Advanced thermal management materials:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
New York
Springer
c2013
|
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Beschreibung: | Includes bibliographical references and index |
| Beschreibung: | 1 Online-Ressource (xi, 154 p.) |
| ISBN: | 9781461419624 146141962X 9781461419631 9781283622387 |
Internformat
MARC
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| 020 | |a 146141962X |c alk. paper |9 1-4614-1962-X | ||
| 020 | |a 9781461419631 |c ebk. |9 978-1-4614-1963-1 | ||
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| 100 | 1 | |a Jiang, Guosheng |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Advanced thermal management materials |c Guosheng Jiang, Liyong Diao, Ken Kuang |
| 264 | 1 | |a New York |b Springer |c c2013 | |
| 300 | |a 1 Online-Ressource (xi, 154 p.) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 500 | |a Includes bibliographical references and index | ||
| 650 | 4 | |a Microelectronic packaging / Materials / Thermal properties | |
| 650 | 4 | |a Microelectronics / Cooling | |
| 650 | 4 | |a Heat sinks (Electronics) | |
| 650 | 0 | 7 | |a Temperaturverhalten |0 (DE-588)4457534-8 |2 gnd |9 rswk-swf |
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| 689 | 0 | 1 | |a Temperaturverhalten |0 (DE-588)4457534-8 |D s |
| 689 | 0 | |8 1\p |5 DE-604 | |
| 700 | 1 | |a Diao, Liyong |e Sonstige |4 oth | |
| 700 | 1 | |a Kuang, Ken |e Sonstige |4 oth | |
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Datensatz im Suchindex
| _version_ | 1804152265261449216 |
|---|---|
| any_adam_object | |
| author | Jiang, Guosheng |
| author_facet | Jiang, Guosheng |
| author_role | aut |
| author_sort | Jiang, Guosheng |
| author_variant | g j gj |
| building | Verbundindex |
| bvnumber | BV041906318 |
| collection | ZDB-26-MYL |
| ctrlnum | (OCoLC)819505171 (DE-599)BVBBV041906318 |
| dewey-full | 621.381046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381046 |
| dewey-search | 621.381046 |
| dewey-sort | 3621.381046 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| id | DE-604.BV041906318 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T01:07:58Z |
| institution | BVB |
| isbn | 9781461419624 146141962X 9781461419631 9781283622387 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-027349987 |
| oclc_num | 819505171 |
| open_access_boolean | |
| physical | 1 Online-Ressource (xi, 154 p.) |
| psigel | ZDB-26-MYL |
| publishDate | 2013 |
| publishDateSearch | 2013 |
| publishDateSort | 2013 |
| publisher | Springer |
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| spelling | Jiang, Guosheng Verfasser aut Advanced thermal management materials Guosheng Jiang, Liyong Diao, Ken Kuang New York Springer c2013 1 Online-Ressource (xi, 154 p.) txt rdacontent c rdamedia cr rdacarrier Includes bibliographical references and index Microelectronic packaging / Materials / Thermal properties Microelectronics / Cooling Heat sinks (Electronics) Temperaturverhalten (DE-588)4457534-8 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 s Temperaturverhalten (DE-588)4457534-8 s 1\p DE-604 Diao, Liyong Sonstige oth Kuang, Ken Sonstige oth http://lib.myilibrary.com?id=393483 Aggregator Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Jiang, Guosheng Advanced thermal management materials Microelectronic packaging / Materials / Thermal properties Microelectronics / Cooling Heat sinks (Electronics) Temperaturverhalten (DE-588)4457534-8 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| subject_GND | (DE-588)4457534-8 (DE-588)4014360-0 |
| title | Advanced thermal management materials |
| title_auth | Advanced thermal management materials |
| title_exact_search | Advanced thermal management materials |
| title_full | Advanced thermal management materials Guosheng Jiang, Liyong Diao, Ken Kuang |
| title_fullStr | Advanced thermal management materials Guosheng Jiang, Liyong Diao, Ken Kuang |
| title_full_unstemmed | Advanced thermal management materials Guosheng Jiang, Liyong Diao, Ken Kuang |
| title_short | Advanced thermal management materials |
| title_sort | advanced thermal management materials |
| topic | Microelectronic packaging / Materials / Thermal properties Microelectronics / Cooling Heat sinks (Electronics) Temperaturverhalten (DE-588)4457534-8 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| topic_facet | Microelectronic packaging / Materials / Thermal properties Microelectronics / Cooling Heat sinks (Electronics) Temperaturverhalten Elektronisches Bauelement |
| url | http://lib.myilibrary.com?id=393483 |
| work_keys_str_mv | AT jiangguosheng advancedthermalmanagementmaterials AT diaoliyong advancedthermalmanagementmaterials AT kuangken advancedthermalmanagementmaterials |