Modeling diffusional coarsening in microelectronic solders:
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Berlin
Weierstrass-Inst. für Angewandte Analysis und Stochastik
2001
|
| Schriftenreihe: | Preprint / Weierstrass-Institut für Angewandte Analysis und Stochastik im Forschungsverbund Berlin e.V.
654 |
| Online-Zugang: | kostenfrei |
| Beschreibung: | 22 Bl. Ill., graph. Darst. |
Internformat
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| 100 | 1 | |a Dreyer, Wolfgang |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Modeling diffusional coarsening in microelectronic solders |c Wolfgang Dreyer, Wolfgang H. Müller |
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Datensatz im Suchindex
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| id | DE-604.BV040409754 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T00:23:26Z |
| institution | BVB |
| language | English |
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| physical | 22 Bl. Ill., graph. Darst. |
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| publishDate | 2001 |
| publishDateSearch | 2001 |
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| publisher | Weierstrass-Inst. für Angewandte Analysis und Stochastik |
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| series2 | Preprint / Weierstrass-Institut für Angewandte Analysis und Stochastik im Forschungsverbund Berlin e.V. |
| spelling | Dreyer, Wolfgang Verfasser aut Modeling diffusional coarsening in microelectronic solders Wolfgang Dreyer, Wolfgang H. Müller Berlin Weierstrass-Inst. für Angewandte Analysis und Stochastik 2001 22 Bl. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Preprint / Weierstrass-Institut für Angewandte Analysis und Stochastik im Forschungsverbund Berlin e.V. 654 Müller, Wolfgang H. 1959- Verfasser (DE-588)13320040X aut Weierstrass-Institut für Angewandte Analysis und Stochastik im Forschungsverbund Berlin e.V. Preprint 654 (DE-604)BV009885922 654 http://www.wias-berlin.de/preprint/654/wias_preprints_654.pdf Verlag kostenfrei Volltext |
| spellingShingle | Dreyer, Wolfgang Müller, Wolfgang H. 1959- Modeling diffusional coarsening in microelectronic solders |
| title | Modeling diffusional coarsening in microelectronic solders |
| title_auth | Modeling diffusional coarsening in microelectronic solders |
| title_exact_search | Modeling diffusional coarsening in microelectronic solders |
| title_full | Modeling diffusional coarsening in microelectronic solders Wolfgang Dreyer, Wolfgang H. Müller |
| title_fullStr | Modeling diffusional coarsening in microelectronic solders Wolfgang Dreyer, Wolfgang H. Müller |
| title_full_unstemmed | Modeling diffusional coarsening in microelectronic solders Wolfgang Dreyer, Wolfgang H. Müller |
| title_short | Modeling diffusional coarsening in microelectronic solders |
| title_sort | modeling diffusional coarsening in microelectronic solders |
| url | http://www.wias-berlin.de/preprint/654/wias_preprints_654.pdf |
| volume_link | (DE-604)BV009885922 |
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