Lau, J. H. (2011). Reliability of RoHS-Compliant 2D and 3D IC interconnects. McGraw-Hill Professional.
Chicago Style (17th ed.) CitationLau, John H. Reliability of RoHS-Compliant 2D and 3D IC Interconnects. New York [u.a.]: McGraw-Hill Professional, 2011.
MLA (9th ed.) CitationLau, John H. Reliability of RoHS-Compliant 2D and 3D IC Interconnects. McGraw-Hill Professional, 2011.
Warning: These citations may not always be 100% accurate.