Adhesives technology for electronic applications: materials, processing, reliability
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
[Norwich, NY]
Andrew
2011
|
| Ausgabe: | 2. ed. |
| Schlagworte: | |
| Online-Zugang: | FFW01 Volltext |
| Beschreibung: | Includes bibliographical references and index |
| Beschreibung: | 1 Online-Ressource (512 S.) |
| ISBN: | 9781437778892 |
Internformat
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| 100 | 1 | |a Licari, James J. |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Adhesives technology for electronic applications |b materials, processing, reliability |c James J. Licari and Dale W. Swanson |
| 250 | |a 2. ed. | ||
| 264 | 1 | |a [Norwich, NY] |b Andrew |c 2011 | |
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| 650 | 4 | |a Adhesives | |
| 650 | 4 | |a Electronic packaging | |
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Datensatz im Suchindex
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| author | Licari, James J. Swanson, Dale W. |
| author_facet | Licari, James J. Swanson, Dale W. |
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| id | DE-604.BV040269545 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T00:20:25Z |
| institution | BVB |
| isbn | 9781437778892 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-025125153 |
| oclc_num | 873880854 |
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| owner | DE-1028 |
| owner_facet | DE-1028 |
| physical | 1 Online-Ressource (512 S.) |
| psigel | ZDB-33-EGE |
| publishDate | 2011 |
| publishDateSearch | 2011 |
| publishDateSort | 2011 |
| publisher | Andrew |
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| spelling | Licari, James J. Verfasser aut Adhesives technology for electronic applications materials, processing, reliability James J. Licari and Dale W. Swanson 2. ed. [Norwich, NY] Andrew 2011 1 Online-Ressource (512 S.) txt rdacontent c rdamedia cr rdacarrier Includes bibliographical references and index Electronics / Materials Adhesives Electronic packaging Adhäsion (DE-588)4000493-4 gnd rswk-swf Elektroniktechnologie (DE-588)4402723-0 gnd rswk-swf Elektroniktechnologie (DE-588)4402723-0 s Adhäsion (DE-588)4000493-4 s DE-604 Swanson, Dale W. Verfasser aut http://www.sciencedirect.com/science/book/9781437778892 Verlag Volltext |
| spellingShingle | Licari, James J. Swanson, Dale W. Adhesives technology for electronic applications materials, processing, reliability Electronics / Materials Adhesives Electronic packaging Adhäsion (DE-588)4000493-4 gnd Elektroniktechnologie (DE-588)4402723-0 gnd |
| subject_GND | (DE-588)4000493-4 (DE-588)4402723-0 |
| title | Adhesives technology for electronic applications materials, processing, reliability |
| title_auth | Adhesives technology for electronic applications materials, processing, reliability |
| title_exact_search | Adhesives technology for electronic applications materials, processing, reliability |
| title_full | Adhesives technology for electronic applications materials, processing, reliability James J. Licari and Dale W. Swanson |
| title_fullStr | Adhesives technology for electronic applications materials, processing, reliability James J. Licari and Dale W. Swanson |
| title_full_unstemmed | Adhesives technology for electronic applications materials, processing, reliability James J. Licari and Dale W. Swanson |
| title_short | Adhesives technology for electronic applications |
| title_sort | adhesives technology for electronic applications materials processing reliability |
| title_sub | materials, processing, reliability |
| topic | Electronics / Materials Adhesives Electronic packaging Adhäsion (DE-588)4000493-4 gnd Elektroniktechnologie (DE-588)4402723-0 gnd |
| topic_facet | Electronics / Materials Adhesives Electronic packaging Adhäsion Elektroniktechnologie |
| url | http://www.sciencedirect.com/science/book/9781437778892 |
| work_keys_str_mv | AT licarijamesj adhesivestechnologyforelectronicapplicationsmaterialsprocessingreliability AT swansondalew adhesivestechnologyforelectronicapplicationsmaterialsprocessingreliability |