip chip technologies Ning-Cheng Lee Boston Newnes c2002 1 Online-Ressource (ix, 270 p.) txt rdacontent c rdamedia cr rdacarrier Includes bibliographical references and index Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process, --and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process TECHNOLOGY & ENGINEERING / Electronics / Microelectronics bisacsh TECHNOLOGY & ENGINEERING / Electronics / Digital bisacsh Electric connectors fast Electronic apparatus and appliances / Design and construction fast Electronic packaging fast Solder and soldering fast Electronic apparatus and appliances Design and construction Solder and soldering Electronic packaging Electric connectors Löten (DE-588)4036162-7 gnd rswk-swf Reflow-Löten (DE-588)4273607-9 gnd rswk-swf Oberflächenmontiertes Bauelement (DE-588)4132685-4 gnd rswk-swf Oberflächenmontage (DE-588)4248071-1 gnd rswk-swf Reflow-Löten (DE-588)4273607-9 s Oberflächenmontage (DE-588)4248071-1 s DE-604 Oberflächenmontiertes Bauelement (DE-588)4132685-4 s Löten (DE-588)4036162-7 s https://doi.org/10.1016/B978-0-7506-7218-4.X5000-3 Verlag Volltext |
| spellingShingle | Lee, Ning-Cheng Reflow soldering processes SMT, BGA, CSP and flip chip technologies TECHNOLOGY & ENGINEERING / Electronics / Microelectronics bisacsh TECHNOLOGY & ENGINEERING / Electronics / Digital bisacsh Electric connectors fast Electronic apparatus and appliances / Design and construction fast Electronic packaging fast Solder and soldering fast Electronic apparatus and appliances Design and construction Solder and soldering Electronic packaging Electric connectors Löten (DE-588)4036162-7 gnd Reflow-Löten (DE-588)4273607-9 gnd Oberflächenmontiertes Bauelement (DE-588)4132685-4 gnd Oberflächenmontage (DE-588)4248071-1 gnd |
| subject_GND | (DE-588)4036162-7 (DE-588)4273607-9 (DE-588)4132685-4 (DE-588)4248071-1 |
| title | Reflow soldering processes SMT, BGA, CSP and flip chip technologies |
| title_auth | Reflow soldering processes SMT, BGA, CSP and flip chip technologies |
| title_exact_search | Reflow soldering processes SMT, BGA, CSP and flip chip technologies |
| title_full | Reflow soldering processes SMT, BGA, CSP and flip chip technologies Ning-Cheng Lee |
| title_fullStr | Reflow soldering processes SMT, BGA, CSP and flip chip technologies Ning-Cheng Lee |
| title_full_unstemmed | Reflow soldering processes SMT, BGA, CSP and flip chip technologies Ning-Cheng Lee |
| title_short | Reflow soldering processes |
| title_sort | reflow soldering processes smt bga csp and flip chip technologies |
| title_sub | SMT, BGA, CSP and flip chip technologies |
| topic | TECHNOLOGY & ENGINEERING / Electronics / Microelectronics bisacsh TECHNOLOGY & ENGINEERING / Electronics / Digital bisacsh Electric connectors fast Electronic apparatus and appliances / Design and construction fast Electronic packaging fast Solder and soldering fast Electronic apparatus and appliances Design and construction Solder and soldering Electronic packaging Electric connectors Löten (DE-588)4036162-7 gnd Reflow-Löten (DE-588)4273607-9 gnd Oberflächenmontiertes Bauelement (DE-588)4132685-4 gnd Oberflächenmontage (DE-588)4248071-1 gnd |
| topic_facet | TECHNOLOGY & ENGINEERING / Electronics / Microelectronics TECHNOLOGY & ENGINEERING / Electronics / Digital Electric connectors Electronic apparatus and appliances / Design and construction Electronic packaging Solder and soldering Electronic apparatus and appliances Design and construction Löten Reflow-Löten Oberflächenmontiertes Bauelement Oberflächenmontage |
| url | https://doi.org/10.1016/B978-0-7506-7218-4.X5000-3 |
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