Modeling and simulation for microelectronic packaging assembly: manufacture, reliability, and testing
Saved in:
| Main Author: | |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
Singapore
Wiley
2011
|
| Online Access: | Buchcover |
| Item Description: | Includes bibliographical references and index |
| Physical Description: | XXII, 564 S. Ill., graph. Darst. |
| ISBN: | 9780470827802 |
Staff View
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Record in the Search Index
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| any_adam_object | 1 |
| author | Liu, Sheng |
| author_facet | Liu, Sheng |
| author_role | aut |
| author_sort | Liu, Sheng |
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| building | Verbundindex |
| bvnumber | BV039596200 |
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| dewey-full | 621.381046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381046 |
| dewey-search | 621.381046 |
| dewey-sort | 3621.381046 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV039596200 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T00:07:03Z |
| institution | BVB |
| isbn | 9780470827802 |
| language | English |
| lccn | 2011019534 |
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| physical | XXII, 564 S. Ill., graph. Darst. |
| publishDate | 2011 |
| publishDateSearch | 2011 |
| publishDateSort | 2011 |
| publisher | Wiley |
| record_format | marc |
| spelling | Liu, Sheng Verfasser aut Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing Sheng Liu ; Yong Liu Singapore Wiley 2011 XXII, 564 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Includes bibliographical references and index Liu, Yong Sonstige oth SWB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=024447185&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Buchcover |
| spellingShingle | Liu, Sheng Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing |
| title | Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing |
| title_auth | Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing |
| title_exact_search | Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing |
| title_full | Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing Sheng Liu ; Yong Liu |
| title_fullStr | Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing Sheng Liu ; Yong Liu |
| title_full_unstemmed | Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing Sheng Liu ; Yong Liu |
| title_short | Modeling and simulation for microelectronic packaging assembly |
| title_sort | modeling and simulation for microelectronic packaging assembly manufacture reliability and testing |
| title_sub | manufacture, reliability, and testing |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=024447185&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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