Characterization of integrated circuit packaging materials:
Saved in:
| Main Author: | |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
New York, NY
Momentum Press
2010
|
| Series: | Materials characterization series
|
| Subjects: | |
| Physical Description: | XX, 274 S. Ill., graph. Darst. |
| ISBN: | 1606501879 9781606501870 |
Staff View
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Record in the Search Index
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| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
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| id | DE-604.BV042000946 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T01:10:17Z |
| institution | BVB |
| isbn | 1606501879 9781606501870 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-027442995 |
| oclc_num | 915528324 |
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| owner | DE-83 |
| owner_facet | DE-83 |
| physical | XX, 274 S. Ill., graph. Darst. |
| publishDate | 2010 |
| publishDateSearch | 2010 |
| publishDateSort | 2010 |
| publisher | Momentum Press |
| record_format | marc |
| series2 | Materials characterization series |
| spelling | Moore, Thomas M. Verfasser aut Characterization of integrated circuit packaging materials eds Thomas M. Moore ... New York, NY Momentum Press 2010 XX, 274 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Materials characterization series Halbleitergehäuse (DE-588)4143472-9 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 gnd rswk-swf Werkstoff (DE-588)4065579-9 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 s Halbleitergehäuse (DE-588)4143472-9 s Werkstoff (DE-588)4065579-9 s DE-604 Erscheint auch als Online-Ausgabe 1-60650-189-5 Erscheint auch als Online-Ausgabe 978-1-60650-189-4 |
| spellingShingle | Moore, Thomas M. Characterization of integrated circuit packaging materials Halbleitergehäuse (DE-588)4143472-9 gnd Integrierte Schaltung (DE-588)4027242-4 gnd Werkstoff (DE-588)4065579-9 gnd |
| subject_GND | (DE-588)4143472-9 (DE-588)4027242-4 (DE-588)4065579-9 |
| title | Characterization of integrated circuit packaging materials |
| title_auth | Characterization of integrated circuit packaging materials |
| title_exact_search | Characterization of integrated circuit packaging materials |
| title_full | Characterization of integrated circuit packaging materials eds Thomas M. Moore ... |
| title_fullStr | Characterization of integrated circuit packaging materials eds Thomas M. Moore ... |
| title_full_unstemmed | Characterization of integrated circuit packaging materials eds Thomas M. Moore ... |
| title_short | Characterization of integrated circuit packaging materials |
| title_sort | characterization of integrated circuit packaging materials |
| topic | Halbleitergehäuse (DE-588)4143472-9 gnd Integrierte Schaltung (DE-588)4027242-4 gnd Werkstoff (DE-588)4065579-9 gnd |
| topic_facet | Halbleitergehäuse Integrierte Schaltung Werkstoff |
| work_keys_str_mv | AT moorethomasm characterizationofintegratedcircuitpackagingmaterials |