APA-Zitierstil (7. Ausg.)

Lau, J. H. (2011). Reliability of RoHS-Compliant 2D and 3D IC interconnects. McGraw-Hill Professional.

Chicago-Zitierstil (17. Ausg.)

Lau, John H. Reliability of RoHS-Compliant 2D and 3D IC Interconnects. New York [u.a.]: McGraw-Hill Professional, 2011.

MLA-Zitierstil (9. Ausg.)

Lau, John H. Reliability of RoHS-Compliant 2D and 3D IC Interconnects. McGraw-Hill Professional, 2011.