Micro and nano fabrication: tools and processes
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Berlin [und 4 weitere]
Springer
[2015]
|
| Schlagworte: | |
| Online-Zugang: | Inhaltstext Inhaltsverzeichnis |
| Beschreibung: | xxvi, 519 Seiten Illustrationen |
| ISBN: | 9783662443941 9783662508268 |
Internformat
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| 100 | 1 | |a Gatzen, Hans Heinrich |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Micro and nano fabrication |b tools and processes |c Hans H. Gatzen, Volker Saile, Jürg Leuthold |
| 264 | 1 | |a Berlin [und 4 weitere] |b Springer |c [2015] | |
| 300 | |a xxvi, 519 Seiten |b Illustrationen | ||
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Datensatz im Suchindex
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| adam_text |
CONTENTS
1 INTRODUCTION*MEMS, A HISTORICAL PERSPECTIVE 1
REFERENCES 4
2 VACUUM TECHNOLOGY 7
2.1 INTRODUCTION INTO VACUUM TECHNOLOGY 7
2.1.1 IMPORTANCE OF VACUUM TECHNOLOGY FOR PROCESSING
AND CHARACTERIZATION 7
2.1.2 HISTORICAL OVERVIEW 8
2.1.3 VACUUM TECHNOLOGY BASICS 11
2.2 GAS PROPERTIES 14
2.2.1 KINETIC GAS BEHAVIOR 14
2.2.2 IDEAL AND REAL GAS 21
2.3 GAS FLOW 22
2.3.1 FLOW REGIMES 22
2.3.2 VISCOUS FLOW 23
2.3.3 MOLECULAR FLOW AND TRANSITION REGIME 23
2.4 VACUUM SYSTEMS*OVERVIEW 24
2.4.1 VACUUM CHAMBER 24
2.4.2 PUMPS 25
2.5 ROUGHING PUMPS 27
2.5.1 ROTARY VANE PUMP 27
2.5.2 ROTARY PISTON PUMP 28
2.5.3 ROOTS PUMP 29
2.5.4 DIAPHRAGM PUMP 30
2.6 HIGH VACUUM PUMPS 1*KINETIC TRANSFER PUMPS 31
2.6.1 DIFFUSION PUMP 32
2.6.2 TURBOMOLECULAR PUMP 33
2.6.3 TURBOMOLECULAR DRAG PUMP 35
2.7 HIGH VACUUM PUMPS 11*ENTRAPMENT PUMPS 36
2.7.1 CRYOGENIC PUMPS I*CRYOPUMP 36
2.7.2 CRYOGENIC PUMPS II*MEISSNER TRAP 39
XI
HTTP://D-NB.INFO/1053676468
XII CONTENTS
2.7.3 GETTER AND SPUTTER ION PUMPS 40
2.8 VACUUM SEALS 42
2.8.1 ELASTOMER SEALS 42
2.8.2 METAL SEALS 43
2.9 VACUUM MEASUREMENT AND ANALYSIS 43
2.9.1 INTRODUCTION INTO PRESSURE MEASUREMENT 43
2.9.2 DIRECT-READING PRESSURE GAUGES 44
2.9.3 INDIRECT-READING GAUGES*THERMAL CONDUCTIVITY
GAUGES 46
2.9.4 INDIRECT-READING GAUGES*IONIZATION GAUGES 48
2.9.5 FLOW METER AND MASS FLOW CONTROLLER 49
2.9.6 RESIDUAL GAS ANALYSIS (RGA) 50
2.10 DESORPTION AND LEAKS 53
2.10.1 GAS RELEASE FROM SOLIDS 53
2.10.2 LEAKS AND LEAK DETECTION 56
2.11 VACUUM PUMP APPLICATIONS 57
2.11.1 SELECTION 57
2.11.2 EXAMPLES OF VACUUM SYSTEMS USED IN RESEARCH . 58
REFERENCES 62
3 DEPOSITION TECHNOLOGIES 65
3.1 INTRODUCTION AND HISTORIC BACKGROUND 65
3.1.1 THE ORIGINS OF THIN-FILM TECHNOLOGY 65
3.1.2 INTRODUCTION INTO DEPOSITION 66
3.2 THERMAL PHYSICAL VAPOR DEPOSITION (THERMAL PVD) 67
3.2.1 INTRODUCTION INTO THERMAL PVD
AND HISTORIC OVERVIEW 67
3.2.2 EVAPORATION PROCESS THEORY 68
3.2.3 EVAPORATION HARDWARE AND PROCESS 81
3.2.4 MOLECULAR BEAM EPITAXY (MBE) 88
3.2.5 PULSED LASER DEPOSITION (PLD) 93
3.3 PLASMA AND ARC PHYSICAL VAPOR DEPOSITION
(PLASMA/ARC PVD) 94
3.3.1 INTRODUCTION AND HISTORY 94
3.3.2 PLASMA PHYSICS 96
3.3.3 PHYSICS OF SPUTTERING 106
3.3.4 SPUTTERING HARDWARE AND PROCESS 116
3.3.5 ION BEAM DEPOSITION (IBD) 120
3.3.6 CATHODIC ARC PLASMA AND FILTERED CATHODIC
ARC DEPOSITION 122
3.4 HYBRID PVD PROCESSES 124
3.4.1 INTRODUCTION 124
3.4.2 ION BEAM ASSISTED EVAPORATION 124
CONTENTS XIII
3.5 CHEMICAL VAPOR DEPOSITION (CVD)-LIKE PROCESSES 125
3.5.1 INTRODUCTION INTO CVD-LIKE PROCESSES
AND HISTORIC OVERVIEW 125
3.5.2 REACTION TYPES 127
3.5.3 THERMODYNAMICS OF CVD 130
3.5.4 GAS TRANSPORT 136
3.5.5 FILM GROWTH KINETICS 140
3.5.6 THERMAL CVD*REACTORS AND PROCESSES 147
3.5.7 PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION
(PECVD)*REACTORS AND PROCESSES 150
3.5.8 LASER-INDUCED CHEMICAL VAPOR
DEPOSITION (LCVD) 154
3.5.9 CVD GAS SAFETY AND ANALYSIS 155
3.5.10 ATOMIC LAYER DEPOSITION (ALD) 156
3.6 PHYSICAL-CHEMICAL HYBRID PROCESSES 164
3.6.1 ACTIVATED REACTIVE EVAPORATION (ARE) 164
3.6.2 REACTIVE SPUTTERING 165
3.7 LIQUID-PHASE DEPOSITION BY SPIN-COATING, SPRAY-COATING,
AND DIP-COATING 169
3.7.1 INTRODUCTION 169
3.7.2 SPIN-COATING 170
3.7.3 SPRAY-COATING 173
3.7.4 DIP-COATING 173
3.8 SOLGEL TECHNOLOGY 174
3.8.1 SOLGEL PROCESS BASICS 174
3.8.2 SOLGEL PROCESS EXAMPLE 175
3.9 ELECTROCHEMICAL AND CHEMICAL REACTION DEPOSITION 176
3.9.1 ELECTROCHEMICAL DEPOSITION 176
3.9.2 CHEMICAL DEPOSITION: ELECTROLESS PLATING 189
3.9.3 ELECTROPHORETIC DEPOSITION (EPD) 190
REFERENCES 196
4 ETCHING TECHNOLOGIES 205
4.1 ETCHING TECHNOLOGIES BASICS 205
4.1.1 INTRODUCTION INTO ETCHING 205
4.1.2 HISTORY OF ETCHING 207
4.2 WET-CHEMICAL ETCHING 208
4.2.1 WET-CHEMICAL ETCHING PROCESSES 208
4.2.2 WET-CHEMICAL ETCHING OF SINGLE CRYSTAL SILICON 211
4.2.3 ETCHING OF INSULATORS AND DIELECTRICS 231
4.2.4 ETCHING OF CONDUCTORS 232
4.3 DRY ETCHING 234
4.3.1 INTRODUCTION 234
4.3.2 PHYSICAL ETCHING 235
XIV CONTENTS
4.3.3 CHEMICAL DRY ETCH 249
4.3.4 PHYSICAL-CHEMICAL PROCESSES 255
4.4 MECHANICAL AND MECHANICAL-CHEMICAL ETCHING 264
4.4.1 INTRODUCTION 264
4.4.2 POWDER BLASTING 264
4.4.3 GAS CLUSTER ION BEAM (GC1B) TECHNOLOGY 265
REFERENCES 268
5 DOPING AND SURFACE MODIFICATION 273
5.1 INTRODUCTION 273
5.1.1 THE IMPORTANCE OF DOPING AND SURFACE
MODIFICATION 273
5.1.2 HISTORY OF DOPING AND SURFACE MODIFICATION 273
5.2 INTRODUCTION INTO DOPING 275
5.2.1 ELECTRICAL CONDUCTIVITY IN SOLIDS 275
5.2.2 SEMICONDUCTOR PROPERTIES AND DOPING OF SILICON 276
5.3 DOPING BY DIFFUSION 278
5.3.1 INTRODUCTION 278
5.3.2 DOPANT DIFFUSION 278
5.3.3 THEORETICAL DESCRIPTION OF DIFFUSION 279
5.3.4 ATOMISTIC MODEL OF DIFFUSION 282
5.3.5 DIFFUSION FURNACE AND PROCESS 284
5.4 DOPING BY IMPLANTATION 288
5.4.1 INTRODUCTION INTO IMPLANTATION 288
5.4.2 IMPLANTATION SCIENCE 289
5.4.3 ION IMPLANTER 295
5.4.4 RAPID THERMAL PROCESSING (RTP) 299
5.5 DOPING APPLICATIONS 300
5.5.1 MEMS APPLICATIONS 300
5.5.2 WAFER TECHNOLOGY APPLICATIONS 301
5.6 THERMAL OXIDATION OF SILICON 302
5.6.1 INTRODUCTION 302
5.6.2 GENERAL PROPERTIES OF SI02 303
5.6.3 OXIDATION MECHANISMS 303
5.6.4 OXIDATION EQUIPMENT AND PROCESS 307
5.6.5 APPLICATIONS OF THERMAL SI0
2
309
REFERENCES 310
6 LITHOGRAPHY 313
6.1 OVERVIEW AND HISTORIC DEVELOPMENT 313
6.1.1 INTRODUCTION 313
6.1.2 HISTORIC DEVELOPMENT 315
6.2 MASK-BASED LITHOGRAPHY I*OPTICAL LITHOGRAPHY 317
6.2.1 INTRODUCTION 317
CONTENTS XV
6.2.2 OPTICAL LITHOGRAPHY PROCESS SEQUENCE 318
6.2.3 OPTICAL BASICS OF LITHOGRAPHY I*EXPOSURE
ALTERNATIVES 326
6.2.4 OPTICAL BASICS OF LITHOGRAPHY II*PHYSICAL
LIMITATIONS OF OPTICS 329
6.2.5 SELECTED PHOTOLITHOGRAPHY TOOLS AND PROCESSES 346
6.2.6 ADVANCED SEMICONDUCTOR LITHOGRAPHY PROCESSES . 355
6.3 MASK-BASED LITHOGRAPHY II: X-RAY LITHOGRAPHY
(XRL) SYSTEMS 364
6.3.1 INTRODUCTION 364
6.3.2 XRL PRINCIPLE 364
6.3.3 XRL MASK FABRICATION 366
6.4 DIRECT WRITE LITHOGRAPHY 367
6.4.1 LASER LITHOGRAPHY 367
6.4.2 E-BEAM LITHOGRAPHY 371
6.5 SCANNING PROBE-BASED LITHOGRAPHY 374
6.5.1 INTRODUCTION 374
6.5.2 AFM-BASED NANOSCRATCH LITHOGRAPHY 374
6.5.3 DIP-PEN NANOLITHOGRAPHY (DPN) 375
6.6 NANOFABRICATION BY REPLICATION AND PATTERN TRANSFER 376
6.6.1 NANOIMPRINT LITHOGRAPHY (NIL) 376
6.6.2 SOFT LITHOGRAPHY 377
6.7 PHOTORESIST AND INK 380
6.7.1 AGGREGATE STATE ALTERNATIVES 380
6.7.2 UV RESISTS, SOLUBLE WHEN CURED 381
6.7.3 UV RESISTS, NON-SOLUBLE WHEN CURED: SU-8 383
6.7.4 TWO-PHOTON ABSORPTION RESISTS 384
6.7.5 X-RAY, E-BEAM, AND EUV RESISTS 385
6.7.6 NANOIMPRINT RESISTS 387
6.7.7 INKS 388
REFERENCES 389
7 LIGA 397
7.1 INTRODUCTION 397
7.2 LIGA INFRASTRUCTURE 398
7.2.1 CHALLENGE 398
7.2.2 SYNCHROTRON RADIATION SOURCE 398
7.2.3 ELECTROCHEMICAL DEPOSITION CAPABILITIES 400
7.2.4 REPLICATION CAPABILITIES 401
7.3 LIGA FABRICATION 401
7.3.1 MASK FABRICATION 401
7.3.2 X-RAY LITHOGRAPHY PROCESS 403
7.3.3 MOLD INSERT FABRICATION BY ELECTRODEPOSITION 404
XVI CONTENTS
7.3.4 REPLICATION 405
7.4 DIRECT LIGA 405
7.5 LIGA AND DIRECT LIGA PRODUCTION SAMPLES 405
7.5.1 LIGA PRODUCTION SAMPLE: MICROSPECTROMETER 405
7.5.2 DIRECT LIGA PRODUCT SAMPLES: ESCAPEMENT PARTS . 406
7.6 LIGA AND HARMST 407
REFERENCES 408
8 NANOFABRICATION BY SELF-ASSEMBLY 409
8.1 INTRODUCTION AND HISTORIC BACKGROUND 409
8.1.1 TOP-DOWN AND BOTTOM-UP NANOFABRICATION 409
8.1.2 HISTORIC BACKGROUND 410
8.2 SELF-ASSEMBLY PROCESS 411
8.2.1 INTRODUCTION INTO SELF-ASSEMBLY 411
8.2.2 CHEMICAL, PHYSICAL, AND COLLOIDAL SELF-ASSEMBLY . 411
8.2.3 STATIC AND DYNAMIC SELF-ASSEMBLY 412
8.2.4 CO-ASSEMBLY 413
8.2.5 HIERARCHICAL SELF-ASSEMBLY 413
8.2.6 DIRECTED (OR GUIDED) SELF-ASSEMBLY*BASICS 414
8.2.7 THE ROLE OF DEFECTS IN SELF-ASSEMBLY 414
8.3 SELF-ASSEMBLED MONOLAYERS (SAMS) 415
8.4 DIRECTED SELF-ASSEMBLY*MECHANISMS 416
8.4.1 SURFACE TOPOGRAPHY 416
8.4.2 SURFACE WETTING 417
8.5 NANOSYSTEM BUILDING BLOCKS*EXAMPLES 418
8.5.1 DNA SCAFFOLDS 418
8.5.2 CARBON NANOTUBES (CNTS) 419
8.5.3 BLOCK COPOLYMERS 420
8.5.4 POROUS ALUMINA 421
REFERENCES 422
9 ENABLING TECHNOLOGIES I*WAFER PLANARIZATION AND BONDING . 425
9.1 INTRODUCTION 425
9.2 WAFER PLANARIZATION 426
9.2.1 PLANARIZATION CHALLENGE 426
9.2.2 HISTORY OF CMP IN THE SEMICONDUCTOR INDUSTRY 427
9.2.3 CMP EQUIPMENT AND CONSUMABLES 429
9.2.4 CMP PROCESS AND ISSUES 436
9.2.5 CMP APPLICATIONS 437
9.3 WAFER BONDING 438
9.3.1 INTRODUCTION 438
9.3.2 ANODIC BONDING 438
9.3.3 SILICON FUSION BONDING 443
CONTENTS XVII
9.3.4 BOND ALIGNMENT 447
9.3.5 DIRECT WAFER BONDING APPLICATIONS 449
REFERENCES 452
10 ENABLING TECHNOLOGIES II*CONTAMINATION CONTROL 455
10.1 INTRODUCTION 455
10.1.1 THE NECESSITY FOR CLEANLINESS 455
10.1.2 CONTAMINATION REMOVAL BY CLEANING 456
10.1.3 MINIMIZATION OF CONTAMINATION BY FABRICATION
IN A CLEAN ENVIRONMENT 457
10.2 CLEANING TECHNOLOGY 457
10.2.1 CLEANING*AN OVERVIEW 457
10.2.2 AQUEOUS CLEANING 458
10.2.3 SOLVENT CLEANING 465
10.2.4 MECHANICAL CLEANING 467
10.2.5 RINSING AND DRYING 468
10.2.6 DRY CLEANING TECHNOLOGY 471
10.3 CLEANROOM TECHNOLOGY 472
10.3.1 INTRODUCTION AND HISTORY 472
10.3.2 CLEANROOM CLASSIFICATION STANDARDS 474
10.3.3 LAMINAR AIRFLOW 476
10.3.4 HIGH EFFICIENCY AIR FILTRATION 477
10.3.5 CLEANROOM 479
10.3.6 LOCAL CLEAN AREA SOLUTIONS 484
10.3.7 CLEANROOM STAFF 487
REFERENCES 491
11 DEVICE FABRICATION*AN EXAMPLE 495
11.1 INTRODUCTION 495
11.2 DEVICE DESCRIPTION 496
11.2.1 MAGNETIC LEVITATION PRINCIPLE 496
11.2.2 MAGNETIC LEVITATION MICROSYSTEM
INTEGRATION CONCEPT 496
11.2.3 STATOR 497
11.2.4 TRAVELER WITH PERMANENT MAGNET 499
11.3 PHOTORESISTS 499
11.4 MASK STEPS 499
11.4.1 INTRODUCTION 499
11.4.2 STATOR MASKS AND THEIR USES 500
11.4.3 STATOR WAFER LEVEL MASK OVERLAY 502
XVIII CONTENTS
11.4.4 TRAVELER MASK 502
11.5 PROCESS STEPS 503
11.5.1 COIL SYSTEM FABRICATION 503
11.5.2 TRAVELER SYSTEM FABRICATION 508
11.5.3 DICING, COMPONENT EVALUATION,
AND SYSTEM INTEGRATION 510
REFERENCES 512
INDEX 513 |
| any_adam_object | 1 |
| author | Gatzen, Hans Heinrich Saile, Volker Leuthold, Juerg 1966- |
| author_GND | (DE-588)109547268 (DE-588)121432238 |
| author_facet | Gatzen, Hans Heinrich Saile, Volker Leuthold, Juerg 1966- |
| author_role | aut aut aut |
| author_sort | Gatzen, Hans Heinrich |
| author_variant | h h g hh hhg v s vs j l jl |
| building | Verbundindex |
| bvnumber | BV042291747 |
| classification_rvk | ZN 3700 |
| ctrlnum | (OCoLC)884576438 (DE-599)DNB1053676468 |
| dewey-full | 621.3815 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3815 |
| dewey-search | 621.3815 |
| dewey-sort | 3621.3815 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Maschinenbau / Maschinenwesen Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV042291747 |
| illustrated | Illustrated |
| indexdate | 2024-08-03T02:06:10Z |
| institution | BVB |
| isbn | 9783662443941 9783662508268 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-027728900 |
| oclc_num | 884576438 |
| open_access_boolean | |
| owner | DE-29T DE-703 DE-83 |
| owner_facet | DE-29T DE-703 DE-83 |
| physical | xxvi, 519 Seiten Illustrationen |
| publishDate | 2015 |
| publishDateSearch | 2015 |
| publishDateSort | 2015 |
| publisher | Springer |
| record_format | marc |
| spelling | Gatzen, Hans Heinrich Verfasser aut Micro and nano fabrication tools and processes Hans H. Gatzen, Volker Saile, Jürg Leuthold Berlin [und 4 weitere] Springer [2015] xxvi, 519 Seiten Illustrationen txt rdacontent n rdamedia nc rdacarrier Mikrosystemtechnik (DE-588)4221617-5 gnd rswk-swf Nanotechnologie (DE-588)4327470-5 gnd rswk-swf Mikrofertigung (DE-588)7523640-0 gnd rswk-swf Nanoelektromechanik (DE-588)7546434-2 gnd rswk-swf MEMS (DE-588)4824724-8 gnd rswk-swf Dünnschichttechnik (DE-588)4136339-5 gnd rswk-swf MEMS (DE-588)4824724-8 s Nanoelektromechanik (DE-588)7546434-2 s Mikrosystemtechnik (DE-588)4221617-5 s Dünnschichttechnik (DE-588)4136339-5 s Mikrofertigung (DE-588)7523640-0 s Nanotechnologie (DE-588)4327470-5 s DE-604 Saile, Volker Verfasser (DE-588)109547268 aut Leuthold, Juerg 1966- Verfasser (DE-588)121432238 aut Erscheint auch als Online-Ausgabe 978-3-662-44395-8 text/html http://deposit.dnb.de/cgi-bin/dokserv?id=4708263&prov=M&dok_var=1&dok_ext=htm Inhaltstext DNB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=027728900&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Gatzen, Hans Heinrich Saile, Volker Leuthold, Juerg 1966- Micro and nano fabrication tools and processes Mikrosystemtechnik (DE-588)4221617-5 gnd Nanotechnologie (DE-588)4327470-5 gnd Mikrofertigung (DE-588)7523640-0 gnd Nanoelektromechanik (DE-588)7546434-2 gnd MEMS (DE-588)4824724-8 gnd Dünnschichttechnik (DE-588)4136339-5 gnd |
| subject_GND | (DE-588)4221617-5 (DE-588)4327470-5 (DE-588)7523640-0 (DE-588)7546434-2 (DE-588)4824724-8 (DE-588)4136339-5 |
| title | Micro and nano fabrication tools and processes |
| title_auth | Micro and nano fabrication tools and processes |
| title_exact_search | Micro and nano fabrication tools and processes |
| title_full | Micro and nano fabrication tools and processes Hans H. Gatzen, Volker Saile, Jürg Leuthold |
| title_fullStr | Micro and nano fabrication tools and processes Hans H. Gatzen, Volker Saile, Jürg Leuthold |
| title_full_unstemmed | Micro and nano fabrication tools and processes Hans H. Gatzen, Volker Saile, Jürg Leuthold |
| title_short | Micro and nano fabrication |
| title_sort | micro and nano fabrication tools and processes |
| title_sub | tools and processes |
| topic | Mikrosystemtechnik (DE-588)4221617-5 gnd Nanotechnologie (DE-588)4327470-5 gnd Mikrofertigung (DE-588)7523640-0 gnd Nanoelektromechanik (DE-588)7546434-2 gnd MEMS (DE-588)4824724-8 gnd Dünnschichttechnik (DE-588)4136339-5 gnd |
| topic_facet | Mikrosystemtechnik Nanotechnologie Mikrofertigung Nanoelektromechanik MEMS Dünnschichttechnik |
| url | http://deposit.dnb.de/cgi-bin/dokserv?id=4708263&prov=M&dok_var=1&dok_ext=htm http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=027728900&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT gatzenhansheinrich microandnanofabricationtoolsandprocesses AT sailevolker microandnanofabricationtoolsandprocesses AT leutholdjuerg microandnanofabricationtoolsandprocesses |