Handbook of thin-film deposition processes and techniques: principles, methods, equipment and applications
Gespeichert in:
Format: | Elektronisch E-Book |
---|---|
Sprache: | English |
Veröffentlicht: |
Norwich, N.Y.
Noyes Publications/William Andrew Pub.
c2002
|
Ausgabe: | 2nd ed |
Schriftenreihe: | Materials science and process technology series
|
Schlagworte: | |
Online-Zugang: | Volltext |
Beschreibung: | The 2nd edition contains new chapters on contamination and contamination control that describe the basics and the issues. Another new chapter on meteorology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together physical vapor deposition techniques. Two entirely new areas are focused on: chemical mechanical polishing, which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials Includes bibliographical references and index |
Beschreibung: | 1 Online-Ressource (xxviii, 629 p.) |
ISBN: | 1591241936 9781591241935 9780815517788 0815517785 9780815514428 0815514425 9780815517764 0815517769 |
Internformat
MARC
LEADER | 00000nmm a2200000zc 4500 | ||
---|---|---|---|
001 | BV042304205 | ||
003 | DE-604 | ||
005 | 00000000000000.0 | ||
007 | cr|uuu---uuuuu | ||
008 | 150129s2002 |||| o||u| ||||||eng d | ||
020 | |a 1591241936 |c electronic bk. |9 1-59124-193-6 | ||
020 | |a 9781591241935 |c electronic bk. |9 978-1-59124-193-5 | ||
020 | |a 9780815517788 |c electronic bk. |9 978-0-8155-1778-8 | ||
020 | |a 0815517785 |c electronic bk. |9 0-8155-1778-5 | ||
020 | |a 9780815514428 |9 978-0-8155-1442-8 | ||
020 | |a 0815514425 |9 0-8155-1442-5 | ||
020 | |a 9780815517764 |c electronic bk. |9 978-0-8155-1776-4 | ||
020 | |a 0815517769 |c electronic bk. |9 0-8155-1776-9 | ||
035 | |a (OCoLC)49708503 | ||
035 | |a (DE-599)BVBBV042304205 | ||
040 | |a DE-604 |b ger |e aacr | ||
041 | 0 | |a eng | |
049 | |a DE-1046 | ||
082 | 0 | |a 621.3815/2 |2 22 | |
245 | 1 | 0 | |a Handbook of thin-film deposition processes and techniques |b principles, methods, equipment and applications |c edited by Krishna Seshan |
250 | |a 2nd ed | ||
264 | 1 | |a Norwich, N.Y. |b Noyes Publications/William Andrew Pub. |c c2002 | |
300 | |a 1 Online-Ressource (xxviii, 629 p.) | ||
336 | |b txt |2 rdacontent | ||
337 | |b c |2 rdamedia | ||
338 | |b cr |2 rdacarrier | ||
490 | 0 | |a Materials science and process technology series | |
500 | |a The 2nd edition contains new chapters on contamination and contamination control that describe the basics and the issues. Another new chapter on meteorology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together physical vapor deposition techniques. Two entirely new areas are focused on: chemical mechanical polishing, which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials | ||
500 | |a Includes bibliographical references and index | ||
650 | 7 | |a Handbooks, manuals, etc |2 fast | |
650 | 7 | |a Filmes finos (equipamentos) |2 larpcal | |
650 | 7 | |a TECHNOLOGY & ENGINEERING / Electronics / Solid State |2 bisacsh | |
650 | 7 | |a TECHNOLOGY & ENGINEERING / Electronics / Semiconductors |2 bisacsh | |
650 | 7 | |a Chemical vapor deposition |2 fast | |
650 | 7 | |a Thin film devices / Design and construction |2 fast | |
650 | 7 | |a Thin films |2 fast | |
650 | 4 | |a Thin film devices |x Design and construction |v Handbooks, manuals, etc | |
650 | 4 | |a Thin films |v Handbooks, manuals, etc | |
650 | 4 | |a Chemical vapor deposition |v Handbooks, manuals, etc | |
650 | 0 | 7 | |a Halbleitertechnologie |0 (DE-588)4158814-9 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Dünnschichttechnik |0 (DE-588)4136339-5 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Integrierte Schaltung |0 (DE-588)4027242-4 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Fertigung |0 (DE-588)4016899-2 |2 gnd |9 rswk-swf |
689 | 0 | 0 | |a Integrierte Schaltung |0 (DE-588)4027242-4 |D s |
689 | 0 | 1 | |a Fertigung |0 (DE-588)4016899-2 |D s |
689 | 0 | 2 | |a Dünnschichttechnik |0 (DE-588)4136339-5 |D s |
689 | 0 | |8 1\p |5 DE-604 | |
689 | 1 | 0 | |a Dünnschichttechnik |0 (DE-588)4136339-5 |D s |
689 | 1 | 1 | |a Halbleitertechnologie |0 (DE-588)4158814-9 |D s |
689 | 1 | |8 2\p |5 DE-604 | |
700 | 1 | |a Seshan, Krishna |e Sonstige |4 oth | |
856 | 4 | 0 | |u http://www.sciencedirect.com/science/book/9780815514428 |x Verlag |3 Volltext |
912 | |a ZDB-33-ESD |a ZDB-33-EBS | ||
940 | 1 | |q FAW_PDA_ESD | |
940 | 1 | |q FLA_PDA_ESD | |
999 | |a oai:aleph.bib-bvb.de:BVB01-027741197 | ||
883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
883 | 1 | |8 2\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk |
Datensatz im Suchindex
_version_ | 1804152885896806400 |
---|---|
any_adam_object | |
building | Verbundindex |
bvnumber | BV042304205 |
collection | ZDB-33-ESD ZDB-33-EBS |
ctrlnum | (OCoLC)49708503 (DE-599)BVBBV042304205 |
dewey-full | 621.3815/2 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.3815/2 |
dewey-search | 621.3815/2 |
dewey-sort | 3621.3815 12 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
edition | 2nd ed |
format | Electronic eBook |
fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03710nmm a2200721zc 4500</leader><controlfield tag="001">BV042304205</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">150129s2002 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">1591241936</subfield><subfield code="c">electronic bk.</subfield><subfield code="9">1-59124-193-6</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781591241935</subfield><subfield code="c">electronic bk.</subfield><subfield code="9">978-1-59124-193-5</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780815517788</subfield><subfield code="c">electronic bk.</subfield><subfield code="9">978-0-8155-1778-8</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0815517785</subfield><subfield code="c">electronic bk.</subfield><subfield code="9">0-8155-1778-5</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780815514428</subfield><subfield code="9">978-0-8155-1442-8</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0815514425</subfield><subfield code="9">0-8155-1442-5</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780815517764</subfield><subfield code="c">electronic bk.</subfield><subfield code="9">978-0-8155-1776-4</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0815517769</subfield><subfield code="c">electronic bk.</subfield><subfield code="9">0-8155-1776-9</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)49708503</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV042304205</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-1046</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.3815/2</subfield><subfield code="2">22</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Handbook of thin-film deposition processes and techniques</subfield><subfield code="b">principles, methods, equipment and applications</subfield><subfield code="c">edited by Krishna Seshan</subfield></datafield><datafield tag="250" ind1=" " ind2=" "><subfield code="a">2nd ed</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Norwich, N.Y.</subfield><subfield code="b">Noyes Publications/William Andrew Pub.</subfield><subfield code="c">c2002</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (xxviii, 629 p.)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Materials science and process technology series</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">The 2nd edition contains new chapters on contamination and contamination control that describe the basics and the issues. Another new chapter on meteorology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together physical vapor deposition techniques. Two entirely new areas are focused on: chemical mechanical polishing, which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and index</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Handbooks, manuals, etc</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Filmes finos (equipamentos)</subfield><subfield code="2">larpcal</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Electronics / Solid State</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Electronics / Semiconductors</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Chemical vapor deposition</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Thin film devices / Design and construction</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Thin films</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thin film devices</subfield><subfield code="x">Design and construction</subfield><subfield code="v">Handbooks, manuals, etc</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thin films</subfield><subfield code="v">Handbooks, manuals, etc</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Chemical vapor deposition</subfield><subfield code="v">Handbooks, manuals, etc</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Halbleitertechnologie</subfield><subfield code="0">(DE-588)4158814-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Dünnschichttechnik</subfield><subfield code="0">(DE-588)4136339-5</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Integrierte Schaltung</subfield><subfield code="0">(DE-588)4027242-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Fertigung</subfield><subfield code="0">(DE-588)4016899-2</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Integrierte Schaltung</subfield><subfield code="0">(DE-588)4027242-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Fertigung</subfield><subfield code="0">(DE-588)4016899-2</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Dünnschichttechnik</subfield><subfield code="0">(DE-588)4136339-5</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="8">1\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="1" ind2="0"><subfield code="a">Dünnschichttechnik</subfield><subfield code="0">(DE-588)4136339-5</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2="1"><subfield code="a">Halbleitertechnologie</subfield><subfield code="0">(DE-588)4158814-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2=" "><subfield code="8">2\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Seshan, Krishna</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">http://www.sciencedirect.com/science/book/9780815514428</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-33-ESD</subfield><subfield code="a">ZDB-33-EBS</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">FAW_PDA_ESD</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">FLA_PDA_ESD</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-027741197</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">2\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield></record></collection> |
id | DE-604.BV042304205 |
illustrated | Not Illustrated |
indexdate | 2024-07-10T01:17:50Z |
institution | BVB |
isbn | 1591241936 9781591241935 9780815517788 0815517785 9780815514428 0815514425 9780815517764 0815517769 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-027741197 |
oclc_num | 49708503 |
open_access_boolean | |
owner | DE-1046 |
owner_facet | DE-1046 |
physical | 1 Online-Ressource (xxviii, 629 p.) |
psigel | ZDB-33-ESD ZDB-33-EBS FAW_PDA_ESD FLA_PDA_ESD |
publishDate | 2002 |
publishDateSearch | 2002 |
publishDateSort | 2002 |
publisher | Noyes Publications/William Andrew Pub. |
record_format | marc |
series2 | Materials science and process technology series |
spelling | Handbook of thin-film deposition processes and techniques principles, methods, equipment and applications edited by Krishna Seshan 2nd ed Norwich, N.Y. Noyes Publications/William Andrew Pub. c2002 1 Online-Ressource (xxviii, 629 p.) txt rdacontent c rdamedia cr rdacarrier Materials science and process technology series The 2nd edition contains new chapters on contamination and contamination control that describe the basics and the issues. Another new chapter on meteorology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together physical vapor deposition techniques. Two entirely new areas are focused on: chemical mechanical polishing, which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials Includes bibliographical references and index Handbooks, manuals, etc fast Filmes finos (equipamentos) larpcal TECHNOLOGY & ENGINEERING / Electronics / Solid State bisacsh TECHNOLOGY & ENGINEERING / Electronics / Semiconductors bisacsh Chemical vapor deposition fast Thin film devices / Design and construction fast Thin films fast Thin film devices Design and construction Handbooks, manuals, etc Thin films Handbooks, manuals, etc Chemical vapor deposition Handbooks, manuals, etc Halbleitertechnologie (DE-588)4158814-9 gnd rswk-swf Dünnschichttechnik (DE-588)4136339-5 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 gnd rswk-swf Fertigung (DE-588)4016899-2 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 s Fertigung (DE-588)4016899-2 s Dünnschichttechnik (DE-588)4136339-5 s 1\p DE-604 Halbleitertechnologie (DE-588)4158814-9 s 2\p DE-604 Seshan, Krishna Sonstige oth http://www.sciencedirect.com/science/book/9780815514428 Verlag Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk 2\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
spellingShingle | Handbook of thin-film deposition processes and techniques principles, methods, equipment and applications Handbooks, manuals, etc fast Filmes finos (equipamentos) larpcal TECHNOLOGY & ENGINEERING / Electronics / Solid State bisacsh TECHNOLOGY & ENGINEERING / Electronics / Semiconductors bisacsh Chemical vapor deposition fast Thin film devices / Design and construction fast Thin films fast Thin film devices Design and construction Handbooks, manuals, etc Thin films Handbooks, manuals, etc Chemical vapor deposition Handbooks, manuals, etc Halbleitertechnologie (DE-588)4158814-9 gnd Dünnschichttechnik (DE-588)4136339-5 gnd Integrierte Schaltung (DE-588)4027242-4 gnd Fertigung (DE-588)4016899-2 gnd |
subject_GND | (DE-588)4158814-9 (DE-588)4136339-5 (DE-588)4027242-4 (DE-588)4016899-2 |
title | Handbook of thin-film deposition processes and techniques principles, methods, equipment and applications |
title_auth | Handbook of thin-film deposition processes and techniques principles, methods, equipment and applications |
title_exact_search | Handbook of thin-film deposition processes and techniques principles, methods, equipment and applications |
title_full | Handbook of thin-film deposition processes and techniques principles, methods, equipment and applications edited by Krishna Seshan |
title_fullStr | Handbook of thin-film deposition processes and techniques principles, methods, equipment and applications edited by Krishna Seshan |
title_full_unstemmed | Handbook of thin-film deposition processes and techniques principles, methods, equipment and applications edited by Krishna Seshan |
title_short | Handbook of thin-film deposition processes and techniques |
title_sort | handbook of thin film deposition processes and techniques principles methods equipment and applications |
title_sub | principles, methods, equipment and applications |
topic | Handbooks, manuals, etc fast Filmes finos (equipamentos) larpcal TECHNOLOGY & ENGINEERING / Electronics / Solid State bisacsh TECHNOLOGY & ENGINEERING / Electronics / Semiconductors bisacsh Chemical vapor deposition fast Thin film devices / Design and construction fast Thin films fast Thin film devices Design and construction Handbooks, manuals, etc Thin films Handbooks, manuals, etc Chemical vapor deposition Handbooks, manuals, etc Halbleitertechnologie (DE-588)4158814-9 gnd Dünnschichttechnik (DE-588)4136339-5 gnd Integrierte Schaltung (DE-588)4027242-4 gnd Fertigung (DE-588)4016899-2 gnd |
topic_facet | Handbooks, manuals, etc Filmes finos (equipamentos) TECHNOLOGY & ENGINEERING / Electronics / Solid State TECHNOLOGY & ENGINEERING / Electronics / Semiconductors Chemical vapor deposition Thin film devices / Design and construction Thin films Thin film devices Design and construction Handbooks, manuals, etc Thin films Handbooks, manuals, etc Chemical vapor deposition Handbooks, manuals, etc Halbleitertechnologie Dünnschichttechnik Integrierte Schaltung Fertigung |
url | http://www.sciencedirect.com/science/book/9780815514428 |
work_keys_str_mv | AT seshankrishna handbookofthinfilmdepositionprocessesandtechniquesprinciplesmethodsequipmentandapplications |