CIPS 2014: 8th International Conference on Integrated Power Electronics Systems ; proceedings ; February, 25 - 27, 2014, Nuremberg, Germany
Gespeichert in:
| Körperschaft: | |
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| Format: | Tagungsbericht Buch |
| Sprache: | English |
| Veröffentlicht: |
Berlin
VDE Verl.
2014
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| Schriftenreihe: | ETG-Fachbericht
141 |
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | Literaturangaben. - Zusätzliches Online-Angebot unter www.cips-conference.de |
| Beschreibung: | 522 S. Ill. 1 CD-ROM (12 cm) |
| ISBN: | 9783800735785 |
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| DE-BY-862_location | 2000 |
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TABLE OF CONTENT
SESSION 1: RELIABILITY (1)
1.1 KEYNOTE: WHAT ARE THE BIG CHALLENGES IN PE
J. W. KOLAR (ETH ZURICH, SWITZERLAND)
NOT AVAILABLE
1.2 PACKAGING AND RELIABILITY OF POWER MODULES (INVITED) 17
J. LUTZ (CHEMNITZ UNIVERSITY OF TECHNOLOGY, GERMANY)
1.3 HIGH-THROUGHPUT DBC-ASSEMBLED IGBT SCREENING FOR POWER MODULE 25
M. TSUKUDA (THE INTERNATIONAL CENTRE FOR THE STUDY OF EAST ASIAN
DEVELOPMENT & KYUSHU INSTITUTE
OF TECHNOLOGY, JAPAN); S. OKODA (COPER ELECTRONICS CO. LTD, JAPAN); N.
RYUZO (C. D. N. CORPORATION,
JAPAN); K. TASHIRO (HOH KOH SYA CO., LTD., JAPAN); I. OMURA (KYUSHU
INSTITUTE OF TECHNOLOGY,
JAPAN)
1.4 SIMULTANEOUS TESTING OF WIREBOND AND SOLDER FATIGUE IN IGBT MODULES
31
G. J. RIEDEL, M. VALOV (ABB CORPORATE RESEARCH, SWITZERLAND)
SESSION 2: RELIABILITY (2)
2.1 POWER CYCLING CAPABILITY OF MODULES WITH SIC-DIODES 36
C. HEROLD, T. POLLER, J. LUTZ (CHEMNITZ UNIVERSITY OF TECHNOLOGY,
GERMANY);
M. SCHAFER, F. SAUERLAND, O. SCHILLING (INFINEON AG, GERMANY)
2.2 A REAL TIME MEASUREMENT OF JUNCTION TEMPERATURE VARIATION IN HIGH
POWER IGBT
MODULES FOR WIND POWER CONVERTER APPLICATION 42
P. GHIMIRE, A. R. DE VEGA, K. B. PEDERSEN, S. MUNK-NIELSEN (AALBORG
UNIVERSITY, DENMARK);
B. RANNESTAD, P. B. THOGERSEN (KK-ELEKTRONICS A/S, DENMARK)
2.3 THERMAL PATH INTEGRITY MONITORING FOR IGBT POWER ELECTRONICS MODULES
48
A. ELEFFENDI, C. M. JOHNSON (UNIVERSITY OF NOTTINGHAM, UNITED KINGDOM)
2.4 RELIABILITY ASSESSMENT OF MOLDED SMART POWER MODULES 55
T. THOMAS (TU BERLIN, GERMANY); K.-D. LANG (TU BERLIN, GERMANY);
K.-F. BECKER, T. BRAUN, J. BAUER, O. WITTIER, R. ASCHENBRENNER
(FRAUNHOFER IZM, GERMANY)
2.5 MICROSTRUCTURAL STUDY OF THE FATIGUE MECHANISM OF ALUMINUM CLADDED
COPPER WIRES 63
F. NAUMANN, B. MAERZ, J. SCHISCHKA, M. PETZOLD (FRAUNHOFER INSTITUTE FOR
MECHANICS OF MATERIALS
IWM, GERMANY)
SESSION 3: RELIABILITY (3)
3.1 AGING OF NEW INTERCONNECT-TECHNOLOGIES OF POWER MODULES DURING
POWER-CYCLING 69
N. HEUCK, K. GUTH, A. CILIOX, M. THOBEN, N. OESCHLER, S. KRASEL, R.
SPECKELS, L. BOWER
(INFINEON TECHNOLOGIES AG, GERMANY)
HTTP://D-NB.INFO/1047554232
3.2 HIGH RESOLUTION FAILURE ANALYSIS OF SILVER-SINTERED CONTACT
INTERFACES FOR POWER
ELECTRONICS 75
B. BOTTGE, S. KLENGEL, M. PETZOLD (FRAUNHOFER INSTITUTE FOR MECHANICS OF
MATERIALS IWM,
GERMANY)
3.3 A NON-DESTRUCTIVE STUDY OF CRACK DEVELOPMENT DURING THERMAL CYCLING
OF A1 WIRE BONDS
USING X-RAY COMPUTED TOMOGRAPHY 82
P. A. AGYAKWA, L. YANG, M. R. CORFIELD, C. M. JOHNSON (UNIVERSITY OF
NOTTINGHAM, UNITED
KINGDOM)
3.4 PROBABILISTIC MODEL BASED ANALYSIS OF ELECTROLYTIC CAPACITOR AGEING
AND FAILURES IN A
SINGLE-PHASE POWER FACTOR CORRECTION CIRCUIT 87
N. SELIGER (UNIVERSITY OF APPLIED SCIENCES ROSENHEIM, GERMANY)
SESSION 4: RELIABILITY (4)
4.1 TRANSIENT HYGRO-THERMAL-RESPONSE OF POWER MODULES IN INVERTERS -
MISSION PROFILING FOR
CLIMATE AND POWER LOADING (INVITED) 93
R. BAYERER, M. LASSMANN, S. KREMP (INFINEON TECHNOLOGIES AG, GERMANY)
4.2 TEMPERATURE HUMIDITY BIAS (THB) TESTING ON IGBT MODULES AT HIGH BIAS
LEVELS 101
C. ZORN, NANDO KAMINSKI (UNIVERSITY OF BREMEN, GERMANY)
4.3 KEYNOTE: SIMULATION AND TEST VIBRATION - NONLINEAR DYNAMIC EFFECTS
IN VIBRATION
DURABILITY OF ELECTRONIC SYSTEMS 108
A. DASGUPTA, C. CHOI (UNIVERSITY OF MARYLAND, USA); ED HABTOUR (US ARMY
RESEARCH LAB, USA)
DIALOG SESSION: INVERTERS, CONVERTERS, DRIVERS
P01 DEVELOPMENT OF A NEW 1000 V /1 MVA IGBT 3L-NPC-VSC PEBB TYPE 2 WITH
INDEPENDENT MODULATION, DC-LINK BALANCING AND SHORT-CIRCUIT PROTECTION
118
I. STAUDT (SEMIKRON ELEKTRONIC GMBH & CO. KG, GERMANY); M. SPRENGER
(TECHNISCHE
UNIVERSITAET DRESDEN, GERMANY)
P02 SWITCHING-FREQUENCY LIMITATIONS OF A THREE-PHASE PWM INVERTER USING
SI-MOSFETS
AND SIC-SBDS 123
K. WADA, KENT TAGURI (TOKYO METROPOLITAN UNIVERSITY, JAPAN)
P03 A PROPOSAL OF EMBEDDED SOC POWER SUPPLY COMPATIBLE WITH A DIGITAL
BLOCK DESIGN FLOW 128
T. SOUVIGNET, S. TROCHUT, F. HASBANI (STMICROELECTRONICS, FRANCE); B.
ALLARD (INSA LYON, FRANCE)
P04 ULTRA-LOW POWER AUTONOMOUS POWER MANAGEMENT SYSTEM WITH EFFECTIVE
IMPEDANCE
MATCHING FOR RF ENERGY HARVESTING 133
S.-E. ADAMI, C. VOLLAIRE, B. ALLARD (AMPERE LAB, FRANCE); F. COSTA
(SATIE, FRANCE);
W. HABOUBI, L. CIRIO (MARNE-LA-VALLEE UNIVERSITY, FRANCE)
P05 GAN POWER SEMICONDUCTORS FOR PV INVERTER APPLICATIONS -
OPPORTUNITIES AND RISKS 139
T. STUBBE (SMA SOLAR TECHNOLOGY AG, GERMANY); R. MALLWITZ (FULDA
UNIVERSITY OF APPLIED
SCIENCES, GERMANY); M. KUNZE (MICROGAN GMBH, GERMANY); W. BERGNER, O.
HABERLEN,
G. POZZOVIVO, R. RUPP (INFINEON TECHNOLOGY AG, GERMANY)
P06 DESIGN OF PHOTOVOLTAIC MICROINVERTER FOR OFF-GRID AND GRID-PARALLEL
APPLICATIONS 145
C. FELGEMACHER, P. JAGER, A. KOBEISSI, J. PFEIFFER, D. WIEGAND, W.
KRUSCHEL, B. DOMBERT,
S. ARAUJO, P. ZACHARIAS (UNIVERSITY OF KASSEL, GERMANY)
P07 AN IMPROVED METHOD OF CONTROLLING IGBT MODULES USING AN OPTIMIZED
GATE CURRENT
WAVEFORM 151
M. CENUSA, G. CRETU, M. PFOST (REUTLINGEN UNIVERSITY, GERMANY)
P08 IMPACT OF THE CONTROL ON THE SIZE OF THE OUTPUT CAPACITOR IN THE
INTEGRATION OF BUCK
CONVERTERS 157
J. CORTES, V. SVIKOVIC, P. ALOU, J. A. OLIVER, J. A. COBOS (UNIVERSIDAD
POLITECNICA DE MADRID,
SPAIN)
DIALOG SESSION: PACKAGING
P09 IMPROVING THE BOND STRENGTH OF SINTER JOINTS BY MODIFYING THE DBC
WITHOUT NOBLE FINISHES
AND MODIFIED SILVER SINTER PASTES 163
A. ROTH (KCC CORPORATION, GERMANY); W. SCHMITT (HERAEUS MATERIALS
TECHNOLOGY GMBH & CO.
KG, GERMANY)
P10 POWER SEMICONDUCTORS PACKAGING IN PV INVERTERS UP TO 30 KW POWER, A
DIFFICULT CHOICE 169
J. HINZE, P. ZACHARIAS, S. ARAUJO (UNIVERSITAT KASSEL, GERMANY); J.
FRIEBE (SMA SOLAR TECHNOLOGY
AG, GERMANY); T. LEIFERT (SMA SOLAR TECHNOLOGY AG, GERMANY)
PLL DATA-DRIVEN MODELING OF THE ULTRASONIC SOFTENING EFFECT FOR ROBUST
COPPER WIRE
BONDING 175
A. UNGER, W. SEXTRO, S. ALTHOFF, T. MEYER (UNIVERSITY OF PADERBORN,
GERMANY);
M. BROKELMANN (HESSE GMBH, GERMANY); F. REINHART, K. NEUMANN (BIELEFELD
UNIVERSITY, GERMANY);
K. GUTH, D. BOLOWSKI (INFINEON TECHNOLOGIES AG, GERMANY)
P12 INFLUENCE OF NICKEL-PHOSPHORUS SURFACE ROUGHNESS ON BOTH WETTABILITY
AND PORES
FORMATION IN SOLDER JOINTS FOR HIGH POWER ELECTRONIC APPLICATIONS 181
L. VIVET, K. L. TAN, J. M. MORELLE (VALEO, FRANCE); A.-L. JOUDRIER
(INSTITUT LAVOISIER DE VERSAILLES,
FRANCE); A. ETCHEBERRY (INSTITUT LAVOISIER DE VERSAILLES, FRANCE); L.
CHALUMEAU (EGIDE, FRANCE)
P13 CHALLENGES ON DIAGNOSTICS OF POWER ELECTRONICS MODULES AND ASSEMLIES
187
H.-J. ALBRECHT, N. BUSCHE, J. STROGIES, K. WILKE, M. SCHUSTER, C.
CASSIGNIOL (SIEMENS AG,
GERMANY)
P14 SURFACE PROFILES OF PRINTED AG NANOPARTICLE PASTE AND THEIR
IMPLICATION ON THE QUALITY
OF SINTERED JOINTS 193
Y. WANG
1
, J. LI, P. AGYAKWA, C. M. JOHNSON, S. LI (UNIVERSITY OF NOTTINGHAM,
UNITED KINGDOM);
'(CHINA AERO-POLYTECHNOLOGY ESTABLISHMENT, BEIJING, CHINA)
P15 DEVELOPMENTS FOR COPPER-GRAPHITE COMPOSITE THERMAL CORES FOR PCBS
FOR HIGH-
RELIABILITY RF SYSTEMS 200
D. L. SAUMS (DS&A LLC, USA); ROBERT A. HAY (MMCC LLC, USA)
P16 ROBUSTNESS STUDY OF SOLDER JOINTS OF DIFFERENT COMPOSITIONS BY USING
STOCHASTIC FINITE
ELEMENT MODELING 206
Y. AOUES, A. MAKHLOUFI, A. EL-HAMI (INSA-LOFIMS, FRANCE);
P. POUGNET (RELIABILITY EXPERT VALEO, FRANCE)
DIALOG SESSION: RELIABILITY, DESIGN TOOLS
P17 INTERNAL DEGRADATION MONITORING OF POWER DEVICES DURING POWER
CYCLING TEST 213
A. WATANABE, I. OMURA (KYUSHU INSTITUTE OF TECHNOLOGY, JAPAN); M.
TSUKUDA (THE INTERNATIONAL
CENTRE FOR THE STUDY OF EAST ASIAN DEVELOPMENT & KYUSHU INSTITUTE OF
TECHNOLOGY, JAPAN)
P18 CHARACTERIZATION OF DIFFERENT WIRE BONDING MATERIALS DURING PASSIVE
THERMAL TEST 218
F. COSIANSI (POLITECNICO OF TURIN, ITALY); M. TURNATURI, E. MATTIUZZO
(VISHAY SEMICONDUCTOR ITALIANA,
ITALY); S. KOETTER, S. THOMAS (HERAEUS, GERMANY)
P19 MANUFACTURABILITY AND RELIABILITY ASSESSMENT OF POWER SANDWICH
TECHNOLOGY 222
I. JOSIFOVIC, J. POPOVIC-GERBER, B. FERREIRA (DELFT UNIVERSITY OF
TECHNOLOGY, THE NETHERLANDS);
T. HUESGEN, E. MENGOTTI, U. DROFENIK (ABB CORPORATE RESEARCH,
SWITZERLAND)
P20 RELIABILITY PREDICTION APPROACH OF DC-DC CONVERTER WITH ELECTRICAL
STRESS ANALYSIS 228
J. KIM, S. CHOI, K. LEE (KWANGWOON UNIVERSITY, SOUTH KOREA)
P21 A MULTI-DISCIPLINARY VIRTUAL PROTOTYPING DESIGN TOOL FOR POWER
ELECTRONICS 232
P. L. EVANS, A. CASTELLAZZI, C. M. JOHNSON (UNIVERSITY OF NOTTINGHAM,
UNITED KINGDOM)
DIALOG SESSION: WIDE BAND GAP PACKAGING
P22 EVOLUTION OF ELECTRICAL PERFORMANCE IN NEW GENERATION OF SIC MOSFET
FOR HIGH
TEMPERATURE APPLICATIONS 239
R. OUAIDA (UNIVERSITE LYONL & THALES TMI, FRANCE); C. CALVEZ, A.-S.
PODLEJSKI, P. BROSSELARD
(LABORATOIRE AMPERE UMR CNRS 5005, FRANCE)
P23 TECHNOLOGY, INDUSTRY AND MARKET TRENDS IN WBG POWER MODULE PACKAGING
244
P. ROUSSEL, J. AZEMAR (YOLE DEVELOPPEMENT, FRANCE)
P24 NOVEL LAYOUT AND PACKAGING FOR LATERAL, LOW-RESISTANCE GAN-ON-SI
POWER TRANSISTORS 247
R. REINER, P. WALTEREIT, F. BENKHELIFA, H. WALCHER, R. QUAY, M.
SCHLECHTWEG, O. AMBACHER
(FRAUNHOFER INSTITUTE FOR APPLIED SOLID STATE PHYSICS, GERMANY)
P25 HIGH TEMPERATURE DISCRETE INTEGRATED CORELESS SIGNAL INSULATOR 252
D. BERGOGNE (AMPERE LAB, FRANCE); K. EL FALAHI, G. PICUN (X-REL
SEMICONDUCTORS, FRANCE);
H. EZZEDDINE (ST-MICROELECTRONICS, FRANCE); C. MARTIN, B. ALLARD
(UNIVERSITY OF LYON, FRANCE)
C. PINTOUT (ST-MICROELECTRONICS, FRANCE)
P26 INVESTIGATION ON ALCU-CLAD BASE PLATES AND A NEW BY-PASS COOLER
CONCEPT FOR PIN FIN
POWER MODULES 256
A. UHLEMANN, E. HYMON, T. FATH (INFINEON TECHNOLOGIES AG, GERMANY)
P27 LAMINATE WITH THERMAL - POWER INSERT FOR EFFICIENT FRONT-SIDE HEAT
REMOVAL AND
POWER DELIVERY 260
D. GSCHWEND, T. TICK, S. PAREDES, T. BRUNSCHWILER (IBM RESEARCH ZURICH,
SWITZERLAND);
S. OGGIONI (IBM ISC ENG., ITALY); K. MATSUMOTO (IBM-JAPAN, JAPAN); M. K.
TIWARI, D. POULIKAKOS
(ETH ZURICH, SWITZERLAND)
P28 A SIMPLE METHOD TO EVALUATE SUBSTRATE LAYOUT FOR POWER MODULES 267
NAN ZHU, MIN CHEN, DEHONG XU (ZHEJIANG UNIVERSITY, P.R. CHINA)
P29 PLANAR, DOUBLE-LAYER MAGNETIC INDUCTORS FOR LOW POWER, HIGH
FREQUENCY DC-DC
CONVERTERS 273
ELIAS HADDAD (UNIVERSITY LYON 1, FRANCE); CHRISTIAN MARTIN (UNIVERSITY
LYON 1, FRANCE); CHARLES
JOUBERT (UNIVERSITY LYON 1, FRANCE); BRUNO ALLARD (INSA LYON, FRANCE);
CYRIL BUTTAY (INSA LYON,
FRANCE); TONY ABI TANNOUS (INSA LYON, FRANCE); PASCAL BEVILACQUA (INSA
LYON, FRANCE)
SESSION 5: INVERTERS, CONVERTERS
5.1 POWER SUPPLY WITH INTEGRATED PASSIVES THE EU FP7 POWER SWIPE PROJECT
(INVITED) 278
C. O. MATHUNA, N. WANG, S. KULKARNI, R. ANTHONY, N. CORDERO (UNIVERSITY
COLLEGE CORK, IRELAND);
J. OLIVER, V. SVIKOVIC, J. ANTONIO COBOS, J. CORTES (UNIVERSIDAD
POLITECNICA DE MADRID, SPAIN);
F. NEVEU, C. MARTIN, B. ALLARD (AMPERE LAB-UMR CNRS, FRANCE); F. VOIRON
(IPDIA, FRANCE);
B. KNOTT, C. SANDNER, G. MADERBACHER, J. PICHLER, M. AGOSTINELLI, A.
ANCA (INFINEON TECHNOLOGIES
AG, AUSTRIA); M. BREIG (BOSCH TECHNOLOGIES, GERMANY)
5.2 REVIEW OF HIGH FREQUENCY, HIGHLY INTEGRATED INDUCTIVE DC-DC
CONVERTERS 285
F. NEVEU, C. MARTIN, B. ALLARD (INSA LYON, FRANCE)
5.3 LOW-INDUCTIVE INVERTER CONCEPT BY 200A / 1200V HALF BRIDGE IN
EASYPACK 2B -
FOLLOWING STRIP-LINE DESIGN 292
C. R. MIILLER, R. BAYERER (INFINEON TECHNOLOGIES AG, GERMANY)
5.4 LOSSES COMPARISON OF GALLIUM NITRIDE AND SILICON TRANSISTORS IN A
HIGH FREQUENCY
BOOST CONVERTER 298
W. WANG, S. DE HAAN, B. FERREIRA (DELFT UNIVERSITY OF TECHNOLOGY, THE
NETHERLANDS);
F. PANSIER (NXP SEMICONDUCTORS, THE NETHERLANDS)
SESSION 6: INTERFACES AND SUBSTRATES
6.1 PRACTICAL ASPECTS OF TESTING METHODS FOR THERMAL INTERFACE MATERIALS
(INVITED) 304
D. SAUMS (DS&A LLC, USA)
6.2 HIGH TEMPERATURE COMPATIBILITY OF INTERFACE BETWEEN A1 RIBBON AND AU
FINISHED
DBC SUBSTRATE 319
S. PARK,
S. NAGAO, K. SUGANUMA (OSAKA UNIVERSITY, JAPAN)
6.3 IMPROVED THERMAL CYCLING RELIABILITY OF ZTA (ZIRCONIA TOUGHENED
ALUMINA) DBC
SUBSTRATES BY MANIPULATING METALLIZATION PROPERTIES 322
J. PARK, A. ROTH (KCC EUROPE GMBH, GERMANY)
6.4 3D PACKAGING FOR VERTICAL POWER DEVICES 331
N. ROUGER, J.-C. CREBIER (UNIVERSITE GRENOBLE ALPES, G2ELAB CNRS,
FRANCE);
J. WIDIEZ, L. BENAISSA, B. IMBERT, P. GONDCHARTON (CEA LETI, FRANCE);
SESSION 7: INVERTERS, CONVERTERS, DRIVERS
7.1 SCALABLE HIGH FREQUENCY CONVERTERS FOR DRIVERS BASED ON SWITCHING
CELLS
M. SCHULZ, F. KAPAUN, R. MARQUARDT (UNIVERSITAT DER BUNDESWEHR MUNCHCN,
GERMANY)
337
7.2 FLEXIBLE SWITCHING SPEED CONTROL TO IMPROVE SWITCHING LOSSES AND EMI
BY A GATE DRIVER
WITH ADJUSTABLE GATE CURRENT 342
J. BAUCH (OTTO-VON-GUERICKE-UNIVERSITY MAGDEBURG, GERMANY); A. LINDEMANN
(UNIVERSITY
OF MAGDEBURG, GERMANY); A. ARENS, P. KANSCHAT (INFINEON TECHNOLOGIES AG,
GERMANY)
7.3 INTEGRATED GATE DRIVER CIRCUITS WITH AN ULTRA-COMPACT DESIGN AND
HIGH LEVEL OF GALVANIC
ISOLATION FOR POWER TRANSISTORS 348
D. TO, Y. LEMBEYE, N. ROUGER, J.-D. ARNOULD, N. CORRAO (UNIVERSITE
GRENOBLE ALPES, FRANCE)
7.4 CONTROLLING OF POWER ELECTRONIC MODULES BY A 2-WIRE-CONNECTION WITH
COMBINED SIGNAL
AND POWER TRANSFER 354
S. ENDRES (LEB UNI ERLANGEN, GERMANY); S. ZELTNER (FRAUNHOFER IISB,
GERMANY)
SESSION 8: INTERCONNECTS
8.1 FOIL BASED TRANSIENT LIQUID PHASE BONDING AS A DIE-ATTACHMENT METHOD
FOR HIGH
TEMPERATURE DEVICES 359
A. A. BAJWA, Y. QIN, J. WILDE (UNIVERSITY OF FREIBURG, GERMANY)
8.2 PARTIAL TRANSIENT LIQUID PHASE BONDING FOR HIGH-TEMPERATURE POWER
ELECTRONICS USING
SN/ZN/SN SANDWICH STRUCTURE SOLDER 365
S. PARK, S. NAGAO, T. SUGAHARA, K. SUGANUMA (OSAKA UNIVERSITY, JAPAN);
Y. KATOH, H. ISHINO,
K. SUGIURA (DENSO CORPORATION, JAPAN)
8.3 APPLICATION OF SILVER NANO PARTICLE TO PRESSURELESS BONDING ONTO A
COPPER SURFACE -
CONSIDERATION OF SUBSTITUTE MATERIAL FOR LEAD SOLDER 371
S. KURITA, H. MIYOSHI, S. KURITA (DOWA ELECTRONICS MATERIALS, JAPAN)
8.4 RELIABILITY OF SN BASED LT-TLPS JOINTS FOR HIGH TEMPERATURE
ELECTRONIC SYSTEMS 376
H. GREVE, P. MCCLUSKEY (UNIVERSITY OF MARYLAND, USA)
8.5 IS CONDUCTIVE ADHESIVE BONDING SUITED FOR THE DIE-ATTACHMENT OF
POWER DEVICES? 382
J. WILDE, J. OCKLENBURG (UNIVERSITY OF FREIBURG, GERMANY); E. RASTJAGAEV
(INFINEON TECHNOLOGIES
AG, AUSTRIA)
SESSION 9: OVERVIEW: EMI: RENEWABLES, SENSORS
9.1 CONDUCTED EMI AND SYSTEMS INTEGRATION (INVITED) 388
D. BOROYEVICH, X. ZHANG, R. BURGOS (CPES, USA); H. BISHINOI (ABB,
SWITZERLAND);
P. MATTAVELLI (DTG, ITALY); F. WANG (CURENT, USA)
9.2 POWER ELECTRONICS FOR RENEWABLE ENERGY SYSTEMS - STATUS AND TRENDS
(INVITED) 402
F. BLAABJERG, K. MA, Y. YANG (AALBORG UNIVERSITY, DENMARK)
9.3 NEW APPLICATIONS IN POWER ELECTRONICS FOR HIGHLY INTEGRATED
HIGH-SPEED MAGNETO-RESISTIVE
CURRENT SENSORS (INVITED) 413
S. SCHEMER, R. SLATTER (SENSITEC GMBH, GERMANY)
9.4
SYSTEM INTEGRATION OF GAN CONVERTERS - PARADIGM SHIFT, CHALLENGES AND
OPPORTUNITIES 420
J. POPOVIC, B. FERREIRA (DELFT UNIVERSITY OF TECHNOLOGY, THE
NETHERLANDS);
J. DAAN VAN WYK (UNIVERSITY OF JOHANNESBURG, SOUTH AFRICA)
SESSION 10: LIFETIME AND ROBUSTNESS
10.1 EFFICIENT ONLINE-ALGORITHM FOR THE TEMPERATURE-CYCLE RECORDING OF
AN IGBT POWER
MODULE IN A HYBRID CAR DURING INVERTER OPERATION 428
M. DENK, M. BAKRAN (UNIVERSITY OF BAYREUTH, GERMANY)
10.2 ANALYZING THE STATE OF HEALTH OF DIODE LAYERS BY USING STRUCTURE
FUNCTIONS 434
M. RICHTER (CHEMNITZ UNIVERSITY OF TECHNOLOGY & ROBERT BOSCH GMBH,
GERMANY); M. KOPP,
R. SCHROTH (ROBERT BOSCH GMBH, GERMANY); J. LUTZ (CHEMNITZ UNIVERSITY OF
TECHNOLOGY,
GERMANY)
10.3 ELECTRO - THERMAL SIMULATIONS AND EXPERIMENTAL RESULTS ON THE SURGE
CURRENT CAPABILITY
OF 1200 V SIC MPS DIODES 438
S. FICHTNER, J. LUTZ, T. BASLER (CHEMNITZ UNIVERSITY OF TECHNOLOGY,
GERMANY);
R. RUPP, R. GERLACH (INFINEON TECHNOLOGIES AG, GERMANY)
10.4 A NEW RAINFLOW - FREE METHOD TO TRANSFER IRREGULAR LOAD MISSION
PROFILE DATA INTO
APPROPRIATE LAB TEST CONDITIONS FOR DESIGN OPTIMIZATION 444
A. AAL (VOLKSWAGEN AG, GERMANY)
SESSION 11: POWER MODULES
11.1 POWER MODULES WITH INCREASED POWER DENSITY AND RELIABILITY USING CU
WIRE BONDS ON
SINTERED METAL BUFFER LAYERS 450
J. RUDZKI, F. OSTERWALD (DANFOSS SILICON POWER GMBH, GERMANY); M.
BECKER, R. EISELE
(FH KIEL, GERMANY); M. POECH (FRAUNHOFER INSTITUT FUR
SILIZIUMTECHNOLOGIE, GERMANY)
11.2 NEW POWER-MODULE STRUCTURES CONSISTING OF BOTH CU AND A1 BONDED TO
A1N SUBSTRATES
WITH AN A1 BASE PLATE 456
N. TERASAKI, Y. NAGATOMO, T. NAGASE, Y. KUROMITSU (MITSUBISHI MATERIALS
CORPORATION, JAPAN)
11.3 BREAKTHROUGH INTO THE THIRD DIMENSION - SINTERED MULTI LAYER FLEX
FOR ULTRA LOW INDUCTANCE
POWER MODULES 461
P. BECKEDAHL, M. SPANG, O. TAMM (SEMIKRON ELEKTRONIK GMBH & CO. KG,
GERMANY)
SESSION 12: WIDE BAND GAP (1)
12.1 INFLUENCE OF CU/NI(P) METALLIZED SI
3
N
4
CERAMIC SUBSTRATE IN BOND RELIABILITY OF POWER
COMPONENTS AT 250 C 466
F. LANG (R&D PARTNERSHIP FOR FUTURE POWER ELECTRONICS TECHNOLOGY,
JAPAN); H. YAMAGUCHI,
H. NAKAGAWA, H. SATO (R&D PARTNERSHIP FOR FUTURE POWER ELECTRONICS
TECHNOLOGY, JAPAN;
ADVANCED POWER ELECTRONICS RESEARCH CENTER, AIST, TSUKUBA, IBARAKI,
JAPAN)
12.2 DCB-BASED LOW-INDUCTIVE SIC MODULES FOR HIGH FREQUENCY OPERATION
472
M. MEISSER (KARLSRUHE INSTITUTE OF TECHNOLOGY & INSTITUTE FOR DATA
PROCESSING AND ELECTRONICS,
GERMANY); D. HAMILTON, P. MAWBY (UNIVERSITY OF WARWICK, UNITED KINGDOM)
12.3 1200 V-360 A SIC POWER MODULE WITH PHASE LEG CLUSTERING CONCEPT FOR
LOW PARASITIC
INDUCTANCE AND HIGH SPEED SWITCHING 482
K. TAKAO, T^ SHINOHE, T. YAMAMOTO, K. HASEGAWA, M. ISHIDA (TOSHIBA
CORPORATION, JAPAN)
12.4 COMPARISON OF THERMO-MECHANICAL RELIABILITY OF HIGH-TEMPERATURE
BONDING MATERIALS
FOR ATTACHMENT OF SIC DEVICES 489
J. LI, I. YAQUB, M. CORFIELD, P. A. AGYAKWA, C. M. JOHNSON (UNIVERSITY
OF NOTTINGHAM, UNITED
KINGDOM)
12.5 ROBUST TOP SIDE CONTACT TECHNOLOGY ON POWER SEMICONDUCTORS -
RESULTS FROM THE
PUBLIC FUNDED PROJECT ,PRO POWER' 496
M. RITTNER, D. GROSS, M. GUYENOT, M. GIINTHER, S. HAAG, T. KADEN, M.
REINHOLD (ROBERT BOSCH
GMBH, GERMANY); M. THOBEN (INFINEON TECHNOLOGIES AG, GERMANY); S.
STEGMEIER, K. WEIDNER
(SIEMENS AG, GERMANY); M. KOCK (DANFOSS SILICON POWER GMBH, GERMANY)
SESSION 13: WIDE BAND GAP (2)
13.1 PACKAGING VERY FAST SWITCHING SEMICONDUCTORS (INVITED) 502
E. HOENE, A. OSTMANN, C. MARCZOK (FRAUNHOFER IZM, GERMANY)
13.2 MULTI-CHIP CIRCUIT DESIGN FOR SILICON CARBIDE POWER ELECTRONICS
(INVITED) 509
H.-P. NEE, D. PEFTITSIS (KTH ROYAL INSTITUTE OF TECHNOLOGY, SWEDEN); J.
RABKOWSKI (WARSAW
UNIVERSITY OF TECHNOLOGY, POLAND)
13.3 KEYNOTE: PRESENT AND FUTURE OF GAN POWER DEVICES 519
D. UEDA, T. FUKUDA, S. NAGAI, H. SAKAI, N. OTSUKA, T. MORITA, N. NEGORO,
T. UEDA, T. TANAKA
(PANASONIC, JAPAN)
V |
| any_adam_object | 1 |
| author_corporate | CIPS Nürnberg |
| author_corporate_role | aut |
| author_facet | CIPS Nürnberg |
| author_sort | CIPS Nürnberg |
| building | Verbundindex |
| bvnumber | BV041745772 |
| classification_rvk | ZN 8100 ZN 8340 |
| ctrlnum | (OCoLC)915430800 (DE-599)DNB1047554232 |
| dewey-full | 621.3815 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3815 |
| dewey-search | 621.3815 |
| dewey-sort | 3621.3815 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Maschinenbau / Maschinenwesen Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Conference Proceeding Book |
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| id | DE-604.BV041745772 |
| illustrated | Illustrated |
| indexdate | 2025-03-13T04:01:04Z |
| institution | BVB |
| institution_GND | (DE-588)1048652505 (DE-588)2117441-6 |
| isbn | 9783800735785 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-027192270 |
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| owner | DE-83 DE-862 DE-BY-FWS |
| owner_facet | DE-83 DE-862 DE-BY-FWS |
| physical | 522 S. Ill. 1 CD-ROM (12 cm) |
| publishDate | 2014 |
| publishDateSearch | 2014 |
| publishDateSort | 2014 |
| publisher | VDE Verl. |
| record_format | marc |
| series | ETG-Fachbericht |
| series2 | ETG-Fachbericht |
| spellingShingle | CIPS 2014 8th International Conference on Integrated Power Electronics Systems ; proceedings ; February, 25 - 27, 2014, Nuremberg, Germany ETG-Fachbericht Schaltungsentwurf (DE-588)4179389-4 gnd Verbindungstechnik (DE-588)4129183-9 gnd Zuverlässigkeit (DE-588)4059245-5 gnd Leistungselektronik (DE-588)4035235-3 gnd Leistungshalbleiter (DE-588)4167286-0 gnd |
| subject_GND | (DE-588)4179389-4 (DE-588)4129183-9 (DE-588)4059245-5 (DE-588)4035235-3 (DE-588)4167286-0 (DE-588)1071861417 (DE-588)4139307-7 |
| title | CIPS 2014 8th International Conference on Integrated Power Electronics Systems ; proceedings ; February, 25 - 27, 2014, Nuremberg, Germany |
| title_auth | CIPS 2014 8th International Conference on Integrated Power Electronics Systems ; proceedings ; February, 25 - 27, 2014, Nuremberg, Germany |
| title_exact_search | CIPS 2014 8th International Conference on Integrated Power Electronics Systems ; proceedings ; February, 25 - 27, 2014, Nuremberg, Germany |
| title_full | CIPS 2014 8th International Conference on Integrated Power Electronics Systems ; proceedings ; February, 25 - 27, 2014, Nuremberg, Germany organized by: ETG, The Power Engineering Society within VDE ... |
| title_fullStr | CIPS 2014 8th International Conference on Integrated Power Electronics Systems ; proceedings ; February, 25 - 27, 2014, Nuremberg, Germany organized by: ETG, The Power Engineering Society within VDE ... |
| title_full_unstemmed | CIPS 2014 8th International Conference on Integrated Power Electronics Systems ; proceedings ; February, 25 - 27, 2014, Nuremberg, Germany organized by: ETG, The Power Engineering Society within VDE ... |
| title_short | CIPS 2014 |
| title_sort | cips 2014 8th international conference on integrated power electronics systems proceedings february 25 27 2014 nuremberg germany |
| title_sub | 8th International Conference on Integrated Power Electronics Systems ; proceedings ; February, 25 - 27, 2014, Nuremberg, Germany |
| topic | Schaltungsentwurf (DE-588)4179389-4 gnd Verbindungstechnik (DE-588)4129183-9 gnd Zuverlässigkeit (DE-588)4059245-5 gnd Leistungselektronik (DE-588)4035235-3 gnd Leistungshalbleiter (DE-588)4167286-0 gnd |
| topic_facet | Schaltungsentwurf Verbindungstechnik Zuverlässigkeit Leistungselektronik Leistungshalbleiter Konferenzschrift 2014 Nürnberg CD-ROM |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=027192270&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| volume_link | (DE-604)BV008287330 |
| work_keys_str_mv | AT cipsnurnberg cips20148thinternationalconferenceonintegratedpowerelectronicssystemsproceedingsfebruary25272014nuremberggermany AT energietechnischegesellschaftdeutschland cips20148thinternationalconferenceonintegratedpowerelectronicssystemsproceedingsfebruary25272014nuremberggermany |
Inhaltsverzeichnis
THWS Schweinfurt Zentralbibliothek Lesesaal
| Signatur: |
2000 ZN 8340 C577 |
|---|---|
| Exemplar 1 | ausleihbar Verfügbar Bestellen |