Verfügbarkeit: Advanced flip chip packaging

Advanced flip chip packaging:

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Bibliographische Detailangaben
Weitere Verfasser:	Tong, Ho-Ming (HerausgeberIn)
Format:	Elektronisch E-Book
Sprache:	English
Veröffentlicht:	New York, NY [u.a.] Springer 2013
Schlagworte:	Ingenieurwissenschaften Electronics Systems engineering Optical materials Engineering Halbleiter Flip-Chip-Technologie
Online-Zugang:	BTU01 FHA01 FHI01 FHN01 FHR01 FKE01 FWS01 UBY01 Volltext Inhaltsverzeichnis Abstract
Beschreibung:	1 Online-Ressource
ISBN:	9781441957689
DOI:	10.1007/978-1-4419-5768-9

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MARC


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Datensatz im Suchindex

DE-BY-FWS_katkey	922627
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adam_text	ADVANCED FLIP CHIP PACKAGING / : 2013 TABLE OF CONTENTS / INHALTSVERZEICHNIS FLIP CHIP TECHNOLOGY OVERVIEW AND EARLY BEGINNINGS TECHNOLOGY TRENDS OF FLIP CHIP BUMPING TECHNOLOGIES FLIP-CHIP INTERCONNECTIONS: PAST, PRESENT AND FUTURE UNDERFILL CONDUCTIVE ADHESIVES FOR FLIP CHIP APPLICATIONS ENABLING SUBSTRATE TECHNOLOGIES: PAST, PRESENT AND FUTURE IC-PACKAGE-SYSTEM INTEGRATED DESIGN THERMAL MANAGEMENT OF FLIP CHIP PACKAGES THERMO-MECHANICAL RELIABILITY IN FLIP CHIP PACKAGES INTERFACIAL REACTIONS AND ELECTROMIGRATION IN FLIP-CHIP SOLDER JOINTS DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT. ADVANCED FLIP CHIP PACKAGING / : 2013 ABSTRACT / INHALTSTEXT ADVANCED FLIP CHIP PACKAGING PRESENTS PAST, PRESENT AND FUTURE ADVANCES AND TRENDS IN AREAS SUCH AS SUBSTRATE TECHNOLOGY, MATERIAL DEVELOPMENT, AND ASSEMBLY PROCESSES. FLIP CHIP PACKAGING IS NOW IN WIDESPREAD USE IN COMPUTING, COMMUNICATIONS, CONSUMER AND AUTOMOTIVE ELECTRONICS, AND THE DEMAND FOR FLIP CHIP TECHNOLOGY IS CONTINUING TO GROW IN ORDER TO MEET THE NEED FOR PRODUCTS THAT OFFER BETTER PERFORMANCE, ARE SMALLER, AND ARE ENVIRONMENTALLY SUSTAINABLE. THIS BOOK ALSO: OFFERS BROAD-RANGING CHAPTERS WITH A FOCUS ON IC-PACKAGE-SYSTEM INTEGRATION PROVIDES VIEWPOINTS FROM LEADING INDUSTRY EXECUTIVES AND EXPERTS DETAILS STATE-OF-THE-ART ACHIEVEMENTS IN PROCESS TECHNOLOGIES AND SCIENTIFIC RESEARCH PRESENTS A CLEAR DEVELOPMENT HISTORY AND TOUCHES ON TRENDS IN THE INDUSTRY WHILE ALSO DISCUSSING UP-TO-DATE TECHNOLOGY INFORMATION ADVANCED FLIP CHIP PACKAGING IS AN IDEAL BOOK FOR ENGINEERS, RESEARCHERS, AND GRADUATE STUDENTS INTERESTED IN THE FIELD OF FLIP CHIP PACKAGING DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT.
any_adam_object	1
author2	Tong, Ho-Ming
author2_role	edt
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dewey-sort	3621.381
dewey-tens	620 - Engineering and allied operations
discipline	Elektrotechnik / Elektronik / Nachrichtentechnik
doi_str_mv	10.1007/978-1-4419-5768-9
format	Electronic eBook
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isbn	9781441957689
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spellingShingle	Advanced flip chip packaging Ingenieurwissenschaften Electronics Systems engineering Optical materials Engineering Halbleiter (DE-588)4022993-2 gnd Flip-Chip-Technologie (DE-588)4427284-4 gnd
subject_GND	(DE-588)4022993-2 (DE-588)4427284-4
title	Advanced flip chip packaging
title_auth	Advanced flip chip packaging
title_exact_search	Advanced flip chip packaging
title_full	Advanced flip chip packaging Ho-Ming Tong ..., eds.
title_fullStr	Advanced flip chip packaging Ho-Ming Tong ..., eds.
title_full_unstemmed	Advanced flip chip packaging Ho-Ming Tong ..., eds.
title_short	Advanced flip chip packaging
title_sort	advanced flip chip packaging
topic	Ingenieurwissenschaften Electronics Systems engineering Optical materials Engineering Halbleiter (DE-588)4022993-2 gnd Flip-Chip-Technologie (DE-588)4427284-4 gnd
topic_facet	Ingenieurwissenschaften Electronics Systems engineering Optical materials Engineering Halbleiter Flip-Chip-Technologie
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work_keys_str_mv	AT tonghoming advancedflipchippackaging

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