RF and microwave microelectronics packaging: "This book is an outgrowth of the firs IMAPS (International Microelectronics and Packaging Society) Advanced Technology Workshop on RF?Microwave Packaging held Sept. 16-18, 2008 in San Diego, Calf."
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
New York
Springer
2010
|
| Schlagworte: | |
| Online-Zugang: | TUM01 Volltext |
| Beschreibung: | Includes bibliographical references and index |
| Beschreibung: | 1 Online-Ressource (1 online resource (xvi, 285 p.)) |
| ISBN: | 1441909834 1441909842 9781441909831 9781441909848 |
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| indexdate | 2024-07-10T00:14:34Z |
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| isbn | 1441909834 1441909842 9781441909831 9781441909848 |
| language | English |
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| spelling | RF and microwave microelectronics packaging "This book is an outgrowth of the firs IMAPS (International Microelectronics and Packaging Society) Advanced Technology Workshop on RF?Microwave Packaging held Sept. 16-18, 2008 in San Diego, Calf." Ken Kuang, Franklin Kim, Sean S. Cahill, editors New York Springer 2010 1 Online-Ressource (1 online resource (xvi, 285 p.)) txt rdacontent c rdamedia cr rdacarrier Includes bibliographical references and index Gehäuse (DE-588)4156307-4 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 s Gehäuse (DE-588)4156307-4 s DE-604 Kuang, Ken Sonstige oth https://ebookcentral.proquest.com/lib/munchentech/detail.action?docID=510945 Aggregator Volltext |
| spellingShingle | RF and microwave microelectronics packaging "This book is an outgrowth of the firs IMAPS (International Microelectronics and Packaging Society) Advanced Technology Workshop on RF?Microwave Packaging held Sept. 16-18, 2008 in San Diego, Calf." Gehäuse (DE-588)4156307-4 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| subject_GND | (DE-588)4156307-4 (DE-588)4014360-0 |
| title | RF and microwave microelectronics packaging "This book is an outgrowth of the firs IMAPS (International Microelectronics and Packaging Society) Advanced Technology Workshop on RF?Microwave Packaging held Sept. 16-18, 2008 in San Diego, Calf." |
| title_auth | RF and microwave microelectronics packaging "This book is an outgrowth of the firs IMAPS (International Microelectronics and Packaging Society) Advanced Technology Workshop on RF?Microwave Packaging held Sept. 16-18, 2008 in San Diego, Calf." |
| title_exact_search | RF and microwave microelectronics packaging "This book is an outgrowth of the firs IMAPS (International Microelectronics and Packaging Society) Advanced Technology Workshop on RF?Microwave Packaging held Sept. 16-18, 2008 in San Diego, Calf." |
| title_full | RF and microwave microelectronics packaging "This book is an outgrowth of the firs IMAPS (International Microelectronics and Packaging Society) Advanced Technology Workshop on RF?Microwave Packaging held Sept. 16-18, 2008 in San Diego, Calf." Ken Kuang, Franklin Kim, Sean S. Cahill, editors |
| title_fullStr | RF and microwave microelectronics packaging "This book is an outgrowth of the firs IMAPS (International Microelectronics and Packaging Society) Advanced Technology Workshop on RF?Microwave Packaging held Sept. 16-18, 2008 in San Diego, Calf." Ken Kuang, Franklin Kim, Sean S. Cahill, editors |
| title_full_unstemmed | RF and microwave microelectronics packaging "This book is an outgrowth of the firs IMAPS (International Microelectronics and Packaging Society) Advanced Technology Workshop on RF?Microwave Packaging held Sept. 16-18, 2008 in San Diego, Calf." Ken Kuang, Franklin Kim, Sean S. Cahill, editors |
| title_short | RF and microwave microelectronics packaging |
| title_sort | rf and microwave microelectronics packaging this book is an outgrowth of the firs imaps international microelectronics and packaging society advanced technology workshop on rf microwave packaging held sept 16 18 2008 in san diego calf |
| title_sub | "This book is an outgrowth of the firs IMAPS (International Microelectronics and Packaging Society) Advanced Technology Workshop on RF?Microwave Packaging held Sept. 16-18, 2008 in San Diego, Calf." |
| topic | Gehäuse (DE-588)4156307-4 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| topic_facet | Gehäuse Elektronisches Bauelement |
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