Verfügbarkeit: Advanced Thermal Management Materials

Advanced Thermal Management Materials:

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	Jiang, Guosheng (VerfasserIn)
Format:	Elektronisch E-Book
Sprache:	English
Veröffentlicht:	New York, NY Springer 2013
Schriftenreihe:	SpringerLink : Bücher
Schlagworte:	Ingenieurwissenschaften Engineering Electronics Materials Energy Temperaturverhalten Elektronisches Bauelement
Online-Zugang:	BTU01 FAN01 FAW01 FFW01 FHI01 FHN01 FKE01 TUM01 UBT01 UBY01 Volltext Inhaltsverzeichnis Abstract
Beschreibung:	Online-Ressource (digital)
ISBN:	9781461419631
DOI:	10.1007/978-1-4614-1963-1

Internformat

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Datensatz im Suchindex

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adam_text	ADVANCED THERMAL MANAGEMENT MATERIALS / JIANG, GUOSHENG : 2013 TABLE OF CONTENTS / INHALTSVERZEICHNIS INTRODUCTION TO THERMAL MANAGEMENT IN MICROELECTRONICS PACKAGING REQUIREMENTS OF THERMAL MANAGEMENT MATERIALS OVERVIEW OF TRADITIONAL THERMAL MANAGEMENT MATERIALS.-DEVELOPMENT OF ADVANCED THERMAL MANAGEMENT MATERIALS PROPERTIES OF WCU, MOCU, CU/MOCU/CU HIGH PERFORMANCE HEAT SINK MATERIALS AND MANUFACTURING TECHNOLOGIES NOVEL METHODS FOR MANUFACTURING OF W85-CU HEAT SINKS FOR ELECTRONIC PACKAGING APPLICATIONS IMPROVED MANUFACTURING PROCESS OF CU/MO70-CU/CU COMPOSITE HEAT SINKS FOR ELECTRONIC PACKAGING APPLICATIONS AL/SIC THERMAL MANAGEMENT MATERIALS UNDERSTANDING OF LASER, LASER DIODES, LASER DIODE PACKAGING AND ITS RELATIONSHIP TO TUNGSTEN COPPER FUTURE TREND OF ADVANCED THERMAL MANAGEMENT MATERIALS DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT. ADVANCED THERMAL MANAGEMENT MATERIALS / JIANG, GUOSHENG : 2013 ABSTRACT / INHALTSTEXT ADVANCED THERMAL MANAGEMENT MATERIALS PROVIDES A COMPREHENSIVE AND HANDS-ON TREATISE ON THE IMPORTANCE OF THERMAL PACKAGING IN HIGH PERFORMANCE SYSTEMS. THESE SYSTEMS, RANGING FROM ACTIVE ELECTRONICALLY-SCANNED RADAR ARRAYS TO WEB SERVERS, REQUIRE COMPONENTS THAT CAN DISSIPATE HEAT EFFICIENTLY. THIS REQUIRES MATERIALS CAPABLE OF DISSIPATING HEAT AND MAINTAINING COMPATIBILITY WITH THE PACKAGING AND DYE. COVERAGE INCLUDES ALL ASPECTS OF THERMAL MANAGEMENT MATERIALS, BOTH TRADITIONAL AND NON-TRADITIONAL,WITH AN EMPHASIS ON METAL BASED MATERIALS. AN IN-DEPTH DISCUSSION OF PROPERTIES AND MANUFACTURING PROCESSES, AND CURRENT APPLICATIONS ARE PROVIDED. ALSO PRESENTED ARE A DISCUSSION OF THE IMPORTANCE OF COST, PERFORMANCE AND RELIABILITY ISSUES WHEN MAKING IMPLEMENTATION DECISIONS, PRODUCT LIFE CYCLE DEVELOPMENTS, LESSONS LEARNED AND FUTURE DIRECTIONS. THIS BOOK ALSO: PROVIDES AN IN-DEPTH OVERVIEW OF COPPER, METAL AND ALUMINUM MATERIALS AND DISCUSSES THE ADVANTAGES AND DISADVANTAGES OF EACH IN THERMAL MANAGEMENT DISCUSSES NUMERICAL SIMULATION METHODS AND TECHNIQUES USED IN ANALYSIS OF ELECTRONIC DEVICES AND MATERIALS COVERS SYSTEM AND COMPONENT INTEGRATION OF ADVANCED PACKAGING MATERIALS ADVANCED THERMAL MANAGEMENT MATERIALS IS AN IDEAL BOOK FOR MICROELECTRONICS AND PACKAGING ENGINEERS, SCIENTISTS AND RESEARCHERS IN ACADEMIA AND INDUSTRY INTERESTED IN THERMAL PACKAGING IN HIGH PERFORMANCE SYSTEMS. DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT.
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discipline	Elektrotechnik Wirtschaftswissenschaften
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spelling	Jiang, Guosheng Verfasser aut Advanced Thermal Management Materials by Guosheng Jiang, Liyong Diao, Ken Kuang New York, NY Springer 2013 Online-Ressource (digital) txt rdacontent c rdamedia cr rdacarrier SpringerLink : Bücher Ingenieurwissenschaften Engineering Electronics Materials Energy Temperaturverhalten (DE-588)4457534-8 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 s Temperaturverhalten (DE-588)4457534-8 s DE-604 Diao, Liyong Sonstige oth Kuang, Ken Sonstige oth https://doi.org/10.1007/978-1-4614-1963-1 Verlag Volltext Springer Fremddatenuebernahme application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=025753555&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis Springer Fremddatenuebernahme application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=025753555&sequence=000003&line_number=0002&func_code=DB_RECORDS&service_type=MEDIA Abstract
spellingShingle	Jiang, Guosheng Advanced Thermal Management Materials Ingenieurwissenschaften Engineering Electronics Materials Energy Temperaturverhalten (DE-588)4457534-8 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd
subject_GND	(DE-588)4457534-8 (DE-588)4014360-0
title	Advanced Thermal Management Materials
title_auth	Advanced Thermal Management Materials
title_exact_search	Advanced Thermal Management Materials
title_full	Advanced Thermal Management Materials by Guosheng Jiang, Liyong Diao, Ken Kuang
title_fullStr	Advanced Thermal Management Materials by Guosheng Jiang, Liyong Diao, Ken Kuang
title_full_unstemmed	Advanced Thermal Management Materials by Guosheng Jiang, Liyong Diao, Ken Kuang
title_short	Advanced Thermal Management Materials
title_sort	advanced thermal management materials
topic	Ingenieurwissenschaften Engineering Electronics Materials Energy Temperaturverhalten (DE-588)4457534-8 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd
topic_facet	Ingenieurwissenschaften Engineering Electronics Materials Energy Temperaturverhalten Elektronisches Bauelement
url	https://doi.org/10.1007/978-1-4614-1963-1 http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=025753555&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=025753555&sequence=000003&line_number=0002&func_code=DB_RECORDS&service_type=MEDIA
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