Modeling and simulation for microelectronic packaging assembly: manufacture, reliability, and testing
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Singapore
Wiley
2011
|
| Online-Zugang: | Buchcover |
| Beschreibung: | Includes bibliographical references and index |
| Beschreibung: | XXII, 564 S. Ill., graph. Darst. |
| ISBN: | 9780470827802 |
Internformat
MARC
| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV039596200 | ||
| 003 | DE-604 | ||
| 005 | 20111104 | ||
| 007 | t | ||
| 008 | 110922s2011 ad|| |||| 00||| eng d | ||
| 010 | |a 2011019534 | ||
| 020 | |a 9780470827802 |c hardback |9 978-0-470-82780-2 | ||
| 035 | |a (OCoLC)837690106 | ||
| 035 | |a (DE-599)GBV66209221X | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-83 | ||
| 082 | 0 | |a 621.381046 | |
| 084 | |a ZN 4192 |0 (DE-625)157372: |2 rvk | ||
| 100 | 1 | |a Liu, Sheng |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Modeling and simulation for microelectronic packaging assembly |b manufacture, reliability, and testing |c Sheng Liu ; Yong Liu |
| 264 | 1 | |a Singapore |b Wiley |c 2011 | |
| 300 | |a XXII, 564 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 500 | |a Includes bibliographical references and index | ||
| 700 | 1 | |a Liu, Yong |e Sonstige |4 oth | |
| 856 | 4 | 2 | |m SWB Datenaustausch |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=024447185&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |3 Buchcover |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-024447185 | ||
Datensatz im Suchindex
| _version_ | 1804148433310711808 |
|---|---|
| any_adam_object | 1 |
| author | Liu, Sheng |
| author_facet | Liu, Sheng |
| author_role | aut |
| author_sort | Liu, Sheng |
| author_variant | s l sl |
| building | Verbundindex |
| bvnumber | BV039596200 |
| classification_rvk | ZN 4192 |
| ctrlnum | (OCoLC)837690106 (DE-599)GBV66209221X |
| dewey-full | 621.381046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381046 |
| dewey-search | 621.381046 |
| dewey-sort | 3621.381046 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV039596200 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T00:07:03Z |
| institution | BVB |
| isbn | 9780470827802 |
| language | English |
| lccn | 2011019534 |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-024447185 |
| oclc_num | 837690106 |
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| physical | XXII, 564 S. Ill., graph. Darst. |
| publishDate | 2011 |
| publishDateSearch | 2011 |
| publishDateSort | 2011 |
| publisher | Wiley |
| record_format | marc |
| spelling | Liu, Sheng Verfasser aut Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing Sheng Liu ; Yong Liu Singapore Wiley 2011 XXII, 564 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Includes bibliographical references and index Liu, Yong Sonstige oth SWB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=024447185&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Buchcover |
| spellingShingle | Liu, Sheng Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing |
| title | Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing |
| title_auth | Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing |
| title_exact_search | Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing |
| title_full | Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing Sheng Liu ; Yong Liu |
| title_fullStr | Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing Sheng Liu ; Yong Liu |
| title_full_unstemmed | Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing Sheng Liu ; Yong Liu |
| title_short | Modeling and simulation for microelectronic packaging assembly |
| title_sort | modeling and simulation for microelectronic packaging assembly manufacture reliability and testing |
| title_sub | manufacture, reliability, and testing |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=024447185&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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