Handbook of silicon wafer cleaning technology:
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Norwich, NY
William Andrew
© 2008
|
| Ausgabe: | 2nd ed |
| Schriftenreihe: | Materials science and process technology series
|
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Beschreibung: | Includes bibliographical references and index The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included." Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits." As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries." Covers processes and equipment, as well as new materials and changes required for the surface conditioning process." Editors are two of the top names in the field and are both extensively published." Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol |
| Beschreibung: | 1 Online-Ressource (xxvi, 718 pages) |
| ISBN: | 9780815517733 0815517734 9780815515548 0815515545 9780815517719 0815517718 |
Internformat
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| 245 | 1 | 0 | |a Handbook of silicon wafer cleaning technology |c edited by Karen A. Reinhardt, Werner Kern |
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Datensatz im Suchindex
| _version_ | 1804152908062654464 |
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| building | Verbundindex |
| bvnumber | BV042314677 |
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| dewey-full | 621.3815/2 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3815/2 |
| dewey-search | 621.3815/2 |
| dewey-sort | 3621.3815 12 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| edition | 2nd ed |
| format | Electronic eBook |
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| id | DE-604.BV042314677 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T01:18:11Z |
| institution | BVB |
| isbn | 9780815517733 0815517734 9780815515548 0815515545 9780815517719 0815517718 |
| language | English |
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| physical | 1 Online-Ressource (xxvi, 718 pages) |
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| publishDate | 2008 |
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| publisher | William Andrew |
| record_format | marc |
| series2 | Materials science and process technology series |
| spelling | Handbook of silicon wafer cleaning technology edited by Karen A. Reinhardt, Werner Kern 2nd ed Norwich, NY William Andrew © 2008 1 Online-Ressource (xxvi, 718 pages) txt rdacontent c rdamedia cr rdacarrier Materials science and process technology series Includes bibliographical references and index The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included." Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits." As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries." Covers processes and equipment, as well as new materials and changes required for the surface conditioning process." Editors are two of the top names in the field and are both extensively published." Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol TECHNOLOGY & ENGINEERING / Electronics / Solid State bisacsh TECHNOLOGY & ENGINEERING / Electronics / Semiconductors bisacsh Silicon-on-insulator technology fast Silicon-on-insulator technology SOI-Technik (DE-588)4128029-5 gnd rswk-swf Wafer (DE-588)4294605-0 gnd rswk-swf Oberflächenreinigung (DE-588)4204243-4 gnd rswk-swf SOI-Technik (DE-588)4128029-5 s Wafer (DE-588)4294605-0 s Oberflächenreinigung (DE-588)4204243-4 s 1\p DE-604 Reinhardt, Karen A. Sonstige oth Kern, Werner Sonstige oth http://www.sciencedirect.com/science/book/9780815515548 Verlag Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Handbook of silicon wafer cleaning technology TECHNOLOGY & ENGINEERING / Electronics / Solid State bisacsh TECHNOLOGY & ENGINEERING / Electronics / Semiconductors bisacsh Silicon-on-insulator technology fast Silicon-on-insulator technology SOI-Technik (DE-588)4128029-5 gnd Wafer (DE-588)4294605-0 gnd Oberflächenreinigung (DE-588)4204243-4 gnd |
| subject_GND | (DE-588)4128029-5 (DE-588)4294605-0 (DE-588)4204243-4 |
| title | Handbook of silicon wafer cleaning technology |
| title_auth | Handbook of silicon wafer cleaning technology |
| title_exact_search | Handbook of silicon wafer cleaning technology |
| title_full | Handbook of silicon wafer cleaning technology edited by Karen A. Reinhardt, Werner Kern |
| title_fullStr | Handbook of silicon wafer cleaning technology edited by Karen A. Reinhardt, Werner Kern |
| title_full_unstemmed | Handbook of silicon wafer cleaning technology edited by Karen A. Reinhardt, Werner Kern |
| title_short | Handbook of silicon wafer cleaning technology |
| title_sort | handbook of silicon wafer cleaning technology |
| topic | TECHNOLOGY & ENGINEERING / Electronics / Solid State bisacsh TECHNOLOGY & ENGINEERING / Electronics / Semiconductors bisacsh Silicon-on-insulator technology fast Silicon-on-insulator technology SOI-Technik (DE-588)4128029-5 gnd Wafer (DE-588)4294605-0 gnd Oberflächenreinigung (DE-588)4204243-4 gnd |
| topic_facet | TECHNOLOGY & ENGINEERING / Electronics / Solid State TECHNOLOGY & ENGINEERING / Electronics / Semiconductors Silicon-on-insulator technology SOI-Technik Wafer Oberflächenreinigung |
| url | http://www.sciencedirect.com/science/book/9780815515548 |
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