Advanced interconnects for ULSI technology:
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip,...
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Hoboken, NJ
Wiley
2012
|
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Zusammenfassung: | Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips. |
| Beschreibung: | "This book presents an in-depth overview of present status, novel developments and new materials and approaches for advanced interconnect technology"-- |
| Beschreibung: | 1 Online-Ressource |
| ISBN: | 9781119963677 9781119963240 9781119966869 9780470662540 9781280590801 |
Internformat
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV041829362 | ||
| 003 | DE-604 | ||
| 005 | 20140723 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 140506s2012 |||| o||u| ||||||eng d | ||
| 020 | |a 9781119963677 |c Online |9 978-1-119-96367-7 | ||
| 020 | |a 9781119963240 |c ePDF |9 978-1-119-96324-0 | ||
| 020 | |a 9781119966869 |c ePub |9 978-1-119-96686-9 | ||
| 020 | |a 9780470662540 |c Print |9 978-0-470-66254-0 | ||
| 020 | |a 9781280590801 |9 978-1-280-59080-1 | ||
| 024 | 7 | |a 10.1002/9781119963677 |2 doi | |
| 035 | |a (OCoLC)778448543 | ||
| 035 | |a (DE-599)BVBBV041829362 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-703 |a DE-861 | ||
| 082 | 0 | |a 621.39/5 |2 23 | |
| 084 | |a ZN 4125 |0 (DE-625)157354: |2 rvk | ||
| 084 | |a ZN 4952 |0 (DE-625)157425: |2 rvk | ||
| 245 | 1 | 0 | |a Advanced interconnects for ULSI technology |c edited by Mikhail R. Baklanov, Paul S. Ho and Ehrenfried Zschech |
| 264 | 1 | |a Hoboken, NJ |b Wiley |c 2012 | |
| 300 | |a 1 Online-Ressource | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 500 | |a "This book presents an in-depth overview of present status, novel developments and new materials and approaches for advanced interconnect technology"-- | ||
| 520 | |a Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips. | ||
| 650 | 7 | |a TECHNOLOGY & ENGINEERING / Electronics / Circuits / VLSI & ULSI. |2 bisacsh | |
| 650 | 7 | |a COMPUTERS / Logic Design |2 bisacsh | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING / Electronics / Circuits / Logic |2 bisacsh | |
| 650 | 7 | |a Integrated circuits / Ultra large scale integration |2 fast | |
| 650 | 7 | |a Interconnects (Integrated circuit technology) |2 fast | |
| 650 | 4 | |a Interconnects (Integrated circuit technology) | |
| 650 | 4 | |a Integrated circuits / Ultra large scale integration | |
| 650 | 0 | 7 | |a Integrierte Schaltung |0 (DE-588)4027242-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a ULSI |0 (DE-588)4226286-0 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Integrierte Schaltung |0 (DE-588)4027242-4 |D s |
| 689 | 0 | 1 | |a ULSI |0 (DE-588)4226286-0 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Baklanov, Mikhail R. |e Sonstige |0 (DE-588)1024580938 |4 oth | |
| 700 | 1 | |a Ho, Paul S. |e Sonstige |4 oth | |
| 700 | 1 | |a Zschech, Ehrenfried |e Sonstige |0 (DE-588)172475201 |4 oth | |
| 856 | 4 | 0 | |u https://onlinelibrary.wiley.com/doi/book/10.1002/9781119963677 |x Verlag |3 Volltext |
| 912 | |a ZDB-35-WCN |a ZDB-35-WIC | ||
| 940 | 1 | |q UBT_ZDB-35-WCN_2012 | |
| 940 | 1 | |q FRO_PDA_WIC | |
| 940 | 1 | |q UBG_PDA_WIC | |
| 940 | 1 | |q FHR_PDA_WIC | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-027274281 | ||
Datensatz im Suchindex
| _version_ | 1804152164841422848 |
|---|---|
| any_adam_object | |
| author_GND | (DE-588)1024580938 (DE-588)172475201 |
| building | Verbundindex |
| bvnumber | BV041829362 |
| classification_rvk | ZN 4125 ZN 4952 |
| collection | ZDB-35-WCN ZDB-35-WIC |
| ctrlnum | (OCoLC)778448543 (DE-599)BVBBV041829362 |
| dewey-full | 621.39/5 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.39/5 |
| dewey-search | 621.39/5 |
| dewey-sort | 3621.39 15 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03786nmm a2200613zc 4500</leader><controlfield tag="001">BV041829362</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20140723 </controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">140506s2012 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781119963677</subfield><subfield code="c">Online</subfield><subfield code="9">978-1-119-96367-7</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781119963240</subfield><subfield code="c">ePDF</subfield><subfield code="9">978-1-119-96324-0</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781119966869</subfield><subfield code="c">ePub</subfield><subfield code="9">978-1-119-96686-9</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780470662540</subfield><subfield code="c">Print</subfield><subfield code="9">978-0-470-66254-0</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781280590801</subfield><subfield code="9">978-1-280-59080-1</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1002/9781119963677</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)778448543</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV041829362</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-703</subfield><subfield code="a">DE-861</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.39/5</subfield><subfield code="2">23</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4125</subfield><subfield code="0">(DE-625)157354:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4952</subfield><subfield code="0">(DE-625)157425:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Advanced interconnects for ULSI technology</subfield><subfield code="c">edited by Mikhail R. Baklanov, Paul S. Ho and Ehrenfried Zschech</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Hoboken, NJ</subfield><subfield code="b">Wiley</subfield><subfield code="c">2012</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">"This book presents an in-depth overview of present status, novel developments and new materials and approaches for advanced interconnect technology"--</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Electronics / Circuits / VLSI & ULSI.</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">COMPUTERS / Logic Design</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Electronics / Circuits / Logic</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Integrated circuits / Ultra large scale integration</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Interconnects (Integrated circuit technology)</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Interconnects (Integrated circuit technology)</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Integrated circuits / Ultra large scale integration</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Integrierte Schaltung</subfield><subfield code="0">(DE-588)4027242-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">ULSI</subfield><subfield code="0">(DE-588)4226286-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Integrierte Schaltung</subfield><subfield code="0">(DE-588)4027242-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">ULSI</subfield><subfield code="0">(DE-588)4226286-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Baklanov, Mikhail R.</subfield><subfield code="e">Sonstige</subfield><subfield code="0">(DE-588)1024580938</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Ho, Paul S.</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Zschech, Ehrenfried</subfield><subfield code="e">Sonstige</subfield><subfield code="0">(DE-588)172475201</subfield><subfield code="4">oth</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119963677</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-35-WCN</subfield><subfield code="a">ZDB-35-WIC</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">UBT_ZDB-35-WCN_2012</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">FRO_PDA_WIC</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">UBG_PDA_WIC</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">FHR_PDA_WIC</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-027274281</subfield></datafield></record></collection> |
| id | DE-604.BV041829362 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T01:06:22Z |
| institution | BVB |
| isbn | 9781119963677 9781119963240 9781119966869 9780470662540 9781280590801 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-027274281 |
| oclc_num | 778448543 |
| open_access_boolean | |
| owner | DE-703 DE-861 |
| owner_facet | DE-703 DE-861 |
| physical | 1 Online-Ressource |
| psigel | ZDB-35-WCN ZDB-35-WIC UBT_ZDB-35-WCN_2012 FRO_PDA_WIC UBG_PDA_WIC FHR_PDA_WIC |
| publishDate | 2012 |
| publishDateSearch | 2012 |
| publishDateSort | 2012 |
| publisher | Wiley |
| record_format | marc |
| spelling | Advanced interconnects for ULSI technology edited by Mikhail R. Baklanov, Paul S. Ho and Ehrenfried Zschech Hoboken, NJ Wiley 2012 1 Online-Ressource txt rdacontent c rdamedia cr rdacarrier "This book presents an in-depth overview of present status, novel developments and new materials and approaches for advanced interconnect technology"-- Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips. TECHNOLOGY & ENGINEERING / Electronics / Circuits / VLSI & ULSI. bisacsh COMPUTERS / Logic Design bisacsh TECHNOLOGY & ENGINEERING / Electronics / Circuits / Logic bisacsh Integrated circuits / Ultra large scale integration fast Interconnects (Integrated circuit technology) fast Interconnects (Integrated circuit technology) Integrated circuits / Ultra large scale integration Integrierte Schaltung (DE-588)4027242-4 gnd rswk-swf ULSI (DE-588)4226286-0 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 s ULSI (DE-588)4226286-0 s DE-604 Baklanov, Mikhail R. Sonstige (DE-588)1024580938 oth Ho, Paul S. Sonstige oth Zschech, Ehrenfried Sonstige (DE-588)172475201 oth https://onlinelibrary.wiley.com/doi/book/10.1002/9781119963677 Verlag Volltext |
| spellingShingle | Advanced interconnects for ULSI technology TECHNOLOGY & ENGINEERING / Electronics / Circuits / VLSI & ULSI. bisacsh COMPUTERS / Logic Design bisacsh TECHNOLOGY & ENGINEERING / Electronics / Circuits / Logic bisacsh Integrated circuits / Ultra large scale integration fast Interconnects (Integrated circuit technology) fast Interconnects (Integrated circuit technology) Integrated circuits / Ultra large scale integration Integrierte Schaltung (DE-588)4027242-4 gnd ULSI (DE-588)4226286-0 gnd |
| subject_GND | (DE-588)4027242-4 (DE-588)4226286-0 |
| title | Advanced interconnects for ULSI technology |
| title_auth | Advanced interconnects for ULSI technology |
| title_exact_search | Advanced interconnects for ULSI technology |
| title_full | Advanced interconnects for ULSI technology edited by Mikhail R. Baklanov, Paul S. Ho and Ehrenfried Zschech |
| title_fullStr | Advanced interconnects for ULSI technology edited by Mikhail R. Baklanov, Paul S. Ho and Ehrenfried Zschech |
| title_full_unstemmed | Advanced interconnects for ULSI technology edited by Mikhail R. Baklanov, Paul S. Ho and Ehrenfried Zschech |
| title_short | Advanced interconnects for ULSI technology |
| title_sort | advanced interconnects for ulsi technology |
| topic | TECHNOLOGY & ENGINEERING / Electronics / Circuits / VLSI & ULSI. bisacsh COMPUTERS / Logic Design bisacsh TECHNOLOGY & ENGINEERING / Electronics / Circuits / Logic bisacsh Integrated circuits / Ultra large scale integration fast Interconnects (Integrated circuit technology) fast Interconnects (Integrated circuit technology) Integrated circuits / Ultra large scale integration Integrierte Schaltung (DE-588)4027242-4 gnd ULSI (DE-588)4226286-0 gnd |
| topic_facet | TECHNOLOGY & ENGINEERING / Electronics / Circuits / VLSI & ULSI. COMPUTERS / Logic Design TECHNOLOGY & ENGINEERING / Electronics / Circuits / Logic Integrated circuits / Ultra large scale integration Interconnects (Integrated circuit technology) Integrierte Schaltung ULSI |
| url | https://onlinelibrary.wiley.com/doi/book/10.1002/9781119963677 |
| work_keys_str_mv | AT baklanovmikhailr advancedinterconnectsforulsitechnology AT hopauls advancedinterconnectsforulsitechnology AT zschechehrenfried advancedinterconnectsforulsitechnology |