Smart systems integration for micro- and nanotechnologies: honorary volume on the occasion of Thomas Gessner's 60th birthday
Gespeichert in:
| Weitere Verfasser: | |
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| Format: | Buch |
| Sprache: | German |
| Veröffentlicht: |
Dresden
Goldenbogen
2014
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| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | XVIII, 729 S. zahlr. Ill., graph. Darst. |
| ISBN: | 9783932434785 |
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| 245 | 1 | 0 | |a Smart systems integration for micro- and nanotechnologies |b honorary volume on the occasion of Thomas Gessner's 60th birthday |c Bernd Michel (Ed.) |
| 264 | 1 | |a Dresden |b Goldenbogen |c 2014 | |
| 300 | |a XVIII, 729 S. |b zahlr. Ill., graph. Darst. | ||
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| 700 | 1 | |a Geßner, Thomas |d 1954-2016 |0 (DE-588)142973548 |4 hnr | |
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Datensatz im Suchindex
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| adam_text | TABLE OF CONTENTS
DEVELOPMENT OF FRAUNHOFER ENAS -
FROM MICROELECTRONICS AND MICROSYSTEMS
TO SMART INTEGRATED SYSTEMS FOR DIFFERENT APPLICATIONS 1
MARTINA VOGEL, GOTTFRIED HOPPNER, DANNY REUTER,
THOMAS OTTO, STEFAN SCHULZ, KARLA HILLER
SMART SYSTEMS INTEGRATION AT FRAUNHOFER ENAS -
TRENDS AND EXAMPLES 11
THOMAS OTTO
CHALLENGES OF CURRENT AND FUTURE ADVANCED INTERCONNECT
SYSTEMS FOR INTEGRATED CIRCUITS 23
STEFAN E. SCHULZ, NICOLE AHNER, TOBIAS FISCHER,
HEINRICH KOERNER, THOMAS OSZINDA, KNUT SCHULZE,
SVEN ZIMMERMANN
HETEROGENEOUS INTEGRATION BY ADHESIVE BONDING
AND WAFER LEVEL PACKAGING 37
MASAYOSHI ESASHI, SHUJI TANAKA
CLUSTER OF EXCELLENCE MERGE -
INTEGRATION OF MICRO- AND NANOSYSTEMS IN HYBRID STRUCTURES 45
LOTHAR KROLL, JURGEN TROLTZSCH AND MARTIN SCHULLER
MODELLING AND TESTING OF MECHANICAL STRESSES
BY MEANS OF STRESS CHIPS FOR THE MERGE PROJECT 51
FLORIAN ROST, FLORIAN SCHINDLER-SAEFKOW, DIETMAR VOGEL,
SVEN RZEPKA, BERND MICHEL
INNOVATION ROADMAP DRIVEN STRATEGIC RESEARCH -
AND WIRELESS COMMUNICATIONS SMART SYSTEMS EXAMPLES 57
GERHARD P. FETTWEIS
HTTP://D-NB.INFO/1059786028
SMART SENSOR SYSTEMS FOR MANAGING HEALTH AND WELLNESS 67
CHRIS VAN HOOF, JO DE BOECK, AND BERT GYSELINCKX
LAB ON A CHIP: THE VISION BECOMES REALITY 73
DANIEL MARK, FELIX VON STETTEN AND ROLAND ZENGERLE
MODELLING AND SIMULATION OF MEMS-BASED PZT BEAM ARRAY
FOR VIBRATION ENERGY HARVESTING 83
ZHIYU WEN, LICHENG DENG, XINGQIANG ZHAO
ADVANCES IN MICRO-NANO RELIABILITY RESEARCH
FOR SMART SYSTEMS INTEGRATION
USING CRACK AVOIDANCE STRATEGIES 93
BERND MICHEL, THOMAS WINKLER, HOSSEIN SHIRANGI,
WOLFGANG WONDRAK, REINHARD PUFALL
MICROMANUFACTURING TECHNOLOGIES FOR MICROSYSTEMS -
MICROSTRUCTURED TOOLS AND EMBOSSING TECHNOLOGIES 99
ANDREAS SCHUBERT, JAN EDELMANN, JORG SCHNEIDER,
STEFAN GROB
ROLL-UP MICROTUBES WITH NANOSTRUCTURES 111
ZHAOQIAN LIU, JINXING LI, GAOSHAN HUANG, YONGFENG MEI,
RAN LIU
PROGRESS OF MEMS PROBE CARD FOR IC TESTING 117
TAO YUAN, DI CHEN, JINGDONG CHEN, YAO XIE, BINBIN LIN
MINIATURIZED MICROMECHANICAL ELECTRONIC NOSE
FOR DETECTION OF VOLATILES 125
SYWERT H. BRONGERSMA, MARIANNE VANDECASTEELE,
JULIA PETTINE, ZENG ZENG, VAN-ANH DAM, YVONNE VAN ANDEL,
LING SIEBEN-XU, MERCEDES CREGO CALAMA, DEVREZ KARABACAK,
ROB VAN SCHAIJK
ADVANCED ASSEMBLY AND PACKAGING TECHNOLOGIES
FOR SMART SYSTEMS 133
KLAUS-DIETER LANG, JURGEN WOLF, TANJA BRAUN,
KARL-FRIEDRICH BECKER, ANDREAS OSTMANN, THOMAS LOHER,
OLAF WITTIER, NILS F. NISSEN, MICHAEL TOPPER, HARALD POTTER,
MAIK HAMPICKE
WAFER BONDING PROCESSES IN SURFACE MICROMACHINING
TECHNOLOGIES FOR INERTIAL SENSOR SYSTEMS 141
ROY KNECHTEL, SOPHIA DEMPWOLF, UWE SCHWARZ
DESIGN, CHARACTERIZATION AND TEST
OF A MEMS ACOUSTIC EMISSION SENSOR 147
ALEXANDER SORGER, CHRISTIAN AUERSWALD, ALEXEY SHAPORIN,
MARCO DIENEL, JAN MEHNER
SYSTEM LEVEL RELIABILITY FOR SOLID STATE LIGHTING APPLICATIONS 155
W.D. VAN DRIEL, G.Q. ZHANG, S. KOH, AND X.J. FAN
SMART MICRO-IMPLANTS: BRIDGING THE GAP
BETWEEN THE LAB AND THE HOSPITAL 167
HERE NEVES
ADVANCING TEM PREPARATION
BY CONSIDERING LASER MICROMACHINING 175
TINO PETSCH, THOMAS HOCHE
NEW METHODOLOGY FOR LIFETIME PREDICTION
OF SMART LIGHTWEIGHT STRUCTURES 181
SVEN RZEPKA, REMI PANTOU, FRANZ BORMANN, BIRGIT BRAMER,
BERND MICHEL
ROLLED-UP ELECTRONIC DEVICES 189
DANIEL GRIMM, CARLOS CESAR BOF BUFON, OLIVER G. SCHMIDT
SILVER METALLIC NANOFILMS FROM ACTIVE PHOSPHATE GLASSES
AS HYDROGEN GAS SENSOR
RICARDO SCHNEIDER, PETRUS A. SANTA-CRUZ
199
DEPOSITION OF COPPER THIN FILMS FOR ULSI INTERCONNECTS
BY ALD OF COPPER OXIDE AND SUBSEQUENT REDUCTION 207
THOMAS WAECHTLER, ROBERT MOTHES, LUTZ HOFMANN,
STEFFEN SCHULZE, STEFFEN OSWALD, STEFAN E. SCHULZ,
HEINRICH LANG, MICHAEL HIETSCHOLD, THOMAS GESSNER
MICRO STRUCTURING AND MAGNETIZING
OF SPINTRONIC LAYER STACKS USING LASER IRRADIATION 217
HORST EXNER, ISABEL BERTHOLD, MATHIAS MUELLER,
SASCHA
KLDTZER, ROBBY EBERT
ADAPTIVE ANTENNA TUNERS FOR MOBILE PHONES 225
E. SPITS, K. BOYLE, M.A. DE JONGH, T. BAKKER, S. SATO,
A. VAN BEZOOIJEN
A GSM/EDGE/WCDMA ADAPTIVE SERIES-LC
MATCHING NETWORK USING RF-MEMS SWITCHES 233
ANDRE VAN BEZOOIJEN, MAURICE A. DE JONGH,
CHRISTOPHE CHANLO, LENNART C. H. RUIJS, FREEK VAN STRATEN,
REZA MAHMOUDI, AND ARTHUR H. M. VAN ROERMUND
THERMOCOMPRESSION BONDING OF SEMICONDUCTOR WAFERS 253
JORG FROMEL, MARIO BAUM, MAIK WIEMER
SMART SYSTEMS INTEGRATION IN BIOANALYSIS: CONVERGENCE OF
TECHNOLOGIES FOR POINT-OF-CARE TESTING 263
FRANK F. BIER, EVA EHRENTREICH-FORSTER
AND SOEREN SCHUMACHER
PROPERTIES, APPLICATIONS AND MARKETS FOR NANOTECHNOLOGIES 281
HANS-JORG FECHT AND MATTHIAS WERNER
PANEL LEVEL PACKAGING - A MANUFACTURING SOLUTION
FOR COST-EFFECTIVE SYSTEMS 287
ROLF ASCHENBRENNER, KARL-FRIEDRICH BECKER, TANJA BRAUN AND
ANDREAS OSTMANN
STRESS MEASUREMENTS AT THROUGH SILICON VIAS 299
DIETMAR VOGEL, ELLEN AUERSWALD, SVEN RZEPKA, BERND MICHEL
SMART MICROSYSTEMS FOR ASSET MANAGEMENT 307
DAVID HERD, ROBERT LYON, DAVID FLYNN, MARC DESMULLIEZ,
PAUL RECORD, IVAN ANDONOVIC
THE HISTORY OF MICRO MIRROR FABRICATION
AT THE CENTER OF MICROTECHNOLOGIES 315
CHRISTIAN KAUFMANN
TECHNOLOGY APPROACHES FOR TUNEABLE IR FABRY-PEROT FILTERS
APPLIED IN GAS SENSING MICROSPECTROMETERS 327
KARLA HILLER, MARCO MEINIG, SEFFEN KURTH, MARIO SEIFERT,
CHRISTIAN HELKE, NORBERT NEUMANN, MARTIN EBERMANN
CHARACTERIZATION OF THERMAL INTERFACE MATERIALS (TIM) 335
MOHAMAD ABORAS, DANIEL MAY, RALPH SCHACHT,
BERNHARD WUNDERLE, THOMAS WINKLER, SVEN RZEPKA,
BERND MICHEL
COLD JOINING WITH REACTIVE NANOMETER MULTILAYERS (RMS) 343
MAXIMILIAN RIIHL, ERIK PFLUG, STEFAN BRAUN, ANDREAS LESON
SYSTEM LEVEL DESIGN OF MEMS AND NEMS
ERIK MARKERT, MILIND A. SHENDE, GORAN HERRMANN,
ULRICH HEINKEL
347
GERMAN ASSOCIATION OF NANOTECHNOLOGY:
OBJECTIVES AND BENEFITS
RALPH NONNINGER, BERND MICHEL
353
INTEGRATION
IN MICROFLUIDICS:
TOWARDS SMART MICROFLUIDIC SYSTEMS 359
JORG NESTLER, THOMAS OTTO
MICROFLUIDIC SYSTEM
FOR AGGLUTINATION BASED POINT-OF-CARE DIAGNOSTICS 367
ANDREAS MORSCHHAUSER, SASCHA
GEIDEL, ALLYN GROL3E,
JORG NESTLER, THOMAS OTTO
TESTING LOW TEMPERATURE SI DIRECT BONDED INTERFACES
FOR 3D MICROELECTRONIC INTEGRATION 373
FALK NAUMANN, MATTHIAS PETZOLD
HETEROINTEGRATION OF SYSTEMS IN ORGANIC SUBSTRATES 381
KARLHEINZ BOCK
FRACTURE TOUGHNESS MEASUREMENTS
FOR MICROELECTRONIC PACKAGES 391
INGRID MAUS, HEINZ PAPE, BIRGIT BRAMER, BERND MICHEL,
BERNHARD WUNDERLE
PRINTED ANTENNAS ON FLEXIBLE SUBSTRATES
FOR HIGHLY INTEGRATED SMART SYSTEMS:
CONDUCTIVITY OF PRINTED LAYER AND ITS ANTENNA PERFORMANCE 395
RALF ZICHNER AND REINHARD R. BAUMANN
RAPID, INEXPENSIVE AND ACCURATE
FRACTURE-MECHANICAL INTERFACE CHARACTERISATION 403
BERHARD WUNDERLE, MARCUS SCHULZ, JURGEN KELLER,
BERND MICHEL, HEINZ PAPE
X-RAY TOMOGRAPHY: FROM MICRO TO NANO
EHRENFRIED ZSCHECH, SVEN NIESE, PETER KRUGER
411
3D TECHNOLOGY - A PROMISING APPROACH
IN THE FIELD OF SMART SYSTEM INTEGRATION 417
M. JUERGEN WOLF, KLAUS-DIETER LANG
SIZE EFFECT ON STRUCTURE AND MECHANICAL PROPERTIES
OF MATERIALS IN ELECTRONICS AND MECHATRONICS
- AN OVERVIEW - 427
JIIRGEN VILLAIN, ULRIKE CORRADI, SIMONA KLIMA
EXPERIMENTAL TESTING OF SILICON DIE STRENGTH
DEPENDING ON THE PROCESSING HISTORY 433
JOHN BRUECKNER, RAINER DUDEK, ELLEN AUERSWALD,
SVEN RZEPKA, BERND MICHEL
ANALYSIS OF INTERFACE DELAMINATION
BY COMBINED THEORETICAL AND EXPERIMENTAL MEANS 439
RAINER DUDEK, BIRGIT BRAMER, JURGEN AUERSPERG
A NOVEL EXPERIMENTAL AND NUMERICAL APPROACH
FOR LIFETIME ASSESSMENT OF MICROELECTRONIC DEVICES 445
GOLTA KHATIBI, MARTIN LEDERER, BERNHARD CZERNY,
AGNIESZKA BETZWAR, BRIGITTE WEISS
INFLUENCE OF ASSEMBLY AND PACKAGING
ON FUNCTIONAL PARAMETERS OF MICRO-SENSORS 453
JURGEN WILDE
APPLICATIONS DRIVEN BY PRINTED BATTERIES 461
ANDREAS WILLERT, MICHAEL ESPIG, MONIQUE HELMERT,
REINHARD R. BAUMANN
INVESTIGATION OF REACTIVE AND NANO SCALE MATERIAL SYSTEMS
FOR ROOM-TEMPERATURE REACTIVE WAFER BONDING 467
JORG BRAUER, JAN BESSER,
MAIK WIEMER, THOMAS GESSNER
OVERVIEW
OF WAFER BONDING AND CHARACTERIZATION
OF THE BONDED INTERFACE 473
KLAUS VOGEL, MARCO HAUBOLD, MAIK WIEMER, THOMAS GESSNER
ON THE CRACK AND DELAMINATION RISK OPTIMIZATION
TOWARDS 3D-IC-LNTEGRATION 483
JURGEN AUERSPERG, ELLEN AUERSWALD, SVEN OSWALD,
KASHI V. MACHANI, SVEN RZEPKA, BERND MICHEL
AIM TECHNOLOGY AND DEVICES -
FROM BASIC RESEARCH TO INDUSTRIAL PROVEN MEMS PLATFORM 491
ANDREAS BERTZ, DANNY REUTER, MARKUS NOWACK
HIGH PRECISION VIBRATORY MEMS GYROSCOPE 501
DETLEF BILLEP, KARLA HILLER, SUSANN HAHN, ROMAN FORKE,
DANIEL KOHLER, CHRIS STOCKEL, STEFAN KONIETZKA, STEFFEN HEINZ
MICRO-DEFORMATIONS IN MEMS 509
ANDREAS H. FOITZIK, KAI-HENNING LIETZAU, CARSTEN STOLLFUSS
DETERMINATION OF RESIDUAL STRESSES BY FIB-DAC METHODOLOGY 515
ELLEN AUERSWALD, DIETMAR VOGEL, BERND MICHEL, SVEN RZEPKA
INVESTIGATION OF LOW TEMPERATURE WAFER BONDING
USING PLASMA ACTIVATION 521
DIRK WUNSCH, CHRISTIAN HOFMANN, JORG BRAUER,
MAIK WIEMER, THOMAS GESSNER
IMPROVEMENT OF COPPER BONDING
BY ANALYZING THE MECHANICAL PROPERTIES
OF THE BOND INTERFACE 529
KLAUS VOGEL, MARIO BAUM, FRANK ROSCHER, MAIK WIEMER,
THOMAS GESSNER
AGING ANALYSIS FOR MEMS DEVICES USING X-RAY TECHNIQUES 537
ALEX DOMMANN, TOBIAS BANDI AND ANTONIA NEELS
SEMICONDUCTOR NANOCRYSTALS -
MODERN BUILDING BLOCKS FOR INNOVATIVE MICROSYSTEMS 545
ALEXANDER WEIG, MARTIN MOBIUS, JORG MARTIN, THOMAS OTTO
HIGH PRECISION 3D SURFACE RECONSTRUCTION BY COMBINING
SHAPE-FROM-SHADING AND LIGHT SECTIONING TECHNIQUES 553
MATTHIAS BACHMAN, BRITTA GERKEN, THOMAS MAGER,
CHRISTIAN HEDAYAT
INTRODUCING AEROSOL-JET PRINTING
AS SEMICONDUCTOR AND MEMS FABRICATION PROCESS 563
FRANK ROSCHER, TOBIAS SEIFERT AND MAIK WIEMER
IMPROVEMENT OF YIELD AND RELIABILITY
OF SUB-30 NM STRUCTURES WITH FINITE ELEMENT ANALYSIS
IN BEOL STRESS ENGINEERING 573
EBERHARD KAULFERSCH, BIRGIT BRAMER, DIRK BREUER,
SVEN RZEPKA, ELLEN CLAUSS, FRANK FEUSTEL, BERND MICHEL
AN ACCELERATED INTERFACIAL CHARACTERIZATION METHOD
FOR MICROELECTRONIC PACKAGES UNDER AUTOMOTIVE
TESTING CONDITIONS - METHODOLOGY AND SAMPLE PREPARATION 581
EMAD A. POSHTAN, CHRISTIAN SILBER, SVEN RZEPKA,
BERND MICHEL, BERNHARD WUNDERLE
EXPERIMENTAL AND NUMERICAL INVESTIGATION
OF PCB VIBRATION DURING DROP IMPACT 589
GRACE L. TSEBO SIMO, HOSSEIN SHIRANGI, SVEN RZEPKA,
BERND MICHEL, MATTHIAS NOWOTTNICK
LOW
-TEMPERATURE ASSEMBLING PROCESS
WITH NANOSCALED SOLDER LAYERS 603
ANDREJ NOVIKOV, GERD HOLZHUTER, AND MATHIAS NOWOTTNICK
INTERFACE CHARACTERISATION AT ELECTRONIC PACKAGES
BY MEANS OF NANOSCALE DEFORMATION ANALYSIS 613
JIIRGEN KELLER, TIMO ZANDER, MARCUS SCHULZ,
MARTIN SPRINGBORN, THOMAS LAUENSTEIN, MICHAEL DOST,
BERNHARD WUNDERLE, BERND MICHEL
STRESS CHIP MEASUREMENTS DURING TEMPERATURE CYCLING TEST 617
FLORIAN SCHINDLER-SAEFKOW, FLORIAN ROST, ALEXANDER OTTO,
JURGEN KELLER, BERND MICHEL, SVEN RZEPKA
IN-SITU CHARACTERIZATION OF MICROELECTRONIC SYSTEMS
USING 2D DIGITAL IMAGE CORRELATION
AND 3D DIGITAL VOLUME CORRELATION
OF X-RAY MICROTOMOGRAPHY IMAGES 627
BETTINA SEILER, SVEN HAASE, ELKE NOACK, ROLF ERB,
LUTZ SCHEITER
SEMICONDUCING NANOPARTICLES
FOR FIELD EFFECT TRANSISTOR INTEGRATION ON FOILS 637
ULRICH HILLERINGMANN, KARSTEN WOLFF, FABIO FEDRIZZI VIDOR,
FABIAN ASSION
ANALYSIS OF MATERIAL PARAMETERS OF HARMNST POLYMERS
BY MICRO TENSILE TEST 651
JURGEN VOGEL, HANS-JURGEN FEIGE, JENS SAUPE,
GABI GRUTZNER, JURGEN GRIMM
ANTI-COUNTERFEITING TECHNIQUE IN THE MICRO REGION
FOR MICRO AND NANO SYSTEMS 659
FALK LUCZAK, MICHAEL DOST, BETTINA SEILER, THOMAS WINKLER,
BERND MICHEL
EXPERIMENTAL CONSIDERATION AND THEORETICAL DESCRIPTION
OF DRYING KINETICS OF THICK PHOTORESIST COATINGS 665
MAIK SCHONFELD, JENS SAUPE, JURGEN GRIMM
PREPARING RELIABILITY TESTING
FOR INCREASED DEMANDS OF AUTOMOTIVE ELECTRONICS 671
KERSTIN KREYGIG, ALEXANDER OTTO
MINIATURIZED FRICTIONLESS FAN CONCEPT
FOR THERMAL MANAGEMENT OF ELECTRONICS 677
RALPH SCHACHT, BERNHARD WUNDERLE, SVEN RZEPKA,
BERND MICHEL
SMART UNIVERSAL POWER ANTENNA
FOR OPTIMIZED WIRELESS ENERGY TRANSFER - SUPA 687
MAIK JULIAN BUKER, ULRICH HILLERINGMANN, VOLKER GENEIG
AND CHRISTIAN HEDAYAT
DETERMINATION OF MOISTURE SENSITIVE MATERIALS DATA
OF MICRO SYSTEMS RELEVANT POLYMERS 695
HANS WALTER, OLE HOICK, OLAF WITTIER
EUCEMAN - THE EUROPEAN CENTER
FOR MICRONANORELIABILITY RESEARCH IN EUROPE
BERND MICHEL, THOMAS WINKLER
703
|
| any_adam_object | 1 |
| author2 | Michel, Bernd 1949- |
| author2_role | edt |
| author2_variant | b m bm |
| author_GND | (DE-588)141263911 (DE-588)142973548 |
| author_facet | Michel, Bernd 1949- |
| building | Verbundindex |
| bvnumber | BV042144243 |
| classification_rvk | ZN 2150 ZN 3750 |
| classification_tum | TEC 020f |
| ctrlnum | (OCoLC)895408527 (DE-599)BVBBV042144243 |
| discipline | Technik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| genre | (DE-588)4143413-4 Aufsatzsammlung gnd-content (DE-588)4016928-5 Festschrift gnd-content |
| genre_facet | Aufsatzsammlung Festschrift |
| id | DE-604.BV042144243 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T01:13:47Z |
| institution | BVB |
| isbn | 9783932434785 |
| language | German |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-027584157 |
| oclc_num | 895408527 |
| open_access_boolean | |
| owner | DE-12 DE-B768 DE-91G DE-BY-TUM DE-29T DE-634 DE-83 DE-11 |
| owner_facet | DE-12 DE-B768 DE-91G DE-BY-TUM DE-29T DE-634 DE-83 DE-11 |
| physical | XVIII, 729 S. zahlr. Ill., graph. Darst. |
| publishDate | 2014 |
| publishDateSearch | 2014 |
| publishDateSort | 2014 |
| publisher | Goldenbogen |
| record_format | marc |
| spelling | Smart systems integration for micro- and nanotechnologies honorary volume on the occasion of Thomas Gessner's 60th birthday Bernd Michel (Ed.) Dresden Goldenbogen 2014 XVIII, 729 S. zahlr. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Mikrosystemtechnik (DE-588)4221617-5 gnd rswk-swf Nanotechnologie (DE-588)4327470-5 gnd rswk-swf (DE-588)4143413-4 Aufsatzsammlung gnd-content (DE-588)4016928-5 Festschrift gnd-content Mikrosystemtechnik (DE-588)4221617-5 s Nanotechnologie (DE-588)4327470-5 s DE-604 Michel, Bernd 1949- (DE-588)141263911 edt Geßner, Thomas 1954-2016 (DE-588)142973548 hnr DNB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=027584157&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Smart systems integration for micro- and nanotechnologies honorary volume on the occasion of Thomas Gessner's 60th birthday Mikrosystemtechnik (DE-588)4221617-5 gnd Nanotechnologie (DE-588)4327470-5 gnd |
| subject_GND | (DE-588)4221617-5 (DE-588)4327470-5 (DE-588)4143413-4 (DE-588)4016928-5 |
| title | Smart systems integration for micro- and nanotechnologies honorary volume on the occasion of Thomas Gessner's 60th birthday |
| title_auth | Smart systems integration for micro- and nanotechnologies honorary volume on the occasion of Thomas Gessner's 60th birthday |
| title_exact_search | Smart systems integration for micro- and nanotechnologies honorary volume on the occasion of Thomas Gessner's 60th birthday |
| title_full | Smart systems integration for micro- and nanotechnologies honorary volume on the occasion of Thomas Gessner's 60th birthday Bernd Michel (Ed.) |
| title_fullStr | Smart systems integration for micro- and nanotechnologies honorary volume on the occasion of Thomas Gessner's 60th birthday Bernd Michel (Ed.) |
| title_full_unstemmed | Smart systems integration for micro- and nanotechnologies honorary volume on the occasion of Thomas Gessner's 60th birthday Bernd Michel (Ed.) |
| title_short | Smart systems integration for micro- and nanotechnologies |
| title_sort | smart systems integration for micro and nanotechnologies honorary volume on the occasion of thomas gessner s 60th birthday |
| title_sub | honorary volume on the occasion of Thomas Gessner's 60th birthday |
| topic | Mikrosystemtechnik (DE-588)4221617-5 gnd Nanotechnologie (DE-588)4327470-5 gnd |
| topic_facet | Mikrosystemtechnik Nanotechnologie Aufsatzsammlung Festschrift |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=027584157&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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