Advanced Materials for Thermal Management of Electronic Packaging:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
New York, NY [u.a.]
Springer
2011
|
| Schriftenreihe: | Springer Series in Advanced Microelectronics
30 |
| Schlagworte: | |
| Online-Zugang: | Inhaltstext |
| Beschreibung: | XXI, 616 S. Ill., graph. Darst. |
| ISBN: | 9781441977588 |
Internformat
MARC
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| 001 | BV039633818 | ||
| 003 | DE-604 | ||
| 005 | 20120131 | ||
| 007 | t | ||
| 008 | 111013s2011 ad|| |||| 00||| eng d | ||
| 015 | |a 10,N36 |2 dnb | ||
| 016 | 7 | |a 1006409750 |2 DE-101 | |
| 020 | |a 9781441977588 |9 978-1-441-97758-8 | ||
| 035 | |a (OCoLC)837896327 | ||
| 035 | |a (DE-599)DNB1006409750 | ||
| 040 | |a DE-604 |b ger |e rakddb | ||
| 041 | 0 | |a eng | |
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| 245 | 1 | 0 | |a Advanced Materials for Thermal Management of Electronic Packaging |c Xingcun Colin Tong |
| 264 | 1 | |a New York, NY [u.a.] |b Springer |c 2011 | |
| 300 | |a XXI, 616 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 1 | |a Springer Series in Advanced Microelectronics |v 30 | |
| 650 | 0 | 7 | |a Werkstoff |0 (DE-588)4065579-9 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Temperaturverhalten |0 (DE-588)4457534-8 |2 gnd |9 rswk-swf |
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| 689 | 0 | 1 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |D s |
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| 689 | 0 | |5 DE-604 | |
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| 830 | 0 | |a Springer Series in Advanced Microelectronics |v 30 |w (DE-604)BV012563021 |9 30 | |
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Datensatz im Suchindex
| _version_ | 1805145350132989952 |
|---|---|
| adam_text | |
| any_adam_object | |
| author | Tong, Xingcun Colin |
| author_facet | Tong, Xingcun Colin |
| author_role | aut |
| author_sort | Tong, Xingcun Colin |
| author_variant | x c t xc xct |
| building | Verbundindex |
| bvnumber | BV039633818 |
| classification_rvk | ZN 4192 |
| ctrlnum | (OCoLC)837896327 (DE-599)DNB1006409750 |
| dewey-full | 620 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 620 - Engineering and allied operations 621 - Applied physics |
| dewey-raw | 620 621.381 |
| dewey-search | 620 621.381 |
| dewey-sort | 3620 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Maschinenbau / Maschinenwesen Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| illustrated | Illustrated |
| indexdate | 2024-07-21T00:12:36Z |
| institution | BVB |
| isbn | 9781441977588 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-024483887 |
| oclc_num | 837896327 |
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| physical | XXI, 616 S. Ill., graph. Darst. |
| publishDate | 2011 |
| publishDateSearch | 2011 |
| publishDateSort | 2011 |
| publisher | Springer |
| record_format | marc |
| series | Springer Series in Advanced Microelectronics |
| series2 | Springer Series in Advanced Microelectronics |
| spelling | Tong, Xingcun Colin Verfasser aut Advanced Materials for Thermal Management of Electronic Packaging Xingcun Colin Tong New York, NY [u.a.] Springer 2011 XXI, 616 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Springer Series in Advanced Microelectronics 30 Werkstoff (DE-588)4065579-9 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Temperaturverhalten (DE-588)4457534-8 gnd rswk-swf Werkstoff (DE-588)4065579-9 s Elektronisches Bauelement (DE-588)4014360-0 s Temperaturverhalten (DE-588)4457534-8 s DE-604 Erscheint auch als Online-Ausgabe 978-1-4419-7759-5 Springer Series in Advanced Microelectronics 30 (DE-604)BV012563021 30 X:MVB text/html http://deposit.dnb.de/cgi-bin/dokserv?id=3530413&prov=M&dok_var=1&dok_ext=htm Inhaltstext |
| spellingShingle | Tong, Xingcun Colin Advanced Materials for Thermal Management of Electronic Packaging Springer Series in Advanced Microelectronics Werkstoff (DE-588)4065579-9 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd Temperaturverhalten (DE-588)4457534-8 gnd |
| subject_GND | (DE-588)4065579-9 (DE-588)4014360-0 (DE-588)4457534-8 |
| title | Advanced Materials for Thermal Management of Electronic Packaging |
| title_auth | Advanced Materials for Thermal Management of Electronic Packaging |
| title_exact_search | Advanced Materials for Thermal Management of Electronic Packaging |
| title_full | Advanced Materials for Thermal Management of Electronic Packaging Xingcun Colin Tong |
| title_fullStr | Advanced Materials for Thermal Management of Electronic Packaging Xingcun Colin Tong |
| title_full_unstemmed | Advanced Materials for Thermal Management of Electronic Packaging Xingcun Colin Tong |
| title_short | Advanced Materials for Thermal Management of Electronic Packaging |
| title_sort | advanced materials for thermal management of electronic packaging |
| topic | Werkstoff (DE-588)4065579-9 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd Temperaturverhalten (DE-588)4457534-8 gnd |
| topic_facet | Werkstoff Elektronisches Bauelement Temperaturverhalten |
| url | http://deposit.dnb.de/cgi-bin/dokserv?id=3530413&prov=M&dok_var=1&dok_ext=htm |
| volume_link | (DE-604)BV012563021 |
| work_keys_str_mv | AT tongxingcuncolin advancedmaterialsforthermalmanagementofelectronicpackaging |