Electromigration modeling at circuit layout level:
Gespeichert in:
1. Verfasser: | |
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Format: | Elektronisch E-Book |
Sprache: | English |
Veröffentlicht: |
Singapore[u.a.]
Springer
2013
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Schriftenreihe: | SpringerBriefs in applied sciences and technology
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Schlagworte: | |
Online-Zugang: | BTU01 FHA01 FHI01 FHN01 FHR01 FKE01 FWS01 UBY01 Volltext Inhaltsverzeichnis Abstract |
Beschreibung: | 1 Online-Ressource |
ISBN: | 9789814451215 |
DOI: | 10.1007/978-981-4451-21-5 |
Internformat
MARC
LEADER | 00000nmm a2200000 c 4500 | ||
---|---|---|---|
001 | BV041155931 | ||
003 | DE-604 | ||
005 | 00000000000000.0 | ||
007 | cr|uuu---uuuuu | ||
008 | 130719s2013 |||| o||u| ||||||eng d | ||
020 | |a 9789814451215 |c Online |9 978-981-445121-5 | ||
024 | 7 | |a 10.1007/978-981-4451-21-5 |2 doi | |
035 | |a (OCoLC)843456565 | ||
035 | |a (DE-599)BSZ381117499 | ||
040 | |a DE-604 |b ger | ||
041 | 0 | |a eng | |
049 | |a DE-898 |a DE-634 |a DE-573 |a DE-92 |a DE-Aug4 |a DE-859 |a DE-706 |a DE-863 | ||
050 | 0 | |a TA169.7 | |
050 | 0 | |a T55-T55.3 | |
050 | 0 | |a TA403.6 | |
082 | 0 | |a 658.56 | |
100 | 1 | |a Tan, Cher Ming |e Verfasser |4 aut | |
245 | 1 | 0 | |a Electromigration modeling at circuit layout level |c Cher Ming Tan ; Feifei He |
264 | 1 | |a Singapore[u.a.] |b Springer |c 2013 | |
300 | |a 1 Online-Ressource | ||
336 | |b txt |2 rdacontent | ||
337 | |b c |2 rdamedia | ||
338 | |b cr |2 rdacarrier | ||
490 | 0 | |a SpringerBriefs in applied sciences and technology | |
650 | 4 | |a Ingenieurwissenschaften | |
650 | 4 | |a System safety | |
650 | 4 | |a Engineering | |
700 | 1 | |a He, Feifei |e Sonstige |4 oth | |
776 | 0 | 8 | |i Erscheint auch als |n Druckausgabe |z 978-981-445120-8 |
856 | 4 | 0 | |u https://doi.org/10.1007/978-981-4451-21-5 |x Verlag |3 Volltext |
856 | 4 | 2 | |m Springer Fremddatenuebernahme |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=026131300&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |3 Inhaltsverzeichnis |
856 | 4 | 2 | |m Springer Fremddatenuebernahme |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=026131300&sequence=000003&line_number=0002&func_code=DB_RECORDS&service_type=MEDIA |3 Abstract |
912 | |a ZDB-2-ENG | ||
999 | |a oai:aleph.bib-bvb.de:BVB01-026131300 | ||
966 | e | |u https://doi.org/10.1007/978-981-4451-21-5 |l BTU01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
966 | e | |u https://doi.org/10.1007/978-981-4451-21-5 |l FHA01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
966 | e | |u https://doi.org/10.1007/978-981-4451-21-5 |l FHI01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
966 | e | |u https://doi.org/10.1007/978-981-4451-21-5 |l FHN01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
966 | e | |u https://doi.org/10.1007/978-981-4451-21-5 |l FHR01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
966 | e | |u https://doi.org/10.1007/978-981-4451-21-5 |l FKE01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
966 | e | |u https://doi.org/10.1007/978-981-4451-21-5 |l FWS01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
966 | e | |u https://doi.org/10.1007/978-981-4451-21-5 |l UBY01 |p ZDB-2-ENG |x Verlag |3 Volltext |
Datensatz im Suchindex
DE-BY-FWS_katkey | 922864 |
---|---|
_version_ | 1806194901707128832 |
adam_text | ELECTROMIGRATION MODELING AT CIRCUIT LAYOUT LEVEL
/ TAN, CHER MING
: 2013
TABLE OF CONTENTS / INHALTSVERZEICHNIS
INTRODUCTION
3D CIRCUIT MODEL CONSTRUCTION AND SIMULATION
COMPARISON OF EM PERFORMANCE IN CIRCUIT STRUCTURE AND TEST STRUCTURE
INTERCONNECT EM RELIABILITY MODELING AT CIRCUIT LAYOUT LEVEL
CONCLUSION
DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT.
ELECTROMIGRATION MODELING AT CIRCUIT LAYOUT LEVEL
/ TAN, CHER MING
: 2013
ABSTRACT / INHALTSTEXT
INTEGRATED CIRCUIT (IC) RELIABILITY IS OF INCREASING CONCERN IN
PRESENT-DAY IC TECHNOLOGY WHERE THE INTERCONNECT FAILURES SIGNIFICANTLY
INCREASES THE FAILURE RATE FOR ICS WITH DECREASING INTERCONNECT
DIMENSION AND INCREASING NUMBER OF INTERCONNECT LEVELS.
ELECTROMIGRATION (EM) OF INTERCONNECTS HAS NOW BECOME THE DOMINANT
FAILURE MECHANISM THAT DETERMINES THE CIRCUIT RELIABILITY. THIS BRIEF
ADDRESSES THE READERS TO THE NECESSITY OF 3D REAL CIRCUIT MODELLING IN
ORDER TO EVALUATE THE EM OF INTERCONNECT SYSTEM IN ICS, AND HOW THEY CAN
CREATE SUCH MODELS FOR THEIR OWN APPLICATIONS. A 3-DIMENSIONAL (3D)
ELECTRO-THERMO-STRUCTURAL MODEL AS OPPOSED TO THE CONVENTIONAL CURRENT
DENSITY BASED 2-DIMENSIONAL (2D) MODELS IS PRESENTED AT CIRCUIT-LAYOUT
LEVEL.
DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT.
|
any_adam_object | 1 |
author | Tan, Cher Ming |
author_facet | Tan, Cher Ming |
author_role | aut |
author_sort | Tan, Cher Ming |
author_variant | c m t cm cmt |
building | Verbundindex |
bvnumber | BV041155931 |
callnumber-first | T - Technology |
callnumber-label | TA169 |
callnumber-raw | TA169.7 T55-T55.3 TA403.6 |
callnumber-search | TA169.7 T55-T55.3 TA403.6 |
callnumber-sort | TA 3169.7 |
callnumber-subject | TA - General and Civil Engineering |
collection | ZDB-2-ENG |
ctrlnum | (OCoLC)843456565 (DE-599)BSZ381117499 |
dewey-full | 658.56 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 658 - General management |
dewey-raw | 658.56 |
dewey-search | 658.56 |
dewey-sort | 3658.56 |
dewey-tens | 650 - Management and auxiliary services |
discipline | Wirtschaftswissenschaften |
doi_str_mv | 10.1007/978-981-4451-21-5 |
format | Electronic eBook |
fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02571nmm a2200529 c 4500</leader><controlfield tag="001">BV041155931</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">130719s2013 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9789814451215</subfield><subfield code="c">Online</subfield><subfield code="9">978-981-445121-5</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-981-4451-21-5</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)843456565</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BSZ381117499</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-898</subfield><subfield code="a">DE-634</subfield><subfield code="a">DE-573</subfield><subfield code="a">DE-92</subfield><subfield code="a">DE-Aug4</subfield><subfield code="a">DE-859</subfield><subfield code="a">DE-706</subfield><subfield code="a">DE-863</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">TA169.7</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">T55-T55.3</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">TA403.6</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">658.56</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Tan, Cher Ming</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Electromigration modeling at circuit layout level</subfield><subfield code="c">Cher Ming Tan ; Feifei He</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Singapore[u.a.]</subfield><subfield code="b">Springer</subfield><subfield code="c">2013</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">SpringerBriefs in applied sciences and technology</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Ingenieurwissenschaften</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">System safety</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">He, Feifei</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druckausgabe</subfield><subfield code="z">978-981-445120-8</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-981-4451-21-5</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">Springer Fremddatenuebernahme</subfield><subfield code="q">application/pdf</subfield><subfield code="u">http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=026131300&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA</subfield><subfield code="3">Inhaltsverzeichnis</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">Springer Fremddatenuebernahme</subfield><subfield code="q">application/pdf</subfield><subfield code="u">http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=026131300&sequence=000003&line_number=0002&func_code=DB_RECORDS&service_type=MEDIA</subfield><subfield code="3">Abstract</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-ENG</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-026131300</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-4451-21-5</subfield><subfield code="l">BTU01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-4451-21-5</subfield><subfield code="l">FHA01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-4451-21-5</subfield><subfield code="l">FHI01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-4451-21-5</subfield><subfield code="l">FHN01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-4451-21-5</subfield><subfield code="l">FHR01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-4451-21-5</subfield><subfield code="l">FKE01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-4451-21-5</subfield><subfield code="l">FWS01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-4451-21-5</subfield><subfield code="l">UBY01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
id | DE-604.BV041155931 |
illustrated | Not Illustrated |
indexdate | 2024-08-01T16:14:46Z |
institution | BVB |
isbn | 9789814451215 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-026131300 |
oclc_num | 843456565 |
open_access_boolean | |
owner | DE-898 DE-BY-UBR DE-634 DE-573 DE-92 DE-Aug4 DE-859 DE-706 DE-863 DE-BY-FWS |
owner_facet | DE-898 DE-BY-UBR DE-634 DE-573 DE-92 DE-Aug4 DE-859 DE-706 DE-863 DE-BY-FWS |
physical | 1 Online-Ressource |
psigel | ZDB-2-ENG |
publishDate | 2013 |
publishDateSearch | 2013 |
publishDateSort | 2013 |
publisher | Springer |
record_format | marc |
series2 | SpringerBriefs in applied sciences and technology |
spellingShingle | Tan, Cher Ming Electromigration modeling at circuit layout level Ingenieurwissenschaften System safety Engineering |
title | Electromigration modeling at circuit layout level |
title_auth | Electromigration modeling at circuit layout level |
title_exact_search | Electromigration modeling at circuit layout level |
title_full | Electromigration modeling at circuit layout level Cher Ming Tan ; Feifei He |
title_fullStr | Electromigration modeling at circuit layout level Cher Ming Tan ; Feifei He |
title_full_unstemmed | Electromigration modeling at circuit layout level Cher Ming Tan ; Feifei He |
title_short | Electromigration modeling at circuit layout level |
title_sort | electromigration modeling at circuit layout level |
topic | Ingenieurwissenschaften System safety Engineering |
topic_facet | Ingenieurwissenschaften System safety Engineering |
url | https://doi.org/10.1007/978-981-4451-21-5 http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=026131300&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=026131300&sequence=000003&line_number=0002&func_code=DB_RECORDS&service_type=MEDIA |
work_keys_str_mv | AT tancherming electromigrationmodelingatcircuitlayoutlevel AT hefeifei electromigrationmodelingatcircuitlayoutlevel |