Advances in electronic system integration: extended abtracts
Gespeichert in:
| Weitere Verfasser: | |
|---|---|
| Format: | Tagungsbericht Buch |
| Sprache: | English |
| Veröffentlicht: |
[Templin]
Detert
2014
|
| Ausgabe: | 1st ed. |
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | 231 S. Ill., graph. Darst. |
| ISBN: | 9783934142497 |
Internformat
MARC
| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV042007603 | ||
| 003 | DE-604 | ||
| 005 | 20190625 | ||
| 007 | t | ||
| 008 | 140804s2014 gw ad|| |||| 10||| eng d | ||
| 015 | |a 14,N18 |2 dnb | ||
| 015 | |a 14,A30 |2 dnb | ||
| 016 | 7 | |a 1050256735 |2 DE-101 | |
| 020 | |a 9783934142497 |9 978-3-934142-49-7 | ||
| 024 | 3 | |a 9783934142497 | |
| 035 | |a (OCoLC)891815776 | ||
| 035 | |a (DE-599)DNB1050256735 | ||
| 040 | |a DE-604 |b ger |e rakddb | ||
| 041 | 0 | |a eng | |
| 044 | |a gw |c XA-DE-BB | ||
| 049 | |a DE-83 | ||
| 082 | 0 | |a 621.381 |2 22/ger | |
| 084 | |a ZN 1900 |0 (DE-625)157244: |2 rvk | ||
| 084 | |a 670 |2 sdnb | ||
| 084 | |a 621.3 |2 sdnb | ||
| 245 | 1 | 0 | |a Advances in electronic system integration |b extended abtracts |c 37th International Spring Seminar on Electronics Technology, May 7 - 11, 2014, Dresden, Germany. [Technische Universität Dresden, Institute of Electronic Packaging Technology ... Eds: Heinz Wohlrabe ...] |
| 246 | 1 | 3 | |a ISSE 2014 |
| 250 | |a 1st ed. | ||
| 264 | 1 | |a [Templin] |b Detert |c 2014 | |
| 300 | |a 231 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 650 | 0 | 7 | |a Nanotechnologie |0 (DE-588)4327470-5 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Mikrofertigung |0 (DE-588)7523640-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Elektroniktechnologie |0 (DE-588)4402723-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Verbindungstechnik |0 (DE-588)4129183-9 |2 gnd |9 rswk-swf |
| 655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |2 gnd-content | |
| 689 | 0 | 0 | |a Verbindungstechnik |0 (DE-588)4129183-9 |D s |
| 689 | 0 | 1 | |a Elektroniktechnologie |0 (DE-588)4402723-0 |D s |
| 689 | 0 | 2 | |a Mikrofertigung |0 (DE-588)7523640-0 |D s |
| 689 | 0 | 3 | |a Nanotechnologie |0 (DE-588)4327470-5 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Wohlrabe, Heinz |d 1955- |0 (DE-588)110858077 |4 edt | |
| 710 | 2 | |a Technische Universität Dresden |b Institut für Aufbau- und Verbindungstechnik der Elektronik |e Sonstige |0 (DE-588)10099355-2 |4 oth | |
| 711 | 2 | |a International Spring Seminar on Electronics Technology |n 37. |d 2014 |c Dresden |j Sonstige |0 (DE-588)1053153686 |4 oth | |
| 856 | 4 | 2 | |m DNB Datenaustausch |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=027449544&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |3 Inhaltsverzeichnis |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-027449544 | ||
Datensatz im Suchindex
| _version_ | 1804152420921507840 |
|---|---|
| adam_text | TABLE OF CONTENTS
V. SUNDARAM
ADVANCES IN INTERPOSER TECHNOLOGIES (KN) 13
J. WOLF
3D SYSTEM INTEGRATION ON WAFER LEVEL - TECHNOLOGIES AND APPLICATIONS
(KN) 13
A. ROMANESCU
INTEGRATED PASSIVE DEVICES IN THE 28 NM TECHNOLOGY NODE (KN) 13
M. VARGA
NOVEL ELECTRODE DESIGNS FOR NEURAL STIMULATION AND RECORDING (KN) 13
P. GIERTH, L. REBENKLAU
WETTABILITY OF RAPID THERMAL FIRING SILVER-PASTES (AO I) 14
M. JURCISIN. S. SLOSARCIK, S. KARDOS
DESIGN SOLUTION OF HEAT DISSIPATION BASED ON LTCC-HTCC HETEROSTRUCTURE
(A02) 16
A. MARIE, N. BLAZ, S. TOSKOV, G. RADOSAVLJEVIC, L. ZIVANOV
AFFECT OF PEAK SINTERING TEMPERATURE VARIATION ON LTCC FERRITE TAPE
COMPLEX
PERMEABILITY (A03) 18
M. STEINHAUSER, G. ECKART, G. LANGE
ELECTRON BEAM BRAZING OF COPPER AND ALUMINUM (A04) 20
S. TOSKOV, N. KRCIC, G. RADOSAVLJEVIC
LTCC LAMINATION PROCESS USING PIM1MA
FUGITIVE MATERIAL (A05) 22
D. SEEHASE, H. HUTH, A. NEISER, M. NOWOTTNICK
REACTIVE PASTE FOR REFLOW SOLDERING OF LARGE COMPONENTS (A06) 24
A. GECZY, B. KOVACS, M. RUSZINKO, L. G4I, I. HAJDU
OPTIMIZING SOLDER JOINTS ON BIODEGRADABLE PCBS WITH VAPOUR PHASE
SOLDERING (A07) 26
P. LUKACS, A. PIETRIKOVA
ANALYSIS OF MECHANICAL PROPERTIES OF LTCC SUBSTRATES (A08) 28
S. STOYANOV, A. DABEK. C. BAILEY
HOT NITROGEN DEBALLING OF BALL GRID ARRAYS (A09) 30
A. STAAT, T. HOHLFELD, T. STANDAU, I. WEIMANN, R. BAUER, K. HARRE
SUBSTRATES BASED ON RENEWABLE RESOURCES FOR PRINTED CIRCUIT BOARDS (A
10) 32
A. FODOR, R. JANO, D. PITICA
THERMAL INFLUENCES ON IC PACKAGES DURING MANUAL SOLDERING PROCESS (B01)
34
P. FULMEK, F. WENZL, W. NEMITZ, S. SCHWEITZER, H. HOSCHOPF, G. LANGER,
J. NICOLICS
INNOVATIVE JUNCTION TEMPERATURE MEASUREMENT METHOD APPLIED ON HIGH-POWER
LED ARRAYS (B02) 36
P. MATKOWSKI
COMPARATIVE THERMAL ANALYSIS OF COMMERCIAL AND NOVEL HYBRID THERMAL
GREASES (B03) 38
B. PLATEK, T. FALAT, J. FELBA
EVALUATION OF THE INTERFACIAL THERMAL RESISTANCE BETWEEN CARBON NANOTUBE
AND
SILICON BY USING MOLECULAR DYNAMICS SIMULATIONS (B04) 40
D. BONFERT, M. BRANZEI, C. IONESCU
INVESTIGATION ON THERMAL PROPERTIES OF SUBSTRATES FOR PRINTED
ELECTRONICS (B05) 42
M. VLADESCU, P. STROICA
OMNIDIRECTIONAL INFRARED ILLUMINATOR FOR A 360-DEGREE VISION SYSTEM
(B06) 44
HTTP://D-NB.INFO/1050256735
M. STEKOVIC. J. SANDERA
FABRICATION OF ELECTROCHEMICAL SENSOR IN LOW TEMPERATURE CO-FIRED
CERAMICS (CO
1) 46
R. KISIEL. B. PLATEK. M. MYSLIWIEC
THERMAL PROPERTIES OF AG SINTERED LAYER USED AS INTERCONNECT MATERIAL IN
MICROELECTRONICS PACKAGING (C02) 48
A. MARGHESCU, P. SVASTA, T. NEACSA
CRYPTOGRAPHIC COPROCESSOR FOR DATA INTEGRITY ALGORITHMS (C03) 50
K. HROMADKA, J. STULIK. J. REBOUN
THICK PRINTED COPPER CONDUCTORS ON ALUMINA SUBSTRATES (C04) 52
M. KLI MA, J. SOMER, M. PROCHAZKA. I. SZENDIUCH
USAGE OF LOW-TEMPERATURE CO-FIRED CERAMIC IN HERMETIC PACKAGING (COS) 54
J. SZALAPAK. A. GADOS, J. KRZEMINSKI, K. KIELBASINSKI, M. JAKUBOWSKA, A.
MLOZNIAK.
M. TEODORCZYK
NANOSILVER SINTERED JOINTS ON ELASTIC SUBSTRATES (C06) 56
P. MACH. D. BUSEK
STUDY OF THERMOMECHANICAL PROPERTIES OF ONE- AND TWO-COMPONENT
CONDUCTIVE
ADHESIVES (C07) 58
O. KRAMMER
CORRECTING FACTOR OF SOLDER PASTE VOLUME CALCULATION FOR PIN-IN-PASTE
TECHNOLOGY (C08) 60
K. RUMAN, A. PIETRIKOV, I. VEHEC, T. ROVENSKY, P. GALAJDA
INTEGRATION OF MICROSTRIP LP AND BP FILTERS TO MULTILAYER STRUCTURE
BASED ON
VARIOUS LTCC (C09) 62
K. SCHULZ. D. ERNST. S. MENZEL, K. WOLTER. J. ECKERT
TS PLATINUM WIRE BONDING ON PLATINUM (CIO) 64
D. ERNST, M. MELZER, D. MAKAROV, F. BAHR. T. ZERNA
PACKAGING TECHNOLOGIES FOR (ULTRA-)THIN SENSOR APPLICATIONS IN ACTIVE
MAGNETIC
BEARINGS
L. LORENZ. R. RIESKE, S. SOHR, K. NIEWEGLOWSKI, T. ZERNA. K.. WOLTER
DEVELOPMENT OF A WAFER-LEVEL INTEGRATION TECHNOLOGY FOR PHOTONIC
TRANSCEIVERS
BASED ON PLANAR LIGHTWAVE CIRCUITS
P. GIERTH, L. REBENKLAU, M. ZIESCHANK
EVALUATION OF LONG TIME STABILITY OF SOLDER JOINTS ON AG THICK FILM
CONDUCTORS
ON AI203 (D01) 70
T. BLECHA
SCREEN PRINTED CHIPLESS RFID TAGS (D02) 72
M. HIRMAN, K. RENDL, F. STEINER. V. WIRTH
INFLUENCE OF REFLOW SOLDERING PROFILES ON CREATION OF IMC AT THE
INTERFACE OF SNBI/CU (D03) 74
B. ILLES, B. HORVATH
TIN WHISKER GROWTH FROM LOW AG CONTENT MICRO-ALLOYED SAC SOLDERS (D04)
76
M. MOLHANEC, I. BESHAJOVA-PELIKANOVA
EMPLOYING MODEL BASED FAILURE MODE AND EFFECT ANALYSIS FOR SCREEN
PRINTING (D05) 78
M. MOLHANEC
EXTREME MANUFACTURING - AGILITY TO GREATER PRODUCTIVITY AND QUALITY
(D06) 80
R. JANO
SOLDERING PROFILE OPTIMIZATION FOR THROUGH-HOLE AND SURFACE MOUNTED
CERAMIC
CAPACITORS (D07) 82
(CI 1) 66
.(CI 2) 68
D. NOWAK, A. DZIEDZIC
RELIABILITY OF FINE-LINE THICK-FILM AND LTCC CONDUCTORS AT
HIGH-TEMPERATURE
OPERATION (D08) 84
A. NEISER, D. SEEHASE, A. FINK, H. BEIKIRCH
THERMOELECTRIC GENERATOR FOR STAND-ALONE ELECTRONIC DEVICE OPERATION IN
TEMPERATURE TEST CABINETS (D09) 86
K. DUSEK. M. PLACEK, D. BUSEK. K. DVORAKOVA
STUDY OF I NFLUENCE OF THERMAL CAPACITY AND FLUX ACTIVITY ON THE
SOLDERABILITY (D10) 88
K. DUSEK. D. BUSEK, I. BESHAJOVA PELIKANOVA, M. ZEIDLER
MEASUREMENTS OF SOLDER PASTE VISCOSITY DURING ITS TEMPERING AND AGING
(D11) 90
M. PLACEK, K. DUSEK, J. URBANEK
THE GROWTH OF WHISKERS ON THICK TIN LAYERS AND VARIOUS TYPES OF SURFACES
(D12) 92
A. OTAHAL, M. ADAMEK, I. SZENDIUCH
IMPACT OF SOLDER PASTE DRYING ON THE SOLDERABILITY (D13) 94
J. DURISIN, A. PIETRIKOVA, M. BAZU, V. ILIAN
INFLUENCE OF DIFFERENT METHODS OF AGEING ON MICROSTRUCTURE OF SOLDER
JOINTS (D14) 96
A. TULBURE, E. CEUCA, D. TURSCHNER
ARDUINO BASED POWER SEMICONDUCTORS TESTER FOR URBAN TRACTION SYSTEMS
(D15) 98
P. MACH, M. HORAK
AGEING OF SELF-HEALING POLYPROPYLENE FILM CAPACITORS BY NON-SINUSOIDAL
VOLTAGE (D16) 100
A. GECZY, M. FEJOS, L. TERSZTYANSZKY, A. KEMLER, A. SZABO
INVESTIGATING PRINTED CIRCUIT BOARD SHRINKAGE DURING REFLOW SOLDERING
(D17) 102
T. ROVENSKY, A. PIETRIKOVA, K. RUMAN, I. VEHEC
STABILITY OF LTCC SUBSTRATES IN HIGH FREQUENCY AREA AFTER ACCELERATED
AGING TESTS (DIB) 104
D. FILIP, D. PETREUS
WIRELESS ENERGY TRANSFER USING RESONANT INDUCTION (D19) 106
I. PLOTOG, M. VLADESCU
WORKING TEMPERATURES INFLUENCE OVER THE SOLDER JOINTS PROPERTIES (D20)
108
G. MISKOVIC, J. FERNANDEZ, 1-1. HOMOLKA, M. UNGER, L. VUCKOVIC, G.
RADOSAVLJEVIC
PHYSICAL AND ELECTRICAL CHARACTERISATION OF LTCC TAPES (D21) 110
P. MATKOWSKI, T. FALAT, Z. ZALUK, J. FELBA, A. MOSCICKI
STRUCTURE OF THE THERMAL INTERFACE CONNECTION MADE OF SINTERED NANO
SILVER (D22) 112
K. URBANSKI, T. FALAT, P. MATKOWSKI, J. FELBA, A. MOSCICKI
INVESTIGATION OF ELECTRICAL PROPERTIES OF CONTACTS MADE OF MATERIALS
BASED ON
SINTERED NANO-AG PARTICLES (D23) 114
K. URBANSKI
AN APPARATUS FOR FAST THERMAL CYCLING IN THE STUDY OF THE RELIABILITY OF
SMALL
ELECTRONIC STRUCTURES (D24) 116
M. BRANZEI, B. MIHAILESCU
LEAD / LEAD-FREE SOLDER ALLOYS SHEAR TESTS CORRELATIONS WITH STRUCTURE
AT
DIFFERENT TEMPERATURES (D25) 118
B. MEDGYES, 1. HAJDU, R. BERENYI, L. GAL, M. RUSZINKO, G. HARS&NYI
ELECTROCHEMICAL MIGRATION OF SILVER ON CONVENTIONAL AND BIODEGRADABLE
SUBSTRATES
IN MICROELECTRONICS
(D26) 120
I. RUSKOVA, A. ANDONOVA, T. TAKOV
RELIABILITY INVESTIGATION OF SILICON HALL EFFECT (D27) 122
Y. GEORGIEV, G. ANGELOV, P. CHERNEV, A. ANDONOVA
DIAGNOSTICS OF PACKAGED ICS BY INFRARED THERMOGRAPHY (D28) 124
Y. GEORGIEV. A. ANDONOVA, G. ANGELOV, J. HONOVA, I. ZHIVKOV. M. WEITER
THERMOGRAPHIC CONTROL OF ORGANIC SOLAR CELLS (D29) 126
K. JANKOWSKI, A. WYMYSLOWSKI
ACCELERATION OF LIFE PREDICTION OF SOLDER JOINTS WITH USING
MULTI-FAILURE CRITERIA (D30) 128
E. GIEVA, R. RUSEV. G. ANGELOV, R. RADONOV, M. HRISTOV
MICROELECTRONIC CIRCUITS ANALOGOUS TO HYDROGEN BONDING NETWORKS IN
MICHAELIS
COMPLEX OF BETA-LACTAMASE PROTEIN (EO1) 130
R. BOZOMITU, V. CEHAN, R. LUPU
A NEW CMOS DIFFERENTIAL INPUT FM QUADRATURE DEMODULATOR (E02) 132
B. PSOTA, A. OTAHAL. I. SZENDIUCH
MECHANICAL TESTING OF PCB USING COMPUTER SIMULATIONS (E03) 134
R. LUPU, R. BOZOMITU, V. CEHAN
DETECTION OF GAZE DIRECTION BY USING IMPROVED EYE-TRACKING TECHNIQUE
(E04) 136
J. §IMOTA
IMPLEMENTATION OF SPC METHODOLOGY TO SERVICE PROCESSES (E05) 138
A. BEKJARSKI, S. PLESHKOVA
MULTICORE DSPS THERMAL IMAGE SEQUENCE PROCESSING FOR REAL TIME MOTION
DETECTION
IN THERMAL SURVEILLANCE SYSTEMS (E06) 140
S. PLESHKOVA, K. PEEVA, A. BEKJARSKI
RECEIVED THERMAL IMAGES QUALITY ESTIMATION IN THERMO VISION
COMMUNICATION
SYSTEMS (E07) 142
D. KURZMANOWSKI
USING LAYOUT DATA FOR PREDICTING EFFECTS ON PRODUCTION PROCESSES IN
PCB-MANUFACTURING (E08) 144
E. CEUCA. A. TULBURE
MODELING AND PRACTICAL STRATEGY FOR PWM CONTROL IN HEATING APPLICATIONS
(E09) 146
I. MOISE, C. DUMITRESCU, N. DUMITRU, B. SOARE
BIOMEDICAL SIGNALS ANALYSIS TECHNIQUES USING THE SIGNAL PROCESSOR
TMS320C62I IB (E10) 148
I. MOISE, P. TANASA. I. BARBU , 1. COJOCARU
AUTOMATIC TRAFFIC MONITORING SYSTEM (EL2) 150
M. SPASOVA
CARBON NANOTUBE FIELD EFFECT TRANSISTOR PARAMETERS IMPACT ON TRANSFER
AND OUTPUT
PERFORMANCE (EL 3) 152
A. BOTAU, C. NEGREA, D. BONFERT
ELECTRICAL AND THERMAL BEHAVIOR FOR DC AND PULSED STRESS ON CHIP
RESISTORS (EL4) 154
Y. BASHKATOV, K. YERSHOV, V. KHOMENKO, V. VOITSEKHOVICH. N. KACHALOVA,
B. TSIGANOK
ELECTRICALLY INDUCED BROADERING OF HIGH INTENSITY PULSES IN
MICROSTRUCTURED FIBERS (E15) 156
M. BURSI K
ANALYTIC METHOD FOR MONITORING OF CLEANING PROCESS EFFICIENCY (F01) 158
T. PATARAU. D. PETREUS, R. ETZ, T. FRENTIU
PORTABLE SYSTEM FOR HEAVY METALS DETECTION BASED ON SPECTRAL ANALYSIS
(F02) 160
M. FRANZ
FREE*FIELD PHOTOVOLTAIC PLANTS IN EUROPE: DISTRIBUTION AND ENVIRONMENTAL
ASPECTS (F03) 162
G. WROBLEWSKI, M. SLOMA. D. JANCZAK, A. MLOZNIAK, M. JAKUBOWSKA
ELECTROLUMINESCENT STRUCTURES WITH NANOMATERIALS FOR DIRECT PRINTING OF
INTERACTIVE
PACKAGES AND LABELS (GO
1) 164
A. KNAPEK, F. MIKA. J. PRASEK, P. MAJZLIKOVA
SEM CHARACTERIZATION OF CARBON NANOTUBES BASED ACTIVE LAYERS OF CHEMICAL
SENSORS ...(G02) 166
T. FALAT, P. MATKOWSKI. Z. ZALUK. J. FELBA. A. MOSCICKI
MECHANICAL STRENGTH OF JOINTS BASED ON NANO-AG SINTERING PHENOMENA (G03)
168
A. BONYAR
DEVELOPMENT OF A LOCALISED SURFACE PLASMON RESONANCE SENSOR BASED ON
GOLD
NANOPARTICLES (G04) 170
I. UVAROVA. R. RUDENKO. E. VOITSIHOVSKA. I. YASKOVETS. B. DANILCHENKO
ACCUMULATION AND RECOVERY OF RADIATION-INDUCED DAMAGES IN SINGLE-WALLED
CARBON
NANOTUBE BUNDLES (G05) 172
C. WANG
BENDED DIFFERENTIAL TRANSMISSION LINE USING TIMING-OFFSET DIFFERENTIAL
SIGNAL (HOI) 174
E. COCA, V. CEHAN
A LABORATORY STUDY OF THE ELECTROMAGNETIC WAVES REFLECTIVITY OF CERTAIN
MATERIALS (H02) 176
C. TAMAS. N. CODREANU, C. GRECU, I. MARGHESCU
INVESTIGATIONS ON SILICON AND PCB GROUND SYSTEM DESIGN FOR NEW 1.2V DDR4
POWER SOURCES (H03) 178
D. VUZA, M. VLADESCU
SOLVING AN EMC/EMI PROBLEM OCCURRED INSIDE A CPLD (H04) 180
A. DABROWSKI, L. GOLONKA
LTCC/PZT DIFFERENTIAL PRESSURE SENSOR UTILIZING ULTRASONIC WAVE
RESONATOR (101) 182
T. GARAMI. R. RETI, O. KRAMMER
CONTROLLING THE COOLING RATE OF SOLDERING PROCESSES WITH PIC
MICROCONTROLLER (102) 184
R. SOUKUP, A. HAMACEK. L. MRACEK. J. REBOUN
TEXTILE BASED TEMPERATURE AND HUMIDITY SENSOR ELEMENTS FOR HEALTHCARE
APPLICATIONS..(103) 186
H. IVANOV. M. VALKOV
APPLICATION OF SENSORS AND CONTROL MICROSYSTEMS TO IMPROVE EFFICIENCY
AND SERVICE
LIFE DURABILITY OF LED LIGHTING EQUIPMENT (104) 188
E. LONTCHEV. R. KENOV, R. MILETIEV, I. SIMEONOV , Y. ISAEV
HARDWARE IMPLEMENTATION OF QUAD MICROELECTROMECHANICAL SENSOR STRUCTURE
FOR
INERTIAL SYSTEMS (105) 190
M. KISIC
INFLUENCE OF COIL DESIGN ON SENSING PERFORMANCE OF PRESSURE SENSOR WITH
POLYIMIDE MEMBRANE (106) 192
I.TOPALOV, M. GEORGIEVA
IMPLEMENTATION OF BIO-IDENTIFICATION SECURITY ACCESS TECHNOLOGIES FOR
TRANSPORT
DISPATCHING SAFETY CENTERS (107) 194
Y. YAKIMENKO, V. ULIANOVA, A. ORLOV, O. BOGDAN. G. PASHKEVICH
OPTIMAL PARAMETERS DETERMINATION FOR NANOSTRUCTURE-ENHANCED SURFACE
ACOUSTIC
WAVES SENSOR (108) 196
N. DODEV. N. NENOV, E. DIMITROV, V. PAVLOV
ELECTRONIC MEASUREMENT SYSTEM OF FLEXI-COIL SUSPENSION SPRINGS TEST
STAND (109) 198
B. MIHAILESCU. P. SVASTA
MODELING AND SIMULATION OF MULTI RESONANCE PLANAR INDUCTIVE STRUCTURE
FOR SENSOR
APPLICATIONS (110) 200
N. BLAZ
CAPACITIVE SENSOR FOR DETECTION OF LIQUID AMOUNT PRESENT IN WATER (111)
202
N. CODREANU, G. VARZARU
SOLAR POWERED WIRELESS MULTI-SENSOR DEVICE FOR AN IRRIGATION SYSTEM
(112) 204
D. WAGNER. B. SCHMIDT, M. DETERT
CHALLENGES TO THE ELECTRONICS PACKAGING TECHNOLOGIES FOR THE VOLUME
INTEGRATION
IN COMPONENTS FOR MEDICAL TOOLS AND INSTRUMENTS (113) 206
R. WUCHRER, G. LAUTENSCHLAGER, R. METASCH. M. ROLLIG. T. FLEISCHER, T.
HARTLING
FILTER-BASED INTERROGATION OF FIBER BRAGG GRATING SENSORS (114) 208
O. KAINZ, S. KARDOS, M. JURCISIN, P. CABUK
VIRTUAL FACTORY FOR PCB AND THICK-FILM CIRCUITS FABRICATION (J01) 210
J. MORRIS, L. WEASEL, P. MOECK
NANOTECHNOLOGY COURSES FOR GENERAL EDUCATION (J02) 212
F. DRAGHICI, M. PANTAZICA, N. CODREANU, P. SVASTA
HANDS-ON PROJECT- KEY ISSUE IN THE EDUCATION OF FUTURE ELECTRONIC
ENGINEERS (J03) 216
B. PLATEK, T. FALAT, J. FELBA
EFFICIENCY OF HEAT TRANSFER THROUGH STACKED SILICON CHIPS CONNECTED BY
SINTERED
NANOAG-BASED THERMAL INTERFACE MATERIALS (J04) 218
A. KLOSSOWICZ, P. WINIARSKI, M. ZAWIERTA, W. STEPLEWSKI, J. BORECKI, A.
DZIEDZIC
ANALYSIS OF LONG-TERM STABILITY OF CAPACITORS EMBEDDED IN PRINTED
CIRCUIT BOARDS (KOI) 220
J. MACIOSZCZYK. P. SLOBODZIAN, L. GOLONKA
IMPROVEMENT OF THE FREQUENCY BANDWIDTH OF LTCC MEANDER ANTENNA (K02) 222
Y. YAKIMENKO, A. ZAZERIN, A. ORLOV, O. BOGDAN
FILM BULK ACOUSTIC RESONATOR FINITE ELEMENT MODEL IN ACTIVE FILTER
DESIGN (K03) 224
T. KORDASS
GALVANIC ENHANCEMENT AS PLATING STRATEGY FOR 3D-MID (K05) 226
INDEX OF AUTHORS
.228
|
| any_adam_object | 1 |
| author2 | Wohlrabe, Heinz 1955- |
| author2_role | edt |
| author2_variant | h w hw |
| author_GND | (DE-588)110858077 |
| author_facet | Wohlrabe, Heinz 1955- |
| building | Verbundindex |
| bvnumber | BV042007603 |
| classification_rvk | ZN 1900 |
| ctrlnum | (OCoLC)891815776 (DE-599)DNB1050256735 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| edition | 1st ed. |
| format | Conference Proceeding Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02369nam a2200541 c 4500</leader><controlfield tag="001">BV042007603</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20190625 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">140804s2014 gw ad|| |||| 10||| eng d</controlfield><datafield tag="015" ind1=" " ind2=" "><subfield code="a">14,N18</subfield><subfield code="2">dnb</subfield></datafield><datafield tag="015" ind1=" " ind2=" "><subfield code="a">14,A30</subfield><subfield code="2">dnb</subfield></datafield><datafield tag="016" ind1="7" ind2=" "><subfield code="a">1050256735</subfield><subfield code="2">DE-101</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783934142497</subfield><subfield code="9">978-3-934142-49-7</subfield></datafield><datafield tag="024" ind1="3" ind2=" "><subfield code="a">9783934142497</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)891815776</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)DNB1050256735</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rakddb</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="044" ind1=" " ind2=" "><subfield code="a">gw</subfield><subfield code="c">XA-DE-BB</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-83</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381</subfield><subfield code="2">22/ger</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 1900</subfield><subfield code="0">(DE-625)157244:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">670</subfield><subfield code="2">sdnb</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">621.3</subfield><subfield code="2">sdnb</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Advances in electronic system integration</subfield><subfield code="b">extended abtracts</subfield><subfield code="c">37th International Spring Seminar on Electronics Technology, May 7 - 11, 2014, Dresden, Germany. [Technische Universität Dresden, Institute of Electronic Packaging Technology ... Eds: Heinz Wohlrabe ...]</subfield></datafield><datafield tag="246" ind1="1" ind2="3"><subfield code="a">ISSE 2014</subfield></datafield><datafield tag="250" ind1=" " ind2=" "><subfield code="a">1st ed.</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">[Templin]</subfield><subfield code="b">Detert</subfield><subfield code="c">2014</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">231 S.</subfield><subfield code="b">Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Nanotechnologie</subfield><subfield code="0">(DE-588)4327470-5</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Mikrofertigung</subfield><subfield code="0">(DE-588)7523640-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Elektroniktechnologie</subfield><subfield code="0">(DE-588)4402723-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Verbindungstechnik</subfield><subfield code="0">(DE-588)4129183-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Verbindungstechnik</subfield><subfield code="0">(DE-588)4129183-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Elektroniktechnologie</subfield><subfield code="0">(DE-588)4402723-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Mikrofertigung</subfield><subfield code="0">(DE-588)7523640-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="3"><subfield code="a">Nanotechnologie</subfield><subfield code="0">(DE-588)4327470-5</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Wohlrabe, Heinz</subfield><subfield code="d">1955-</subfield><subfield code="0">(DE-588)110858077</subfield><subfield code="4">edt</subfield></datafield><datafield tag="710" ind1="2" ind2=" "><subfield code="a">Technische Universität Dresden</subfield><subfield code="b">Institut für Aufbau- und Verbindungstechnik der Elektronik</subfield><subfield code="e">Sonstige</subfield><subfield code="0">(DE-588)10099355-2</subfield><subfield code="4">oth</subfield></datafield><datafield tag="711" ind1="2" ind2=" "><subfield code="a">International Spring Seminar on Electronics Technology</subfield><subfield code="n">37.</subfield><subfield code="d">2014</subfield><subfield code="c">Dresden</subfield><subfield code="j">Sonstige</subfield><subfield code="0">(DE-588)1053153686</subfield><subfield code="4">oth</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">DNB Datenaustausch</subfield><subfield code="q">application/pdf</subfield><subfield code="u">http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=027449544&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA</subfield><subfield code="3">Inhaltsverzeichnis</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-027449544</subfield></datafield></record></collection> |
| genre | (DE-588)1071861417 Konferenzschrift gnd-content |
| genre_facet | Konferenzschrift |
| id | DE-604.BV042007603 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T01:10:26Z |
| institution | BVB |
| institution_GND | (DE-588)10099355-2 (DE-588)1053153686 |
| isbn | 9783934142497 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-027449544 |
| oclc_num | 891815776 |
| open_access_boolean | |
| owner | DE-83 |
| owner_facet | DE-83 |
| physical | 231 S. Ill., graph. Darst. |
| publishDate | 2014 |
| publishDateSearch | 2014 |
| publishDateSort | 2014 |
| publisher | Detert |
| record_format | marc |
| spelling | Advances in electronic system integration extended abtracts 37th International Spring Seminar on Electronics Technology, May 7 - 11, 2014, Dresden, Germany. [Technische Universität Dresden, Institute of Electronic Packaging Technology ... Eds: Heinz Wohlrabe ...] ISSE 2014 1st ed. [Templin] Detert 2014 231 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Nanotechnologie (DE-588)4327470-5 gnd rswk-swf Mikrofertigung (DE-588)7523640-0 gnd rswk-swf Elektroniktechnologie (DE-588)4402723-0 gnd rswk-swf Verbindungstechnik (DE-588)4129183-9 gnd rswk-swf (DE-588)1071861417 Konferenzschrift gnd-content Verbindungstechnik (DE-588)4129183-9 s Elektroniktechnologie (DE-588)4402723-0 s Mikrofertigung (DE-588)7523640-0 s Nanotechnologie (DE-588)4327470-5 s DE-604 Wohlrabe, Heinz 1955- (DE-588)110858077 edt Technische Universität Dresden Institut für Aufbau- und Verbindungstechnik der Elektronik Sonstige (DE-588)10099355-2 oth International Spring Seminar on Electronics Technology 37. 2014 Dresden Sonstige (DE-588)1053153686 oth DNB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=027449544&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Advances in electronic system integration extended abtracts Nanotechnologie (DE-588)4327470-5 gnd Mikrofertigung (DE-588)7523640-0 gnd Elektroniktechnologie (DE-588)4402723-0 gnd Verbindungstechnik (DE-588)4129183-9 gnd |
| subject_GND | (DE-588)4327470-5 (DE-588)7523640-0 (DE-588)4402723-0 (DE-588)4129183-9 (DE-588)1071861417 |
| title | Advances in electronic system integration extended abtracts |
| title_alt | ISSE 2014 |
| title_auth | Advances in electronic system integration extended abtracts |
| title_exact_search | Advances in electronic system integration extended abtracts |
| title_full | Advances in electronic system integration extended abtracts 37th International Spring Seminar on Electronics Technology, May 7 - 11, 2014, Dresden, Germany. [Technische Universität Dresden, Institute of Electronic Packaging Technology ... Eds: Heinz Wohlrabe ...] |
| title_fullStr | Advances in electronic system integration extended abtracts 37th International Spring Seminar on Electronics Technology, May 7 - 11, 2014, Dresden, Germany. [Technische Universität Dresden, Institute of Electronic Packaging Technology ... Eds: Heinz Wohlrabe ...] |
| title_full_unstemmed | Advances in electronic system integration extended abtracts 37th International Spring Seminar on Electronics Technology, May 7 - 11, 2014, Dresden, Germany. [Technische Universität Dresden, Institute of Electronic Packaging Technology ... Eds: Heinz Wohlrabe ...] |
| title_short | Advances in electronic system integration |
| title_sort | advances in electronic system integration extended abtracts |
| title_sub | extended abtracts |
| topic | Nanotechnologie (DE-588)4327470-5 gnd Mikrofertigung (DE-588)7523640-0 gnd Elektroniktechnologie (DE-588)4402723-0 gnd Verbindungstechnik (DE-588)4129183-9 gnd |
| topic_facet | Nanotechnologie Mikrofertigung Elektroniktechnologie Verbindungstechnik Konferenzschrift |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=027449544&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT wohlrabeheinz advancesinelectronicsystemintegrationextendedabtracts AT technischeuniversitatdresdeninstitutfuraufbauundverbindungstechnikderelektronik advancesinelectronicsystemintegrationextendedabtracts AT internationalspringseminaronelectronicstechnologydresden advancesinelectronicsystemintegrationextendedabtracts AT wohlrabeheinz isse2014 AT technischeuniversitatdresdeninstitutfuraufbauundverbindungstechnikderelektronik isse2014 AT internationalspringseminaronelectronicstechnologydresden isse2014 |