Vertical integration and technological innovation: a transaction cost approach
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Abschlussarbeit Buch |
| Sprache: | English |
| Veröffentlicht: |
Ann Arbor, Mich.
University Microfilms International
1988
|
| Schlagworte: | |
| Beschreibung: | VIII, S.107 graph.Darst. |
Internformat
MARC
| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV040637659 | ||
| 003 | DE-604 | ||
| 005 | 20121220 | ||
| 007 | t | ||
| 008 | 121217s1988 d||| m||| 00||| eng d | ||
| 035 | |a (OCoLC)823258829 | ||
| 035 | |a (DE-599)BVBBV040637659 | ||
| 040 | |a DE-604 |b ger |e rakwb | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-19 | ||
| 100 | 1 | |a Lee, Yeong Heok |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Vertical integration and technological innovation |b a transaction cost approach |c Yeong Heok Lee |
| 264 | 1 | |a Ann Arbor, Mich. |b University Microfilms International |c 1988 | |
| 300 | |a VIII, S.107 |b graph.Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 502 | |a Diss., Univ., Pennsylvania, 1988 | ||
| 650 | 0 | 7 | |a Vertikale Integration |0 (DE-588)4215421-2 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Elektronikindustrie |0 (DE-588)4133005-5 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Forschung und Entwicklung |0 (DE-588)4017897-3 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Innovation |0 (DE-588)4027089-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Transaktionskostenansatz |0 (DE-588)4206592-6 |2 gnd |9 rswk-swf |
| 651 | 7 | |a USA |0 (DE-588)4078704-7 |2 gnd |9 rswk-swf | |
| 655 | 7 | |0 (DE-588)4113937-9 |a Hochschulschrift |2 gnd-content | |
| 689 | 0 | 0 | |a USA |0 (DE-588)4078704-7 |D g |
| 689 | 0 | 1 | |a Elektronikindustrie |0 (DE-588)4133005-5 |D s |
| 689 | 0 | 2 | |a Vertikale Integration |0 (DE-588)4215421-2 |D s |
| 689 | 0 | 3 | |a Innovation |0 (DE-588)4027089-0 |D s |
| 689 | 0 | 4 | |a Transaktionskostenansatz |0 (DE-588)4206592-6 |D s |
| 689 | 0 | |8 1\p |5 DE-604 | |
| 689 | 1 | 0 | |a Vertikale Integration |0 (DE-588)4215421-2 |D s |
| 689 | 1 | 1 | |a Forschung und Entwicklung |0 (DE-588)4017897-3 |D s |
| 689 | 1 | |8 2\p |5 DE-604 | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-025464773 | ||
| 883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
| 883 | 1 | |8 2\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
Datensatz im Suchindex
| _version_ | 1804149751407443968 |
|---|---|
| any_adam_object | |
| author | Lee, Yeong Heok |
| author_facet | Lee, Yeong Heok |
| author_role | aut |
| author_sort | Lee, Yeong Heok |
| author_variant | y h l yh yhl |
| building | Verbundindex |
| bvnumber | BV040637659 |
| ctrlnum | (OCoLC)823258829 (DE-599)BVBBV040637659 |
| format | Thesis Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01885nam a2200469 c 4500</leader><controlfield tag="001">BV040637659</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20121220 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">121217s1988 d||| m||| 00||| eng d</controlfield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)823258829</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV040637659</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-19</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Lee, Yeong Heok</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Vertical integration and technological innovation</subfield><subfield code="b">a transaction cost approach</subfield><subfield code="c">Yeong Heok Lee</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Ann Arbor, Mich.</subfield><subfield code="b">University Microfilms International</subfield><subfield code="c">1988</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">VIII, S.107</subfield><subfield code="b">graph.Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="502" ind1=" " ind2=" "><subfield code="a">Diss., Univ., Pennsylvania, 1988</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Vertikale Integration</subfield><subfield code="0">(DE-588)4215421-2</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Elektronikindustrie</subfield><subfield code="0">(DE-588)4133005-5</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Forschung und Entwicklung</subfield><subfield code="0">(DE-588)4017897-3</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Innovation</subfield><subfield code="0">(DE-588)4027089-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Transaktionskostenansatz</subfield><subfield code="0">(DE-588)4206592-6</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="651" ind1=" " ind2="7"><subfield code="a">USA</subfield><subfield code="0">(DE-588)4078704-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)4113937-9</subfield><subfield code="a">Hochschulschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">USA</subfield><subfield code="0">(DE-588)4078704-7</subfield><subfield code="D">g</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Elektronikindustrie</subfield><subfield code="0">(DE-588)4133005-5</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Vertikale Integration</subfield><subfield code="0">(DE-588)4215421-2</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="3"><subfield code="a">Innovation</subfield><subfield code="0">(DE-588)4027089-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="4"><subfield code="a">Transaktionskostenansatz</subfield><subfield code="0">(DE-588)4206592-6</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="8">1\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="1" ind2="0"><subfield code="a">Vertikale Integration</subfield><subfield code="0">(DE-588)4215421-2</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2="1"><subfield code="a">Forschung und Entwicklung</subfield><subfield code="0">(DE-588)4017897-3</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2=" "><subfield code="8">2\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-025464773</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">2\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield></record></collection> |
| genre | (DE-588)4113937-9 Hochschulschrift gnd-content |
| genre_facet | Hochschulschrift |
| geographic | USA (DE-588)4078704-7 gnd |
| geographic_facet | USA |
| id | DE-604.BV040637659 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T00:28:00Z |
| institution | BVB |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-025464773 |
| oclc_num | 823258829 |
| open_access_boolean | |
| owner | DE-19 DE-BY-UBM |
| owner_facet | DE-19 DE-BY-UBM |
| physical | VIII, S.107 graph.Darst. |
| publishDate | 1988 |
| publishDateSearch | 1988 |
| publishDateSort | 1988 |
| publisher | University Microfilms International |
| record_format | marc |
| spelling | Lee, Yeong Heok Verfasser aut Vertical integration and technological innovation a transaction cost approach Yeong Heok Lee Ann Arbor, Mich. University Microfilms International 1988 VIII, S.107 graph.Darst. txt rdacontent n rdamedia nc rdacarrier Diss., Univ., Pennsylvania, 1988 Vertikale Integration (DE-588)4215421-2 gnd rswk-swf Elektronikindustrie (DE-588)4133005-5 gnd rswk-swf Forschung und Entwicklung (DE-588)4017897-3 gnd rswk-swf Innovation (DE-588)4027089-0 gnd rswk-swf Transaktionskostenansatz (DE-588)4206592-6 gnd rswk-swf USA (DE-588)4078704-7 gnd rswk-swf (DE-588)4113937-9 Hochschulschrift gnd-content USA (DE-588)4078704-7 g Elektronikindustrie (DE-588)4133005-5 s Vertikale Integration (DE-588)4215421-2 s Innovation (DE-588)4027089-0 s Transaktionskostenansatz (DE-588)4206592-6 s 1\p DE-604 Forschung und Entwicklung (DE-588)4017897-3 s 2\p DE-604 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk 2\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Lee, Yeong Heok Vertical integration and technological innovation a transaction cost approach Vertikale Integration (DE-588)4215421-2 gnd Elektronikindustrie (DE-588)4133005-5 gnd Forschung und Entwicklung (DE-588)4017897-3 gnd Innovation (DE-588)4027089-0 gnd Transaktionskostenansatz (DE-588)4206592-6 gnd |
| subject_GND | (DE-588)4215421-2 (DE-588)4133005-5 (DE-588)4017897-3 (DE-588)4027089-0 (DE-588)4206592-6 (DE-588)4078704-7 (DE-588)4113937-9 |
| title | Vertical integration and technological innovation a transaction cost approach |
| title_auth | Vertical integration and technological innovation a transaction cost approach |
| title_exact_search | Vertical integration and technological innovation a transaction cost approach |
| title_full | Vertical integration and technological innovation a transaction cost approach Yeong Heok Lee |
| title_fullStr | Vertical integration and technological innovation a transaction cost approach Yeong Heok Lee |
| title_full_unstemmed | Vertical integration and technological innovation a transaction cost approach Yeong Heok Lee |
| title_short | Vertical integration and technological innovation |
| title_sort | vertical integration and technological innovation a transaction cost approach |
| title_sub | a transaction cost approach |
| topic | Vertikale Integration (DE-588)4215421-2 gnd Elektronikindustrie (DE-588)4133005-5 gnd Forschung und Entwicklung (DE-588)4017897-3 gnd Innovation (DE-588)4027089-0 gnd Transaktionskostenansatz (DE-588)4206592-6 gnd |
| topic_facet | Vertikale Integration Elektronikindustrie Forschung und Entwicklung Innovation Transaktionskostenansatz USA Hochschulschrift |
| work_keys_str_mv | AT leeyeongheok verticalintegrationandtechnologicalinnovationatransactioncostapproach |