Handbook of wafer bonding:
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Weinheim
Wiley-VCH
2012
|
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Beschreibung: | Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices |
| Beschreibung: | 1 Online-Ressource |
| ISBN: | 9783527644223 9783527644247 9783527644230 9783527644254 9783527326464 |
Internformat
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| 245 | 1 | 0 | |a Handbook of wafer bonding |c edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M. V. Taklo |
| 264 | 1 | |a Weinheim |b Wiley-VCH |c 2012 | |
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| 337 | |b c |2 rdamedia | ||
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| 500 | |a Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices | ||
| 650 | 7 | |a Handbooks, manuals, etc |2 fast | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING / Electronics / Semiconductors |2 bisacsh | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING / Electronics / Solid State |2 bisacsh | |
| 650 | 7 | |a Semiconductor wafers |2 fast | |
| 650 | 7 | |a Semiconductors / Bonding |2 fast | |
| 650 | 4 | |a Semiconductor wafers / Handbooks, manuals, etc | |
| 650 | 4 | |a Semiconductors / Bonding / Handbooks, manuals, etc | |
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| 700 | 1 | |a Ramm, Peter |d 1940- |e Sonstige |0 (DE-588)172926106 |4 oth | |
| 700 | 1 | |a Lu, James Jian-Qiang |e Sonstige |4 oth | |
| 700 | 1 | |a Taklo, Maaike M. V. |e Sonstige |4 oth | |
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Datensatz im Suchindex
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| dewey-full | 621.38152 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.38152 |
| dewey-search | 621.38152 |
| dewey-sort | 3621.38152 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Physik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| illustrated | Not Illustrated |
| indexdate | 2024-07-10T01:06:22Z |
| institution | BVB |
| isbn | 9783527644223 9783527644247 9783527644230 9783527644254 9783527326464 |
| language | English |
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| spelling | Handbook of wafer bonding edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M. V. Taklo Weinheim Wiley-VCH 2012 1 Online-Ressource txt rdacontent c rdamedia cr rdacarrier Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices Handbooks, manuals, etc fast TECHNOLOGY & ENGINEERING / Electronics / Semiconductors bisacsh TECHNOLOGY & ENGINEERING / Electronics / Solid State bisacsh Semiconductor wafers fast Semiconductors / Bonding fast Semiconductor wafers / Handbooks, manuals, etc Semiconductors / Bonding / Handbooks, manuals, etc Bonden (DE-588)4232594-8 gnd rswk-swf Wafer (DE-588)4294605-0 gnd rswk-swf MEMS (DE-588)4824724-8 gnd rswk-swf Wafer (DE-588)4294605-0 s Bonden (DE-588)4232594-8 s MEMS (DE-588)4824724-8 s DE-604 Ramm, Peter 1940- Sonstige (DE-588)172926106 oth Lu, James Jian-Qiang Sonstige oth Taklo, Maaike M. V. Sonstige oth https://onlinelibrary.wiley.com/doi/book/10.1002/9783527644223 Verlag Volltext |
| spellingShingle | Handbook of wafer bonding Handbooks, manuals, etc fast TECHNOLOGY & ENGINEERING / Electronics / Semiconductors bisacsh TECHNOLOGY & ENGINEERING / Electronics / Solid State bisacsh Semiconductor wafers fast Semiconductors / Bonding fast Semiconductor wafers / Handbooks, manuals, etc Semiconductors / Bonding / Handbooks, manuals, etc Bonden (DE-588)4232594-8 gnd Wafer (DE-588)4294605-0 gnd MEMS (DE-588)4824724-8 gnd |
| subject_GND | (DE-588)4232594-8 (DE-588)4294605-0 (DE-588)4824724-8 |
| title | Handbook of wafer bonding |
| title_auth | Handbook of wafer bonding |
| title_exact_search | Handbook of wafer bonding |
| title_full | Handbook of wafer bonding edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M. V. Taklo |
| title_fullStr | Handbook of wafer bonding edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M. V. Taklo |
| title_full_unstemmed | Handbook of wafer bonding edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M. V. Taklo |
| title_short | Handbook of wafer bonding |
| title_sort | handbook of wafer bonding |
| topic | Handbooks, manuals, etc fast TECHNOLOGY & ENGINEERING / Electronics / Semiconductors bisacsh TECHNOLOGY & ENGINEERING / Electronics / Solid State bisacsh Semiconductor wafers fast Semiconductors / Bonding fast Semiconductor wafers / Handbooks, manuals, etc Semiconductors / Bonding / Handbooks, manuals, etc Bonden (DE-588)4232594-8 gnd Wafer (DE-588)4294605-0 gnd MEMS (DE-588)4824724-8 gnd |
| topic_facet | Handbooks, manuals, etc TECHNOLOGY & ENGINEERING / Electronics / Semiconductors TECHNOLOGY & ENGINEERING / Electronics / Solid State Semiconductor wafers Semiconductors / Bonding Semiconductor wafers / Handbooks, manuals, etc Semiconductors / Bonding / Handbooks, manuals, etc Bonden Wafer MEMS |
| url | https://onlinelibrary.wiley.com/doi/book/10.1002/9783527644223 |
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