Design and Modeling for 3D ICs and Interposers:
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Singapore
World Scientific
2014
|
| Schriftenreihe: | WSPC series in advanced integration and packaging
2 |
| Schlagworte: | |
| Beschreibung: | XXI, 354 S. Ill., graph. Darst. 24 cm |
| ISBN: | 9789814508599 9814508594 |
Internformat
MARC
| LEADER | 00000nam a2200000 cb4500 | ||
|---|---|---|---|
| 001 | BV041619843 | ||
| 003 | DE-604 | ||
| 005 | 20140220 | ||
| 007 | t | ||
| 008 | 140203s2014 ad|| |||| 00||| eng d | ||
| 020 | |a 9789814508599 |c Geb. : £ 84.00 |9 978-981-450859-9 | ||
| 020 | |a 9814508594 |9 981-450859-4 | ||
| 035 | |a (OCoLC)873430685 | ||
| 035 | |a (DE-599)GBV770160298 | ||
| 040 | |a DE-604 |b ger | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-706 | ||
| 100 | 1 | |a Swaminathan, Madhavan |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Design and Modeling for 3D ICs and Interposers |c Madhavan Swaminathan ; Ki Jin Han |
| 264 | 1 | |a Singapore |b World Scientific |c 2014 | |
| 300 | |a XXI, 354 S. |b Ill., graph. Darst. |c 24 cm | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 1 | |a WSPC series in advanced integration and packaging |v 2 | |
| 650 | 0 | 7 | |a Dreidimensionale Integration |0 (DE-588)4218841-6 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Integrierte Schaltung |0 (DE-588)4027242-4 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Integrierte Schaltung |0 (DE-588)4027242-4 |D s |
| 689 | 0 | 1 | |a Dreidimensionale Integration |0 (DE-588)4218841-6 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Han, Ki Jin |e Verfasser |4 aut | |
| 830 | 0 | |a WSPC series in advanced integration and packaging |v 2 |w (DE-604)BV041357980 |9 2 | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-027060896 | ||
Datensatz im Suchindex
| _version_ | 1804151829880111104 |
|---|---|
| any_adam_object | |
| author | Swaminathan, Madhavan Han, Ki Jin |
| author_facet | Swaminathan, Madhavan Han, Ki Jin |
| author_role | aut aut |
| author_sort | Swaminathan, Madhavan |
| author_variant | m s ms k j h kj kjh |
| building | Verbundindex |
| bvnumber | BV041619843 |
| ctrlnum | (OCoLC)873430685 (DE-599)GBV770160298 |
| format | Book |
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| id | DE-604.BV041619843 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T01:01:03Z |
| institution | BVB |
| isbn | 9789814508599 9814508594 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-027060896 |
| oclc_num | 873430685 |
| open_access_boolean | |
| owner | DE-706 |
| owner_facet | DE-706 |
| physical | XXI, 354 S. Ill., graph. Darst. 24 cm |
| publishDate | 2014 |
| publishDateSearch | 2014 |
| publishDateSort | 2014 |
| publisher | World Scientific |
| record_format | marc |
| series | WSPC series in advanced integration and packaging |
| series2 | WSPC series in advanced integration and packaging |
| spelling | Swaminathan, Madhavan Verfasser aut Design and Modeling for 3D ICs and Interposers Madhavan Swaminathan ; Ki Jin Han Singapore World Scientific 2014 XXI, 354 S. Ill., graph. Darst. 24 cm txt rdacontent n rdamedia nc rdacarrier WSPC series in advanced integration and packaging 2 Dreidimensionale Integration (DE-588)4218841-6 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 s Dreidimensionale Integration (DE-588)4218841-6 s DE-604 Han, Ki Jin Verfasser aut WSPC series in advanced integration and packaging 2 (DE-604)BV041357980 2 |
| spellingShingle | Swaminathan, Madhavan Han, Ki Jin Design and Modeling for 3D ICs and Interposers WSPC series in advanced integration and packaging Dreidimensionale Integration (DE-588)4218841-6 gnd Integrierte Schaltung (DE-588)4027242-4 gnd |
| subject_GND | (DE-588)4218841-6 (DE-588)4027242-4 |
| title | Design and Modeling for 3D ICs and Interposers |
| title_auth | Design and Modeling for 3D ICs and Interposers |
| title_exact_search | Design and Modeling for 3D ICs and Interposers |
| title_full | Design and Modeling for 3D ICs and Interposers Madhavan Swaminathan ; Ki Jin Han |
| title_fullStr | Design and Modeling for 3D ICs and Interposers Madhavan Swaminathan ; Ki Jin Han |
| title_full_unstemmed | Design and Modeling for 3D ICs and Interposers Madhavan Swaminathan ; Ki Jin Han |
| title_short | Design and Modeling for 3D ICs and Interposers |
| title_sort | design and modeling for 3d ics and interposers |
| topic | Dreidimensionale Integration (DE-588)4218841-6 gnd Integrierte Schaltung (DE-588)4027242-4 gnd |
| topic_facet | Dreidimensionale Integration Integrierte Schaltung |
| volume_link | (DE-604)BV041357980 |
| work_keys_str_mv | AT swaminathanmadhavan designandmodelingfor3dicsandinterposers AT hankijin designandmodelingfor3dicsandinterposers |