Handbook of wafer bonding:
Saved in:
| Format: | Electronic eBook |
|---|---|
| Language: | English |
| Published: |
Weinheim
Wiley-VCH
2012
|
| Subjects: | |
| Online Access: | Volltext |
| Item Description: | Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices |
| Physical Description: | 1 Online-Ressource |
| ISBN: | 9783527644223 9783527644247 9783527644230 9783527644254 9783527326464 |
Staff View
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV041829410 | ||
| 003 | DE-604 | ||
| 005 | 20180307 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 140506s2012 |||| o||u| ||||||eng d | ||
| 020 | |a 9783527644223 |c Online |9 978-3-527-64422-3 | ||
| 020 | |a 9783527644247 |c ePDF |9 978-3-527-64424-7 | ||
| 020 | |a 9783527644230 |c ePub |9 978-3-527-64423-0 | ||
| 020 | |a 9783527644254 |c Mobi |9 978-3-527-64425-4 | ||
| 020 | |a 9783527326464 |c Print |9 978-3-527-32646-4 | ||
| 024 | 7 | |a 10.1002/9783527644223 |2 doi | |
| 035 | |a (OCoLC)779616373 | ||
| 035 | |a (DE-599)BVBBV041829410 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-703 |a DE-861 | ||
| 082 | 0 | |a 621.38152 |2 22 | |
| 084 | |a UP 7570 |0 (DE-625)146436: |2 rvk | ||
| 084 | |a ZN 4192 |0 (DE-625)157372: |2 rvk | ||
| 245 | 1 | 0 | |a Handbook of wafer bonding |c edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M. V. Taklo |
| 264 | 1 | |a Weinheim |b Wiley-VCH |c 2012 | |
| 300 | |a 1 Online-Ressource | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 500 | |a Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices | ||
| 650 | 7 | |a Handbooks, manuals, etc |2 fast | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING / Electronics / Semiconductors |2 bisacsh | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING / Electronics / Solid State |2 bisacsh | |
| 650 | 7 | |a Semiconductor wafers |2 fast | |
| 650 | 7 | |a Semiconductors / Bonding |2 fast | |
| 650 | 4 | |a Semiconductor wafers / Handbooks, manuals, etc | |
| 650 | 4 | |a Semiconductors / Bonding / Handbooks, manuals, etc | |
| 650 | 0 | 7 | |a Bonden |0 (DE-588)4232594-8 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Wafer |0 (DE-588)4294605-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a MEMS |0 (DE-588)4824724-8 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Wafer |0 (DE-588)4294605-0 |D s |
| 689 | 0 | 1 | |a Bonden |0 (DE-588)4232594-8 |D s |
| 689 | 0 | 2 | |a MEMS |0 (DE-588)4824724-8 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Ramm, Peter |d 1940- |e Sonstige |0 (DE-588)172926106 |4 oth | |
| 700 | 1 | |a Lu, James Jian-Qiang |e Sonstige |4 oth | |
| 700 | 1 | |a Taklo, Maaike M. V. |e Sonstige |4 oth | |
| 856 | 4 | 0 | |u https://onlinelibrary.wiley.com/doi/book/10.1002/9783527644223 |x Verlag |3 Volltext |
| 912 | |a ZDB-35-WIC |a ZDB-35-WCQ | ||
| 940 | 1 | |q UBT_ZDB-35-WCQ_2012 | |
| 940 | 1 | |q FRO_PDA_WIC | |
| 940 | 1 | |q UBG_PDA_WIC | |
| 940 | 1 | |q FHR_PDA_WIC | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-027274329 | ||
Record in the Search Index
| _version_ | 1804152164946280448 |
|---|---|
| any_adam_object | |
| author_GND | (DE-588)172926106 |
| building | Verbundindex |
| bvnumber | BV041829410 |
| classification_rvk | UP 7570 ZN 4192 |
| collection | ZDB-35-WIC ZDB-35-WCQ |
| ctrlnum | (OCoLC)779616373 (DE-599)BVBBV041829410 |
| dewey-full | 621.38152 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.38152 |
| dewey-search | 621.38152 |
| dewey-sort | 3621.38152 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Physik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02809nmm a2200625zc 4500</leader><controlfield tag="001">BV041829410</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20180307 </controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">140506s2012 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783527644223</subfield><subfield code="c">Online</subfield><subfield code="9">978-3-527-64422-3</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783527644247</subfield><subfield code="c">ePDF</subfield><subfield code="9">978-3-527-64424-7</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783527644230</subfield><subfield code="c">ePub</subfield><subfield code="9">978-3-527-64423-0</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783527644254</subfield><subfield code="c">Mobi</subfield><subfield code="9">978-3-527-64425-4</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783527326464</subfield><subfield code="c">Print</subfield><subfield code="9">978-3-527-32646-4</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1002/9783527644223</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)779616373</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV041829410</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-703</subfield><subfield code="a">DE-861</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.38152</subfield><subfield code="2">22</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">UP 7570</subfield><subfield code="0">(DE-625)146436:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4192</subfield><subfield code="0">(DE-625)157372:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Handbook of wafer bonding</subfield><subfield code="c">edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M. V. Taklo</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Weinheim</subfield><subfield code="b">Wiley-VCH</subfield><subfield code="c">2012</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Handbooks, manuals, etc</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Electronics / Semiconductors</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Electronics / Solid State</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Semiconductor wafers</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Semiconductors / Bonding</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Semiconductor wafers / Handbooks, manuals, etc</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Semiconductors / Bonding / Handbooks, manuals, etc</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Bonden</subfield><subfield code="0">(DE-588)4232594-8</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Wafer</subfield><subfield code="0">(DE-588)4294605-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">MEMS</subfield><subfield code="0">(DE-588)4824724-8</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Wafer</subfield><subfield code="0">(DE-588)4294605-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Bonden</subfield><subfield code="0">(DE-588)4232594-8</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">MEMS</subfield><subfield code="0">(DE-588)4824724-8</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Ramm, Peter</subfield><subfield code="d">1940-</subfield><subfield code="e">Sonstige</subfield><subfield code="0">(DE-588)172926106</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Lu, James Jian-Qiang</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Taklo, Maaike M. V.</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://onlinelibrary.wiley.com/doi/book/10.1002/9783527644223</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-35-WIC</subfield><subfield code="a">ZDB-35-WCQ</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">UBT_ZDB-35-WCQ_2012</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">FRO_PDA_WIC</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">UBG_PDA_WIC</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">FHR_PDA_WIC</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-027274329</subfield></datafield></record></collection> |
| id | DE-604.BV041829410 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T01:06:22Z |
| institution | BVB |
| isbn | 9783527644223 9783527644247 9783527644230 9783527644254 9783527326464 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-027274329 |
| oclc_num | 779616373 |
| open_access_boolean | |
| owner | DE-703 DE-861 |
| owner_facet | DE-703 DE-861 |
| physical | 1 Online-Ressource |
| psigel | ZDB-35-WIC ZDB-35-WCQ UBT_ZDB-35-WCQ_2012 FRO_PDA_WIC UBG_PDA_WIC FHR_PDA_WIC |
| publishDate | 2012 |
| publishDateSearch | 2012 |
| publishDateSort | 2012 |
| publisher | Wiley-VCH |
| record_format | marc |
| spelling | Handbook of wafer bonding edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M. V. Taklo Weinheim Wiley-VCH 2012 1 Online-Ressource txt rdacontent c rdamedia cr rdacarrier Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices Handbooks, manuals, etc fast TECHNOLOGY & ENGINEERING / Electronics / Semiconductors bisacsh TECHNOLOGY & ENGINEERING / Electronics / Solid State bisacsh Semiconductor wafers fast Semiconductors / Bonding fast Semiconductor wafers / Handbooks, manuals, etc Semiconductors / Bonding / Handbooks, manuals, etc Bonden (DE-588)4232594-8 gnd rswk-swf Wafer (DE-588)4294605-0 gnd rswk-swf MEMS (DE-588)4824724-8 gnd rswk-swf Wafer (DE-588)4294605-0 s Bonden (DE-588)4232594-8 s MEMS (DE-588)4824724-8 s DE-604 Ramm, Peter 1940- Sonstige (DE-588)172926106 oth Lu, James Jian-Qiang Sonstige oth Taklo, Maaike M. V. Sonstige oth https://onlinelibrary.wiley.com/doi/book/10.1002/9783527644223 Verlag Volltext |
| spellingShingle | Handbook of wafer bonding Handbooks, manuals, etc fast TECHNOLOGY & ENGINEERING / Electronics / Semiconductors bisacsh TECHNOLOGY & ENGINEERING / Electronics / Solid State bisacsh Semiconductor wafers fast Semiconductors / Bonding fast Semiconductor wafers / Handbooks, manuals, etc Semiconductors / Bonding / Handbooks, manuals, etc Bonden (DE-588)4232594-8 gnd Wafer (DE-588)4294605-0 gnd MEMS (DE-588)4824724-8 gnd |
| subject_GND | (DE-588)4232594-8 (DE-588)4294605-0 (DE-588)4824724-8 |
| title | Handbook of wafer bonding |
| title_auth | Handbook of wafer bonding |
| title_exact_search | Handbook of wafer bonding |
| title_full | Handbook of wafer bonding edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M. V. Taklo |
| title_fullStr | Handbook of wafer bonding edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M. V. Taklo |
| title_full_unstemmed | Handbook of wafer bonding edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M. V. Taklo |
| title_short | Handbook of wafer bonding |
| title_sort | handbook of wafer bonding |
| topic | Handbooks, manuals, etc fast TECHNOLOGY & ENGINEERING / Electronics / Semiconductors bisacsh TECHNOLOGY & ENGINEERING / Electronics / Solid State bisacsh Semiconductor wafers fast Semiconductors / Bonding fast Semiconductor wafers / Handbooks, manuals, etc Semiconductors / Bonding / Handbooks, manuals, etc Bonden (DE-588)4232594-8 gnd Wafer (DE-588)4294605-0 gnd MEMS (DE-588)4824724-8 gnd |
| topic_facet | Handbooks, manuals, etc TECHNOLOGY & ENGINEERING / Electronics / Semiconductors TECHNOLOGY & ENGINEERING / Electronics / Solid State Semiconductor wafers Semiconductors / Bonding Semiconductor wafers / Handbooks, manuals, etc Semiconductors / Bonding / Handbooks, manuals, etc Bonden Wafer MEMS |
| url | https://onlinelibrary.wiley.com/doi/book/10.1002/9783527644223 |
| work_keys_str_mv | AT rammpeter handbookofwaferbonding AT lujamesjianqiang handbookofwaferbonding AT taklomaaikemv handbookofwaferbonding |