Influences on the reflow soldering process by components with specific thermal properties:
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Elektronisch E-Book |
Sprache: | English |
Veröffentlicht: |
2009
|
Online-Zugang: | Volltext Volltext |
Beschreibung: | Aus: Circuit World ; 35. 2009 |
Beschreibung: | 1 Online-Ressource |
Internformat
MARC
LEADER | 00000nmm a2200000 c 4500 | ||
---|---|---|---|
001 | BV040705513 | ||
003 | DE-604 | ||
005 | 00000000000000.0 | ||
007 | cr|uuu---uuuuu | ||
008 | 130129s2009 |||| o||u| ||||||eng d | ||
024 | 7 | |a urn:nbn:de:bvb:29-opus-41424 |2 urn | |
035 | |a (OCoLC)826626951 | ||
035 | |a (DE-599)BVBBV040705513 | ||
040 | |a DE-604 |b ger |e rakwb | ||
041 | 0 | |a eng | |
049 | |a DE-29 | ||
100 | 1 | |a Schüßler, Florian |e Verfasser |4 aut | |
245 | 1 | 0 | |a Influences on the reflow soldering process by components with specific thermal properties |c Florian Schüßler ; Denis Kozic ; Jörg Franke |
264 | 1 | |c 2009 | |
300 | |a 1 Online-Ressource | ||
336 | |b txt |2 rdacontent | ||
337 | |b c |2 rdamedia | ||
338 | |b cr |2 rdacarrier | ||
500 | |a Aus: Circuit World ; 35. 2009 | ||
700 | 1 | |a Kozic, Denis |e Verfasser |4 aut | |
700 | 1 | |a Franke, Jörg |e Verfasser |4 aut | |
856 | 4 | 0 | |u https://open.fau.de/handle/openfau/2906 |x Verlag |z kostenfrei |3 Volltext |
856 | 4 | 0 | |u https://nbn-resolving.org/urn:nbn:de:bvb:29-opus-41424 |x Resolving-System |z kostenfrei |3 Volltext |
912 | |a ebook | ||
999 | |a oai:aleph.bib-bvb.de:BVB01-025685958 |
Datensatz im Suchindex
_version_ | 1804150010047102976 |
---|---|
any_adam_object | |
author | Schüßler, Florian Kozic, Denis Franke, Jörg |
author_facet | Schüßler, Florian Kozic, Denis Franke, Jörg |
author_role | aut aut aut |
author_sort | Schüßler, Florian |
author_variant | f s fs d k dk j f jf |
building | Verbundindex |
bvnumber | BV040705513 |
collection | ebook |
ctrlnum | (OCoLC)826626951 (DE-599)BVBBV040705513 |
format | Electronic eBook |
fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01140nmm a2200325 c 4500</leader><controlfield tag="001">BV040705513</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">130129s2009 |||| o||u| ||||||eng d</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">urn:nbn:de:bvb:29-opus-41424</subfield><subfield code="2">urn</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)826626951</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV040705513</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-29</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Schüßler, Florian</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Influences on the reflow soldering process by components with specific thermal properties</subfield><subfield code="c">Florian Schüßler ; Denis Kozic ; Jörg Franke</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2009</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Aus: Circuit World ; 35. 2009</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Kozic, Denis</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Franke, Jörg</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://open.fau.de/handle/openfau/2906</subfield><subfield code="x">Verlag</subfield><subfield code="z">kostenfrei</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://nbn-resolving.org/urn:nbn:de:bvb:29-opus-41424</subfield><subfield code="x">Resolving-System</subfield><subfield code="z">kostenfrei</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ebook</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-025685958</subfield></datafield></record></collection> |
id | DE-604.BV040705513 |
illustrated | Not Illustrated |
indexdate | 2024-07-10T00:32:07Z |
institution | BVB |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-025685958 |
oclc_num | 826626951 |
open_access_boolean | 1 |
owner | DE-29 |
owner_facet | DE-29 |
physical | 1 Online-Ressource |
psigel | ebook |
publishDate | 2009 |
publishDateSearch | 2009 |
publishDateSort | 2009 |
record_format | marc |
spelling | Schüßler, Florian Verfasser aut Influences on the reflow soldering process by components with specific thermal properties Florian Schüßler ; Denis Kozic ; Jörg Franke 2009 1 Online-Ressource txt rdacontent c rdamedia cr rdacarrier Aus: Circuit World ; 35. 2009 Kozic, Denis Verfasser aut Franke, Jörg Verfasser aut https://open.fau.de/handle/openfau/2906 Verlag kostenfrei Volltext https://nbn-resolving.org/urn:nbn:de:bvb:29-opus-41424 Resolving-System kostenfrei Volltext |
spellingShingle | Schüßler, Florian Kozic, Denis Franke, Jörg Influences on the reflow soldering process by components with specific thermal properties |
title | Influences on the reflow soldering process by components with specific thermal properties |
title_auth | Influences on the reflow soldering process by components with specific thermal properties |
title_exact_search | Influences on the reflow soldering process by components with specific thermal properties |
title_full | Influences on the reflow soldering process by components with specific thermal properties Florian Schüßler ; Denis Kozic ; Jörg Franke |
title_fullStr | Influences on the reflow soldering process by components with specific thermal properties Florian Schüßler ; Denis Kozic ; Jörg Franke |
title_full_unstemmed | Influences on the reflow soldering process by components with specific thermal properties Florian Schüßler ; Denis Kozic ; Jörg Franke |
title_short | Influences on the reflow soldering process by components with specific thermal properties |
title_sort | influences on the reflow soldering process by components with specific thermal properties |
url | https://open.fau.de/handle/openfau/2906 https://nbn-resolving.org/urn:nbn:de:bvb:29-opus-41424 |
work_keys_str_mv | AT schußlerflorian influencesonthereflowsolderingprocessbycomponentswithspecificthermalproperties AT kozicdenis influencesonthereflowsolderingprocessbycomponentswithspecificthermalproperties AT frankejorg influencesonthereflowsolderingprocessbycomponentswithspecificthermalproperties |