Advanced materials for thermal management of electronic packaging:
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
New York, NY [u.a.]
Springer
2011
|
| Schriftenreihe: | Springer series in advanced microelectronics
30 |
| Schlagworte: | |
| Online-Zugang: | BTU01 FAB01 FHA01 FHI01 FHN01 FHR01 FKE01 FWS01 FWS02 Volltext |
| Beschreibung: | 1 Online-Ressource |
| ISBN: | 9781441977595 |
| DOI: | 10.1007/978-1-4419-7759-5 |
Internformat
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Datensatz im Suchindex
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| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| doi_str_mv | 10.1007/978-1-4419-7759-5 |
| format | Electronic eBook |
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| id | DE-604.BV040124496 |
| illustrated | Not Illustrated |
| indexdate | 2024-08-01T11:46:55Z |
| institution | BVB |
| isbn | 9781441977595 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-024981782 |
| oclc_num | 707187951 |
| open_access_boolean | |
| owner | DE-863 DE-BY-FWS DE-862 DE-BY-FWS DE-634 DE-898 DE-BY-UBR DE-Aug4 DE-92 DE-1043 DE-859 DE-573 |
| owner_facet | DE-863 DE-BY-FWS DE-862 DE-BY-FWS DE-634 DE-898 DE-BY-UBR DE-Aug4 DE-92 DE-1043 DE-859 DE-573 |
| physical | 1 Online-Ressource |
| psigel | ZDB-2-ENG |
| publishDate | 2011 |
| publishDateSearch | 2011 |
| publishDateSort | 2011 |
| publisher | Springer |
| record_format | marc |
| series | Springer series in advanced microelectronics |
| series2 | Springer series in advanced microelectronics |
| spellingShingle | Advanced materials for thermal management of electronic packaging Springer series in advanced microelectronics Ingenieurwissenschaften Physics Engineering Electronics Optical materials Electronic Circuits and Devices Optical and Electronic Materials Engineering Thermodynamics, Heat and Mass Transfer Electronics and Microelectronics, Instrumentation Werkstoff (DE-588)4065579-9 gnd Temperaturverhalten (DE-588)4457534-8 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| subject_GND | (DE-588)4065579-9 (DE-588)4457534-8 (DE-588)4014360-0 |
| title | Advanced materials for thermal management of electronic packaging |
| title_auth | Advanced materials for thermal management of electronic packaging |
| title_exact_search | Advanced materials for thermal management of electronic packaging |
| title_full | Advanced materials for thermal management of electronic packaging Xingcun Colin Tong |
| title_fullStr | Advanced materials for thermal management of electronic packaging Xingcun Colin Tong |
| title_full_unstemmed | Advanced materials for thermal management of electronic packaging Xingcun Colin Tong |
| title_short | Advanced materials for thermal management of electronic packaging |
| title_sort | advanced materials for thermal management of electronic packaging |
| topic | Ingenieurwissenschaften Physics Engineering Electronics Optical materials Electronic Circuits and Devices Optical and Electronic Materials Engineering Thermodynamics, Heat and Mass Transfer Electronics and Microelectronics, Instrumentation Werkstoff (DE-588)4065579-9 gnd Temperaturverhalten (DE-588)4457534-8 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| topic_facet | Ingenieurwissenschaften Physics Engineering Electronics Optical materials Electronic Circuits and Devices Optical and Electronic Materials Engineering Thermodynamics, Heat and Mass Transfer Electronics and Microelectronics, Instrumentation Werkstoff Temperaturverhalten Elektronisches Bauelement |
| url | https://doi.org/10.1007/978-1-4419-7759-5 |
| volume_link | (DE-604)BV041461435 |
| work_keys_str_mv | AT tongxingcuncolin advancedmaterialsforthermalmanagementofelectronicpackaging |