Pulse plating: including 25 tables
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Buch |
Sprache: | English |
Veröffentlicht: |
Bad Saulgau
Leuze
2012
|
Ausgabe: | 1st ed. |
Schlagworte: | |
Online-Zugang: | Inhaltstext Inhaltsverzeichnis |
Beschreibung: | 385 S. Ill., graph. Darst. |
ISBN: | 9783874802659 |
Internformat
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Datensatz im Suchindex
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adam_text |
IMAGE 1
CONTENT
1 A N OVERVIEW O F PULSE DEPOSITION 19
1.1 INTRODUCTION 19
1.2 BASIC DEFINITIONS 2 0
1.3 PRACTICAL ELECTRODEPOSITION SYSTEMS 21
1.3.1 MEASUREMENT AND CONTROL O F POTENTIAL AND CURRENT 21
1.3.2 ELECTROLYTE COMPOSITION 2 4
1.3.3 ELECTRODE REACTIONS 25
1.4 DYNAMIC PHENOMENA DURING PULSED DEPOSITION OR DISSOLUTION 2 7
1.4.1 DOUBLE LAYER CHARGING 2 8
1.4.2 REACTION DYNAMICS 2 8
1.4.3 ELECTROCRYSTALLISATION 2 9
1.4.4 MASS TRANSFER EFFECTS 31
2 THERMODYNAMICS 33
2.1 INTRODUCTION 33
2.2 ELECTROCHEMICAL EQUILIBRIUM AT INTERFACES 33
2.3 THE ORIGIN O F ELECTROCHEMICAL POTENTIALS AND THE NERNST EQUATION 3
5
2.4 STANDARD ELECTRODE POTENTIALS 3 7
2.5 STANDARD ELECTRODE POTENTIALS AND SPECIATION O F METAL COMPLEXES 3 8
2.6 THE ELECTRICAL DOUBLE LAYER . 41
2.7 DEPARTURE FROM EQUILIBRIUM 4 2
2.8 CAPACITIVE EFFECTS IN PULSE PLATING 4 3
2.8.1 CALCULATION O F DOUBLE LAYER CHARGING AND DISCHARGING TIMES 4 3
2.8.2 CAPACITIVE DAMPING O F FARADAIC CURRENT 4 7
2.8.3 EFFECT O F PSEUDOCAPACITANCE 4 8
3 REACTION KINETICS 51
3.1 INTRODUCTION 51
3.2 SIMPLE CHARGE TRANSFER KINETICS 51
3.3 CHARGE TRANSFER KINETICS O F MULTISTEP PROCESSES 57
HTTP://D-NB.INFO/1021273139
IMAGE 2
14
CONTENT
3.4 REACTION MECHANISM 5 9
3.4.1 COPPER DEPOSITION AND DISSOLUTION 59
3.4.2 C A D M I U M DEPOSITION AND DISSOLUTION 6 1
3.4.3 SILVER DEPOSITION AND DISSOLUTION 6 2
3.5 CHARGE TRANSFER KINETICS O F ALLOY PLATING 6 4
3.6 EFFECT O F ADDITIVES ON CHARGE TRANSFER KINETICS 6 6
3.7 OVERALL IMPORTANCE O F KINETICS IN PULSE PLATING 6 8
4 NUCLEATION AND MORPHOLOGY 72
4.1 INTRODUCTION 72
4.2 MECHANISM O F THE ELECTROCHEMICAL METAL DEPOSITION 72
4.3 PULSE PLATING AND DEPOSIT MORPHOLOGY 7 6
4.4 ADDITIVE EFFECTS 81
5 CURRENT DISTRIBUTION 83
5.1 INTRODUCTION 83
5.2 CURRENT DISTRIBUTION 84
5.3 QUALIFICATION O F CURRENT DISTRIBUTION 88
5.4 QUANTIFICATION O F CURRENT DISTRIBUTION 92
5.5 CURRENT DISTRIBUTION AND PULSE PLATING 9 5
6 M A S S TRANSFER DURING PULSE DEPOSITION 100
6.1 INTRODUCTION 100
6.2 IONIC TRANSPORT AND THE CONCENTRATION DEPLETION LAYER 101
6.2.1 DILFUSIONAL TRANSPORT 102
6.2.2 CONVECTIVE-DIFIFUSIONAL TRANSPORT 103
6.3 CONCENTRATION DEPLETION DURING PULSE CURRENT DEPOSITION 105
6.4 M A X I M U M PLATING RATE DURING PULSE DEPOSITION 107
6.5 PULSE LIMITING CURRENT USING THE DUAL DIFFUSION LAYER CONCEPT I L L
6.6 EXPERIMENTAL VERIFICATION O F THE PULSE LIMITING CURRENT 112
6.7 EFFECT O F M A S S TRANSPORT ON MICROSTRUCTURE AND CURRENT
EFFICIENCY 114
6.8 EFFECT O F M A S S TRANSPORT ON ALLOY COMPOSITION 117
6.9 EFFECT O F M A S S TRANSPORT ON ADDITIVES 118
6.10 MASS TRANSPORT O N THE MICROSCALE 120
7 MODELLING O F PULSE PLATING 123
7.1 INTRODUCTION 123
7.2 MODEL EQUATIONS 124
IMAGE 3
CONTENT
15
7.2.1 SINGLE METAL DEPOSITION 124
7.2.2 METAL DEPOSITION WITH CO-EVOLUTION O F HYDROGEN 127
7.2.3 ALLOY DEPOSITION 129
7.2.3.1 EFFECT O F PULSE PARAMETERS 130
7.2.3.2 EFFECT O F GALVANIC CORROSION 131
7.3 EFFECT O F ADSORBED ADDITIVES AND INTERMEDIATES 132
7.4 APPROXIMATE ANALYTICAL MODELS 133
8 PULSE RECTIFIER SYSTEMS 136
8.1 INTRODUCTION 136
8.2 T H E PULSE POWER SUPPLIES 138
8.3 CURRENT WAVEFORM 140
8.3.1 RISE AND FALL TIME 140
8.3.2 OVERSHOOT AND UNDERSHOOT 141
8.3.3 THE PERIOD TIME 143
8.3.4 T H E FREQUENCY 143
8.3.5 THE AVERAGE VALUE 143
8.3.6 EFFECTIVE CURRENT 144
8.3.7 PEAK ENERGY 145
8.3.8 ACTUAL (PRACTICAL) CURRENT WAVEFORM 145
8.4 T H E PULSE PLATING PROCESS 146
8.4.1 CHEMISTRY 147
8.4.2 PLATING LINE / INSTALLATION 147
8.4.2.1 CABLE LENGTH 148
8.4.2.2 CABLE INDUCTANCE 148
8.4.2.3 CONTACT SYSTEMS 151
8.5 SAFETY I N F O R M A T I O N - E L E C T R I C A L MAGNETIC FIELDS
152
8.6 PROCESS CONTROL 153
8.7 DIMENSIONING A PULSE REVERSE POWER SUPPLY 155
9 TECHNICAL IMPLEMENTATION O F P P PROCESSES 159
9.1 I M P L E M E N T A T I O N - G U I D E L I N E S ARISING FROM
THEORETICAL CONSIDERATIONS 160
9.1.1 INTRODUCTION 160
9.1.2 CASE STUDIES 160
9.1.2.1 INFLUENCING DEPOSIT UNIFORMITY USING M A S S TRANSFER 160
9.1.2.2 INFLUENCING DEPOSIT UNIFORMITY USING KINETICS 161
9.1.2.3 INFLUENCING HYDROGEN CONTENT O F DEPOSITS VIA KINETICS 164
9.1.2.4 INFLUENCING DEPOSIT STRUCTURE VIA M A S S TRANSPORT 165
9.1.3 GUIDELINES FOR CHOOSING PULSE PARAMETERS 166
IMAGE 4
16
CONTENT
9.2 PRACTICAL IMPLEMENTATION O F PULSE PLATING 172
9.2.1 A SYSTEMATIC METHOD FOR CHOOSING PULSE PLATING PARAMETERS 173
9.2.1.1 ELECTROCHEMICAL EXPERIMENTS 174
9.2.1.2 MECHANISM O F THE DEPOSITION 175
9.2.1.3 APPLICATION O F THE BASIC DATA TO THE PULSE DEPOSITION - FROM
CURRENT-POTENTIAL DATA TO REACTION INFORMATION 176
9.2.1.4 NUMERICAL SIMULATION O F PULSE PLATING PROCESSES 176
9.2.1.5 MACROSCOPIC PROPERTIES 178
9.2.2 PLATING LINE ADAPTION 181
9.2.3 PULSE PLATING AND BARREL PLATING 182
10 ENERGY AND MATERIAL CONSIDERATIONS 184
10.1 INTRODUCTION 184
10.2 PULSE PLATING AND ENERGY CONSUMPTION 184
10.3 MATERIAL 185
10.4 C 0 2 E M I S S I O N 187
11 PULSE PLATING O F C O P P E R ON PRINTED CIRCUIT BOARDS 189
11.1 INTRODUCTION 189
11.2 SUMMARY O F EARLY INVESTIGATIONS O F PUIS AND PULSE REVERSE PLATING
O F COPPER 191
11.3 REACTIONS 192
11.3.1 CURRENT EFFICIENCY 192
11.3.2 ANODIC PASSIVATION 193
11.4 THROWING POWER 194
11.4.1 WAGNER N U M B E R 194
11.4.2 SURFACE DISTRIBUTION 196
11.4.3 PLATING IN THROUGH HOLES AND BLIND VIAS 197
11.5 STRUCTURE AND MORPHOLOGY 2 0 2
11.6 MECHANICAL PROPERTIES 204
11.7 SUPERIMPOSED PULSE REVERSE PLATING 2 0 5
11.8 R E C O M M E N D E D PULSE PARAMETERS SETTINGS 2 0 7
12 PULSE PLATING O F NICKEL AND ITS ALLOYS 2 0 8
12.1 INTRODUCTION 208
12.2 WATTS BATHS 2 0 8
12.3 SULFAMATE BATHS 2 1 0
12.4 CHLORIDE BATHS AND WOODS STRIKE 2 1 6
IMAGE 5
CONTENT 17
12.5 NANOCRYSTALLINE NICKEL LAYERS 2 1 6
12.6 NICKEL-COBALT AND NICKEL-COBALT-IRON 2 1 8
12.7 NICKEL-IRON 2 2 0
12.8 NICKEL-COPPER 2 2 2
12.9 NICKEL TUNGSTEN AND NICKEL-PHOSPHOR 2 2 3
12.10 OTHERNICKEL ALLOYS 2 2 4
12.11 NICKEL ELECTROFORMING 2 2 5
13 PULSE PLATING O F TIN AND ITS ALLOYS 229
13.1 INTRODUCTION 2 2 9
13.2 ALKALINE ELECTROLYTE SYSTEMS 2 3 0
13.3 ACIDIC ELECTROLYTE SYSTEMS 2 3 3
13.4 GOLD-TIN ALLOYS 2 3 6
13.5 SILVER-TIN ALLOYS 2 4 1
13.6 TIN-ZINC ALLOYS 2 4 5
13.7 TIN-LEAD ALLOYS 2 4 6
13.8 COPPER-TIN ALLOYS 2 4 7
13.9 PULSE PLATING AND WHISKER FORMATION 248
14 PULSE PLATING O F CHROMIUM 2 5 0
14.1 INTRODUCTION 2 5 0
14.2 CRACK FORMATION AND ELIMINATION 2 5 2
14.3 MICROSTRUCTURED CHROMIUM SURFACES 2 5 7
14.4 MULTILAYER CHROMIUM DEPOSITS 2 5 9
14.5 PRACTICAL CONSIDERATIONS A N D APPLICATION 2 6 1
14.5.1 HARDNESS AND WEAR RESISTANCE 2 6 2
14.5.2 APPEARANCE 265
14.5.3 APPLICATION 2 6 6
14.6 PULSE DEPOSITION USING TRIVALENT CHROMIUM BATHS 2 6 7
15 PULSE PLATING O F PRECIOUS METALS 2 6 9
15.1 INTRODUCTION 2 6 9
15.2 GOLD 2 7 0
15.3 SILVER 2 7 6
15.4 PALLADIUM 2 7 8
15.5 PLATINUM 282
15.6 RHODIUM 283
15.7 PRECIOUS METAL ALLOYS 2 8 4
IMAGE 6
18
CONTENT
16 PULSE PLATING O F ZINC AND ITS ALLOYS 2 8 6
16.1 INTRODUCTION 2 8 6
16.2 PULSE PLATING O F ZINC 2 8 6
16.3 ZINC-NICKEL ALLOYS 291
16.4 OTHER ZINC ALLOYS 2 9 3
16.5 HYDROGEN EMBRITTLEMENT 2 9 5
17 PULSE POLISHING, MACHINING AND ANODISING 2 9 8
17.1 INTRODUCTION 2 9 8
17.2 THEORY O F ANODIC PROCESSES 2 9 9
17.3 PULSED ELECTROPOLISHING 302
17.4 PULSED ELECTROCHEMICAL MACHINING 3 0 5
17.5 PULSED ANODISATION 3 1 0
18 PULSE DEPOSITION O F NANOSTRUCTURED METAL MULTILAYERS 318
18.1 INTRODUCTION 318
18.2 PROCESSING OFCOMPOSITIONALLY MODULATED MATERIALS 3 1 9
18.3 DUAL BATH ELECTRODEPOSITION 3 1 9
18.4 SINGLE BATH ELECTRODEPOSITION 321
18.4.1 PROCESS DETAILS 321
18.4.2 ELECTROLYTE FORMULATION 323
18.4.3 CHOICE O F PULSE WAVEFORMS 324
18.4.4 EQUIPMENT AND MONITORING 3 2 7
18.4.5 PROTOTYPICAL EXAMPLE O F C M M DEPOSITION 3 2 9
19 PULSE PLATING IN COMBINATION WITH PARTICLE DISPERSION 331
19.1 INTRODUCTION 3 3 1
19.2 PARTICLE INCORPORATION AND ZETA POTENTIAL 3 3 2
19.3 NANOSCALED COMPOSITE COATINGS 338
19.4 NICKEL DISPERSION COATINGS 340
19.5 COPPER DISPERSION COATINGS 344
19.6 G O L D DISPERSION SYSTEMS 345
2 0 REFERENCES 347
21 INDEX 372
ADVERTISERS'INDEX 387 |
any_adam_object | 1 |
author | Hansal, Wolfgang E. G. 1972- Roy, Sudipta |
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discipline | Werkstoffwissenschaften / Fertigungstechnik |
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language | English |
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owner_facet | DE-92 DE-83 DE-29T |
physical | 385 S. Ill., graph. Darst. |
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publishDateSort | 2012 |
publisher | Leuze |
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spelling | Hansal, Wolfgang E. G. 1972- Verfasser (DE-588)1023022958 aut Pulse plating including 25 tables Wolfgang E. G. Hansal ; Sudipta Roy 1st ed. Bad Saulgau Leuze 2012 385 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Pulsgalvanisieren (DE-588)4226180-6 gnd rswk-swf Pulsgalvanisieren (DE-588)4226180-6 s DE-604 Roy, Sudipta Verfasser (DE-588)1023023016 aut X:MVB text/html http://deposit.dnb.de/cgi-bin/dokserv?id=4000987&prov=M&dok_var=1&dok_ext=htm Inhaltstext DNB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=025329963&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
spellingShingle | Hansal, Wolfgang E. G. 1972- Roy, Sudipta Pulse plating including 25 tables Pulsgalvanisieren (DE-588)4226180-6 gnd |
subject_GND | (DE-588)4226180-6 |
title | Pulse plating including 25 tables |
title_auth | Pulse plating including 25 tables |
title_exact_search | Pulse plating including 25 tables |
title_full | Pulse plating including 25 tables Wolfgang E. G. Hansal ; Sudipta Roy |
title_fullStr | Pulse plating including 25 tables Wolfgang E. G. Hansal ; Sudipta Roy |
title_full_unstemmed | Pulse plating including 25 tables Wolfgang E. G. Hansal ; Sudipta Roy |
title_short | Pulse plating |
title_sort | pulse plating including 25 tables |
title_sub | including 25 tables |
topic | Pulsgalvanisieren (DE-588)4226180-6 gnd |
topic_facet | Pulsgalvanisieren |
url | http://deposit.dnb.de/cgi-bin/dokserv?id=4000987&prov=M&dok_var=1&dok_ext=htm http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=025329963&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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