Lead-free solders: materials reliability for electronics
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to al...
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Hoboken, NJ
Wiley
2012
|
| Schriftenreihe: | Wiley series in materials for electronic and optoelectronic applications
|
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Zusammenfassung: | Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met. K. N. Subramanian is Professor of Materials Science and Engineering at Michigan State University. He has been a full-time faculty member at MSU for over 45 years. For the last 15 years he has devoted all his research efforts to lead-free electronic solders. |
| Beschreibung: | 1 Online-Ressource |
| ISBN: | 9781119966203 9781119966210 9781119966807 9780470971826 |
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| language | English |
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| spelling | Lead-free solders materials reliability for electronics edited by K. N. Subramanian Hoboken, NJ Wiley 2012 1 Online-Ressource txt rdacontent c rdamedia cr rdacarrier Wiley series in materials for electronic and optoelectronic applications Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met. K. N. Subramanian is Professor of Materials Science and Engineering at Michigan State University. He has been a full-time faculty member at MSU for over 45 years. For the last 15 years he has devoted all his research efforts to lead-free electronic solders. Lead-free electronics manufacturing processes fast Solder and soldering fast Lead-free electronics manufacturing processes Solder and soldering Blei (DE-588)4145879-5 gnd rswk-swf Löten (DE-588)4036162-7 gnd rswk-swf Ersatzstoff (DE-588)4131298-3 gnd rswk-swf Löten (DE-588)4036162-7 s Blei (DE-588)4145879-5 s Ersatzstoff (DE-588)4131298-3 s DE-604 Subramanian, K. N. Sonstige oth https://onlinelibrary.wiley.com/doi/book/10.1002/9781119966203 Verlag Volltext |
| spellingShingle | Lead-free solders materials reliability for electronics Lead-free electronics manufacturing processes fast Solder and soldering fast Lead-free electronics manufacturing processes Solder and soldering Blei (DE-588)4145879-5 gnd Löten (DE-588)4036162-7 gnd Ersatzstoff (DE-588)4131298-3 gnd |
| subject_GND | (DE-588)4145879-5 (DE-588)4036162-7 (DE-588)4131298-3 |
| title | Lead-free solders materials reliability for electronics |
| title_auth | Lead-free solders materials reliability for electronics |
| title_exact_search | Lead-free solders materials reliability for electronics |
| title_full | Lead-free solders materials reliability for electronics edited by K. N. Subramanian |
| title_fullStr | Lead-free solders materials reliability for electronics edited by K. N. Subramanian |
| title_full_unstemmed | Lead-free solders materials reliability for electronics edited by K. N. Subramanian |
| title_short | Lead-free solders |
| title_sort | lead free solders materials reliability for electronics |
| title_sub | materials reliability for electronics |
| topic | Lead-free electronics manufacturing processes fast Solder and soldering fast Lead-free electronics manufacturing processes Solder and soldering Blei (DE-588)4145879-5 gnd Löten (DE-588)4036162-7 gnd Ersatzstoff (DE-588)4131298-3 gnd |
| topic_facet | Lead-free electronics manufacturing processes Solder and soldering Blei Löten Ersatzstoff |
| url | https://onlinelibrary.wiley.com/doi/book/10.1002/9781119966203 |
| work_keys_str_mv | AT subramaniankn leadfreesoldersmaterialsreliabilityforelectronics |