Lead Free Solder: Mechanics and Reliability
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
New York, NY
Springer New York
2012
|
| Schlagworte: | |
| Online-Zugang: | BTU01 FAB01 FHA01 FHI01 FHN01 FKE01 FWS01 FWS02 Volltext |
| Beschreibung: | 1 Online-Ressource |
| ISBN: | 9781461404637 |
| DOI: | 10.1007/978-1-4614-0463-7 |
Internformat
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV040124697 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 120509s2012 |||| o||u| ||||||eng d | ||
| 020 | |a 9781461404637 |9 978-1-4614-0463-7 | ||
| 024 | 7 | |a 10.1007/978-1-4614-0463-7 |2 doi | |
| 035 | |a (OCoLC)863785751 | ||
| 035 | |a (DE-599)BVBBV040124697 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-863 |a DE-862 |a DE-634 |a DE-Aug4 |a DE-92 |a DE-1043 |a DE-859 |a DE-573 | ||
| 245 | 1 | 0 | |a Lead Free Solder |b Mechanics and Reliability |c by John Hock Lye Pang |
| 264 | 1 | |a New York, NY |b Springer New York |c 2012 | |
| 300 | |a 1 Online-Ressource | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 650 | 4 | |a Ingenieurwissenschaften | |
| 650 | 4 | |a Engineering | |
| 650 | 4 | |a Materials | |
| 650 | 4 | |a Electronics | |
| 650 | 4 | |a Systems engineering | |
| 650 | 4 | |a Optical materials | |
| 650 | 4 | |a Electronics and Microelectronics, Instrumentation | |
| 650 | 4 | |a Optical and Electronic Materials | |
| 650 | 4 | |a Continuum Mechanics and Mechanics of Materials | |
| 650 | 4 | |a Circuits and Systems | |
| 700 | 1 | |a Pang, John Hock Lye |e Sonstige |4 oth | |
| 710 | 2 | |a SpringerLink (Online service) |e Sonstige |4 oth | |
| 856 | 4 | 0 | |u https://doi.org/10.1007/978-1-4614-0463-7 |x Verlag |3 Volltext |
| 912 | |a ZDB-2-ENG | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-024981983 | ||
| 966 | e | |u https://doi.org/10.1007/978-1-4614-0463-7 |l BTU01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-1-4614-0463-7 |l FAB01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-1-4614-0463-7 |l FHA01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-1-4614-0463-7 |l FHI01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-1-4614-0463-7 |l FHN01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-1-4614-0463-7 |l FKE01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-1-4614-0463-7 |l FWS01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-1-4614-0463-7 |l FWS02 |p ZDB-2-ENG |x Verlag |3 Volltext | |
Datensatz im Suchindex
| DE-BY-FWS_katkey | 435522 |
|---|---|
| _version_ | 1824554197869133824 |
| any_adam_object | |
| building | Verbundindex |
| bvnumber | BV040124697 |
| collection | ZDB-2-ENG |
| ctrlnum | (OCoLC)863785751 (DE-599)BVBBV040124697 |
| doi_str_mv | 10.1007/978-1-4614-0463-7 |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02169nmm a2200517zc 4500</leader><controlfield tag="001">BV040124697</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">120509s2012 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781461404637</subfield><subfield code="9">978-1-4614-0463-7</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-1-4614-0463-7</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)863785751</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV040124697</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-863</subfield><subfield code="a">DE-862</subfield><subfield code="a">DE-634</subfield><subfield code="a">DE-Aug4</subfield><subfield code="a">DE-92</subfield><subfield code="a">DE-1043</subfield><subfield code="a">DE-859</subfield><subfield code="a">DE-573</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Lead Free Solder</subfield><subfield code="b">Mechanics and Reliability</subfield><subfield code="c">by John Hock Lye Pang</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">New York, NY</subfield><subfield code="b">Springer New York</subfield><subfield code="c">2012</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Ingenieurwissenschaften</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Systems engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics and Microelectronics, Instrumentation</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical and Electronic Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Continuum Mechanics and Mechanics of Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Circuits and Systems</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Pang, John Hock Lye</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="710" ind1="2" ind2=" "><subfield code="a">SpringerLink (Online service)</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-1-4614-0463-7</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-ENG</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-024981983</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4614-0463-7</subfield><subfield code="l">BTU01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4614-0463-7</subfield><subfield code="l">FAB01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4614-0463-7</subfield><subfield code="l">FHA01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4614-0463-7</subfield><subfield code="l">FHI01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4614-0463-7</subfield><subfield code="l">FHN01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4614-0463-7</subfield><subfield code="l">FKE01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4614-0463-7</subfield><subfield code="l">FWS01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4614-0463-7</subfield><subfield code="l">FWS02</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV040124697 |
| illustrated | Not Illustrated |
| indexdate | 2025-02-20T06:47:57Z |
| institution | BVB |
| isbn | 9781461404637 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-024981983 |
| oclc_num | 863785751 |
| open_access_boolean | |
| owner | DE-863 DE-BY-FWS DE-862 DE-BY-FWS DE-634 DE-Aug4 DE-92 DE-1043 DE-859 DE-573 |
| owner_facet | DE-863 DE-BY-FWS DE-862 DE-BY-FWS DE-634 DE-Aug4 DE-92 DE-1043 DE-859 DE-573 |
| physical | 1 Online-Ressource |
| psigel | ZDB-2-ENG |
| publishDate | 2012 |
| publishDateSearch | 2012 |
| publishDateSort | 2012 |
| publisher | Springer New York |
| record_format | marc |
| spellingShingle | Lead Free Solder Mechanics and Reliability Ingenieurwissenschaften Engineering Materials Electronics Systems engineering Optical materials Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Continuum Mechanics and Mechanics of Materials Circuits and Systems |
| title | Lead Free Solder Mechanics and Reliability |
| title_auth | Lead Free Solder Mechanics and Reliability |
| title_exact_search | Lead Free Solder Mechanics and Reliability |
| title_full | Lead Free Solder Mechanics and Reliability by John Hock Lye Pang |
| title_fullStr | Lead Free Solder Mechanics and Reliability by John Hock Lye Pang |
| title_full_unstemmed | Lead Free Solder Mechanics and Reliability by John Hock Lye Pang |
| title_short | Lead Free Solder |
| title_sort | lead free solder mechanics and reliability |
| title_sub | Mechanics and Reliability |
| topic | Ingenieurwissenschaften Engineering Materials Electronics Systems engineering Optical materials Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Continuum Mechanics and Mechanics of Materials Circuits and Systems |
| topic_facet | Ingenieurwissenschaften Engineering Materials Electronics Systems engineering Optical materials Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Continuum Mechanics and Mechanics of Materials Circuits and Systems |
| url | https://doi.org/10.1007/978-1-4614-0463-7 |
| work_keys_str_mv | AT pangjohnhocklye leadfreesoldermechanicsandreliability AT springerlinkonlineservice leadfreesoldermechanicsandreliability |