Electrical conductive adhesives with nanotechnologies:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
New York
Springer
c2010
|
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Beschreibung: | Includes bibliographical references and index |
| Beschreibung: | 1 Online-Ressource (xii, 437 p.) |
| ISBN: | 9781282837188 |
Internformat
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| 100 | 1 | |a Li, Yi |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Electrical conductive adhesives with nanotechnologies |c Yi Li, Daniel Lu, C.P. Wong |
| 264 | 1 | |a New York |b Springer |c c2010 | |
| 300 | |a 1 Online-Ressource (xii, 437 p.) | ||
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| 650 | 4 | |a Solder and soldering | |
| 650 | 4 | |a Adhesives / Electric properties | |
| 650 | 4 | |a Nanostructured materials | |
| 700 | 1 | |a Lu, Daniel |e Sonstige |4 oth | |
| 700 | 1 | |a Wong, C. P. |e Sonstige |4 oth | |
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Datensatz im Suchindex
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|---|---|
| any_adam_object | |
| author | Li, Yi |
| author_facet | Li, Yi |
| author_role | aut |
| author_sort | Li, Yi |
| author_variant | y l yl |
| building | Verbundindex |
| bvnumber | BV041911745 |
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| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381046 |
| dewey-search | 621.381046 |
| dewey-sort | 3621.381046 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| id | DE-604.BV041911745 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T01:08:07Z |
| institution | BVB |
| isbn | 9781282837188 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-027355414 |
| oclc_num | 732599164 |
| open_access_boolean | |
| physical | 1 Online-Ressource (xii, 437 p.) |
| psigel | ZDB-26-MYL |
| publishDate | 2010 |
| publishDateSearch | 2010 |
| publishDateSort | 2010 |
| publisher | Springer |
| record_format | marc |
| spelling | Li, Yi Verfasser aut Electrical conductive adhesives with nanotechnologies Yi Li, Daniel Lu, C.P. Wong New York Springer c2010 1 Online-Ressource (xii, 437 p.) txt rdacontent c rdamedia cr rdacarrier Includes bibliographical references and index Electronic packaging Solder and soldering Adhesives / Electric properties Nanostructured materials Lu, Daniel Sonstige oth Wong, C. P. Sonstige oth Erscheint auch als Druck-Ausgabe, Hardcover 978-0-387-88782-1 Erscheint auch als Druck-Ausgabe, Hardcover 0-387-88782-2 http://lib.myilibrary.com?id=283718 Aggregator Volltext |
| spellingShingle | Li, Yi Electrical conductive adhesives with nanotechnologies Electronic packaging Solder and soldering Adhesives / Electric properties Nanostructured materials |
| title | Electrical conductive adhesives with nanotechnologies |
| title_auth | Electrical conductive adhesives with nanotechnologies |
| title_exact_search | Electrical conductive adhesives with nanotechnologies |
| title_full | Electrical conductive adhesives with nanotechnologies Yi Li, Daniel Lu, C.P. Wong |
| title_fullStr | Electrical conductive adhesives with nanotechnologies Yi Li, Daniel Lu, C.P. Wong |
| title_full_unstemmed | Electrical conductive adhesives with nanotechnologies Yi Li, Daniel Lu, C.P. Wong |
| title_short | Electrical conductive adhesives with nanotechnologies |
| title_sort | electrical conductive adhesives with nanotechnologies |
| topic | Electronic packaging Solder and soldering Adhesives / Electric properties Nanostructured materials |
| topic_facet | Electronic packaging Solder and soldering Adhesives / Electric properties Nanostructured materials |
| url | http://lib.myilibrary.com?id=283718 |
| work_keys_str_mv | AT liyi electricalconductiveadhesiveswithnanotechnologies AT ludaniel electricalconductiveadhesiveswithnanotechnologies AT wongcp electricalconductiveadhesiveswithnanotechnologies |