Three-dimensional molded interconnect devices (3D-MID): materials, manufacturing, assembly and applications for injection molded circuit carriers
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
München
Hanser
2014
|
| Schlagworte: | |
| Online-Zugang: | FAB01 FAN01 FAW01 FAW02 FCO01 FHA01 FHD01 FKE01 FLA01 FRO01 Volltext |
| Beschreibung: | 1 Online-Ressource (XII, 356 S.) Ill., graph. Darst. |
| ISBN: | 9781569905524 |
| DOI: | 10.3139/9781569905524 |
Internformat
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| 245 | 1 | 0 | |a Three-dimensional molded interconnect devices (3D-MID) |b materials, manufacturing, assembly and applications for injection molded circuit carriers |c Jörg Franke |
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Datensatz im Suchindex
| DE-BY-FWS_katkey | 525776 |
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| _version_ | 1806179083907760129 |
| any_adam_object | |
| author | Franke, Jörg 1964- |
| author_GND | (DE-588)141144874 |
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| author_role | aut |
| author_sort | Franke, Jörg 1964- |
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| bvnumber | BV042037045 |
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| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| doi_str_mv | 10.3139/9781569905524 |
| format | Electronic eBook |
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| id | DE-604.BV042037045 |
| illustrated | Illustrated |
| indexdate | 2024-08-01T12:03:22Z |
| institution | BVB |
| isbn | 9781569905524 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-027478394 |
| oclc_num | 890015951 |
| open_access_boolean | |
| owner | DE-703 DE-858 DE-860 DE-1046 DE-1047 DE-898 DE-BY-UBR DE-1102 DE-Aug4 DE-1043 DE-861 DE-859 DE-1050 DE-863 DE-BY-FWS DE-862 DE-BY-FWS |
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| physical | 1 Online-Ressource (XII, 356 S.) Ill., graph. Darst. |
| psigel | ZDB-16-HEB ZDB-16-HEP ZDB-16-HEP14 ZDB-16-HEB14 ZDB-16-HEB FAB_PDA_HEB ZDB-16-HEB FAN_PDA_HEB ZDB-16-HEB FAW_PDA_HEB ZDB-16-HEB FCO_PDA_HEB ZDB-16-HEB FHA_PDA_HEB ZDB-16-HEB FHD_PDA_HEB ZDB-16-HEB FKE_PDA_HEB ZDB-16-HEB FLA_PDA_HEB ZDB-16-HEB FRO_PDA_HEB |
| publishDate | 2014 |
| publishDateSearch | 2014 |
| publishDateSort | 2014 |
| publisher | Hanser |
| record_format | marc |
| spellingShingle | Franke, Jörg 1964- Three-dimensional molded interconnect devices (3D-MID) materials, manufacturing, assembly and applications for injection molded circuit carriers Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 gnd |
| subject_GND | (DE-588)4550503-2 |
| title | Three-dimensional molded interconnect devices (3D-MID) materials, manufacturing, assembly and applications for injection molded circuit carriers |
| title_auth | Three-dimensional molded interconnect devices (3D-MID) materials, manufacturing, assembly and applications for injection molded circuit carriers |
| title_exact_search | Three-dimensional molded interconnect devices (3D-MID) materials, manufacturing, assembly and applications for injection molded circuit carriers |
| title_full | Three-dimensional molded interconnect devices (3D-MID) materials, manufacturing, assembly and applications for injection molded circuit carriers Jörg Franke |
| title_fullStr | Three-dimensional molded interconnect devices (3D-MID) materials, manufacturing, assembly and applications for injection molded circuit carriers Jörg Franke |
| title_full_unstemmed | Three-dimensional molded interconnect devices (3D-MID) materials, manufacturing, assembly and applications for injection molded circuit carriers Jörg Franke |
| title_short | Three-dimensional molded interconnect devices (3D-MID) |
| title_sort | three dimensional molded interconnect devices 3d mid materials manufacturing assembly and applications for injection molded circuit carriers |
| title_sub | materials, manufacturing, assembly and applications for injection molded circuit carriers |
| topic | Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 gnd |
| topic_facet | Dreidimensionaler spritzgegossener Schaltungsträger |
| url | https://doi.org/10.3139/9781569905524 |
| work_keys_str_mv | AT frankejorg threedimensionalmoldedinterconnectdevices3dmidmaterialsmanufacturingassemblyandapplicationsforinjectionmoldedcircuitcarriers |