Adhesives technology for electronic applications: materials, processing, reliability
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Amsterdam [u.a.]
Elsevier
2011
|
| Ausgabe: | 2. ed |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Beschreibung: | Includes bibliographical references and index |
| Beschreibung: | 1 Online-Ressource (viii, 403 p.) ill. |
| ISBN: | 9781437778892 1437778895 9781437778908 |
Internformat
MARC
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| 001 | BV039706897 | ||
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| 005 | 20120116 | ||
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| 020 | |a 9781437778892 |c Print |9 978-1-4377-7889-2 | ||
| 020 | |a 1437778895 |c Print |9 1-4377-7889-5 | ||
| 020 | |a 9781437778908 |c Online |9 978-1-4377-7890-8 | ||
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| 040 | |a DE-604 |b ger |e rakwb | ||
| 041 | 0 | |a eng | |
| 100 | 1 | |a Licari, James J. |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Adhesives technology for electronic applications |b materials, processing, reliability |c James J. Licari and Dale W. Swanson |
| 250 | |a 2. ed | ||
| 264 | 1 | |a Amsterdam [u.a.] |b Elsevier |c 2011 | |
| 300 | |a 1 Online-Ressource (viii, 403 p.) |b ill. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 500 | |a Includes bibliographical references and index | ||
| 650 | 4 | |a Electronics / Materials | |
| 650 | 4 | |a Adhesives | |
| 650 | 4 | |a Electronic packaging | |
| 650 | 0 | 7 | |a Adhäsion |0 (DE-588)4000493-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Elektroniktechnologie |0 (DE-588)4402723-0 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Elektroniktechnologie |0 (DE-588)4402723-0 |D s |
| 689 | 0 | 1 | |a Adhäsion |0 (DE-588)4000493-4 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Swanson, Dale W. |e Verfasser |4 aut | |
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| 776 | 0 | 8 | |i Erscheint auch als |n Druckausgabe |z 1-4377-7889-5 |
| 856 | 4 | 0 | |u http://www.knovel.com/web/portal/browse/display?_EXT_KNOVEL_DISPLAY_bookid=4289 |3 Volltext |
| 912 | |a ZDB-10-ESC | ||
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Datensatz im Suchindex
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| id | DE-604.BV039706897 |
| illustrated | Illustrated |
| indexdate | 2024-07-31T01:10:26Z |
| institution | BVB |
| isbn | 9781437778892 1437778895 9781437778908 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-024555293 |
| oclc_num | 873880854 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM |
| owner_facet | DE-91 DE-BY-TUM |
| physical | 1 Online-Ressource (viii, 403 p.) ill. |
| psigel | ZDB-10-ESC |
| publishDate | 2011 |
| publishDateSearch | 2011 |
| publishDateSort | 2011 |
| publisher | Elsevier |
| record_format | marc |
| spelling | Licari, James J. Verfasser aut Adhesives technology for electronic applications materials, processing, reliability James J. Licari and Dale W. Swanson 2. ed Amsterdam [u.a.] Elsevier 2011 1 Online-Ressource (viii, 403 p.) ill. txt rdacontent c rdamedia cr rdacarrier Includes bibliographical references and index Electronics / Materials Adhesives Electronic packaging Adhäsion (DE-588)4000493-4 gnd rswk-swf Elektroniktechnologie (DE-588)4402723-0 gnd rswk-swf Elektroniktechnologie (DE-588)4402723-0 s Adhäsion (DE-588)4000493-4 s DE-604 Swanson, Dale W. Verfasser aut Erscheint auch als Druckausgabe 978-1-4377-7889-2 Erscheint auch als Druckausgabe 1-4377-7889-5 http://www.knovel.com/web/portal/browse/display?_EXT_KNOVEL_DISPLAY_bookid=4289 Volltext |
| spellingShingle | Licari, James J. Swanson, Dale W. Adhesives technology for electronic applications materials, processing, reliability Electronics / Materials Adhesives Electronic packaging Adhäsion (DE-588)4000493-4 gnd Elektroniktechnologie (DE-588)4402723-0 gnd |
| subject_GND | (DE-588)4000493-4 (DE-588)4402723-0 |
| title | Adhesives technology for electronic applications materials, processing, reliability |
| title_auth | Adhesives technology for electronic applications materials, processing, reliability |
| title_exact_search | Adhesives technology for electronic applications materials, processing, reliability |
| title_full | Adhesives technology for electronic applications materials, processing, reliability James J. Licari and Dale W. Swanson |
| title_fullStr | Adhesives technology for electronic applications materials, processing, reliability James J. Licari and Dale W. Swanson |
| title_full_unstemmed | Adhesives technology for electronic applications materials, processing, reliability James J. Licari and Dale W. Swanson |
| title_short | Adhesives technology for electronic applications |
| title_sort | adhesives technology for electronic applications materials processing reliability |
| title_sub | materials, processing, reliability |
| topic | Electronics / Materials Adhesives Electronic packaging Adhäsion (DE-588)4000493-4 gnd Elektroniktechnologie (DE-588)4402723-0 gnd |
| topic_facet | Electronics / Materials Adhesives Electronic packaging Adhäsion Elektroniktechnologie |
| url | http://www.knovel.com/web/portal/browse/display?_EXT_KNOVEL_DISPLAY_bookid=4289 |
| work_keys_str_mv | AT licarijamesj adhesivestechnologyforelectronicapplicationsmaterialsprocessingreliability AT swansondalew adhesivestechnologyforelectronicapplicationsmaterialsprocessingreliability |