Reliability of RoHS-Compliant 2D and 3D IC interconnects:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
New York [u.a.]
McGraw-Hill Professional
2011
|
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | Includes bibliographical references and index |
| Beschreibung: | XXIX, 606 S. Ill., graph. Darst. |
| ISBN: | 9780071753791 |
Internformat
MARC
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| 245 | 1 | 0 | |a Reliability of RoHS-Compliant 2D and 3D IC interconnects |c John H. Lau |
| 264 | 1 | |a New York [u.a.] |b McGraw-Hill Professional |c 2011 | |
| 300 | |a XXIX, 606 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
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| 650 | 4 | |a Green technology |x Reliability | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING / Electronics / Optoelectronics |2 bisacsh | |
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Datensatz im Suchindex
| _version_ | 1804149439056576512 |
|---|---|
| adam_text | RELIABILITY OF ROHS-COMPLIANT 2D AND 3D IC INTERCONNECTS
/ LAU, JOHN H.
: 2011
TABLE OF CONTENTS / INHALTSVERZEICHNIS
BRIEF TOCCH 1. INTRODUCTION TO ROHS COMPLIANT SEMICONDUCTOR AND
PACKAGING TECHNOLOGIESCH 2. RELIABILITY ENGINEERING OF LEAD-FREE
INTERCONNECTSCH 3. NOTES ON FAILURE CRITERIONCH 4. RELIABILITY OF
1657-PIN CCGA LEAD-FREE SOLDER JOINTSCH 5. RELIABILITY OF PBGA (W/O
UNDERFILS) LEAD-FREE SOLDER JOINTSCH 6. RELIABILITY OF LED LEAD-FREE
INTERCONNECTSCH 7. RELIABILITY OF VCSEL LEAD-FREE INTERCONNECTSCH 8.
RELIABILITY OF LOW-TEMPERATURE LEAD-FREE (SNBIAG) SOLDER JOINTSCH 9.
RELIABILITY OF LEAD-FREE (SACX) SOLDER JOINTSCH 10. CHIP-TO-WAFER (C2W)
LEAD-FREE INTERCONNECT RELIABILITYCH 11. WAFER-TO-WAFER (W2W) LEAD-FREE
INTERCONNECT RELIABILITYCH 12. THROUGH-SILICON-VIA (TSV) INTERPOSER
LEAD-FREE INTERCONNECT RELIABILITYCH 13. ELECTROMIGRATION OF LEAD-FREE
MICROBUMPS FOR 3D IC INTEGRATIONSCH 14. EFFECTS OF DWELL-TIME AND
RAMP-RATES ON SAC THERMAL CYCLING TEST RESULTSCH 15. EFFECTS OF HIGH
STRAIN RATE (IMPACT) ON SAC SOLDER BUMPSCH 16. EFFECTS OF VOIDS ON
SOLDER JOINTS RELIABILITY.
DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT.
|
| any_adam_object | 1 |
| author | Lau, John H. |
| author_facet | Lau, John H. |
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| author_sort | Lau, John H. |
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| bvnumber | BV040392104 |
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| callnumber-label | TK7874 |
| callnumber-raw | TK7874.53 |
| callnumber-search | TK7874.53 |
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| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | ZN 4192 |
| ctrlnum | (OCoLC)837666042 (DE-599)BVBBV040392104 |
| dewey-full | 621.381/046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV040392104 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T00:23:02Z |
| institution | BVB |
| isbn | 9780071753791 |
| language | English |
| lccn | 2010040873 |
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| physical | XXIX, 606 S. Ill., graph. Darst. |
| publishDate | 2011 |
| publishDateSearch | 2011 |
| publishDateSort | 2011 |
| publisher | McGraw-Hill Professional |
| record_format | marc |
| spelling | Lau, John H. Verfasser aut Reliability of RoHS-Compliant 2D and 3D IC interconnects John H. Lau New York [u.a.] McGraw-Hill Professional 2011 XXIX, 606 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Includes bibliographical references and index Interconnects (Integrated circuit technology) Reliability Green technology Reliability TECHNOLOGY & ENGINEERING / Electronics / Optoelectronics bisacsh Integrierte Schaltung (DE-588)4027242-4 gnd rswk-swf Verbindungstechnik (DE-588)4129183-9 gnd rswk-swf Halbleitertechnologie (DE-588)4158814-9 gnd rswk-swf Zuverlässigkeit (DE-588)4059245-5 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 s Zuverlässigkeit (DE-588)4059245-5 s Verbindungstechnik (DE-588)4129183-9 s Halbleitertechnologie (DE-588)4158814-9 s DE-604 LoC Fremddatenuebernahme application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=025245417&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Lau, John H. Reliability of RoHS-Compliant 2D and 3D IC interconnects Interconnects (Integrated circuit technology) Reliability Green technology Reliability TECHNOLOGY & ENGINEERING / Electronics / Optoelectronics bisacsh Integrierte Schaltung (DE-588)4027242-4 gnd Verbindungstechnik (DE-588)4129183-9 gnd Halbleitertechnologie (DE-588)4158814-9 gnd Zuverlässigkeit (DE-588)4059245-5 gnd |
| subject_GND | (DE-588)4027242-4 (DE-588)4129183-9 (DE-588)4158814-9 (DE-588)4059245-5 |
| title | Reliability of RoHS-Compliant 2D and 3D IC interconnects |
| title_auth | Reliability of RoHS-Compliant 2D and 3D IC interconnects |
| title_exact_search | Reliability of RoHS-Compliant 2D and 3D IC interconnects |
| title_full | Reliability of RoHS-Compliant 2D and 3D IC interconnects John H. Lau |
| title_fullStr | Reliability of RoHS-Compliant 2D and 3D IC interconnects John H. Lau |
| title_full_unstemmed | Reliability of RoHS-Compliant 2D and 3D IC interconnects John H. Lau |
| title_short | Reliability of RoHS-Compliant 2D and 3D IC interconnects |
| title_sort | reliability of rohs compliant 2d and 3d ic interconnects |
| topic | Interconnects (Integrated circuit technology) Reliability Green technology Reliability TECHNOLOGY & ENGINEERING / Electronics / Optoelectronics bisacsh Integrierte Schaltung (DE-588)4027242-4 gnd Verbindungstechnik (DE-588)4129183-9 gnd Halbleitertechnologie (DE-588)4158814-9 gnd Zuverlässigkeit (DE-588)4059245-5 gnd |
| topic_facet | Interconnects (Integrated circuit technology) Reliability Green technology Reliability TECHNOLOGY & ENGINEERING / Electronics / Optoelectronics Integrierte Schaltung Verbindungstechnik Halbleitertechnologie Zuverlässigkeit |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=025245417&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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