Microsystems and nanotechnology:
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Heidelberg [u.a.]
Springer
2012
Beijing Tsinghua Univ. Press |
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | Literaturangaben |
| Beschreibung: | XXII, 1004 S. Ill., graph. Darst. |
| ISBN: | 9787302243076 9783642182921 |
Internformat
MARC
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| 245 | 1 | 0 | |a Microsystems and nanotechnology |c Zhaoying Zhou ... [Eds.] |
| 264 | 1 | |a Heidelberg [u.a.] |b Springer |c 2012 | |
| 264 | 1 | |a Beijing |b Tsinghua Univ. Press | |
| 300 | |a XXII, 1004 S. |b Ill., graph. Darst. | ||
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Datensatz im Suchindex
| _version_ | 1804145620628275200 |
|---|---|
| adam_text | IMAGE 1
CONTENTS
FUNDAMENTALS OF MICROSYSTEM AND NANOTECHNOLOGY 1 INFORMATION ELECTRONICS
IN THE NANOTECHNOLOGY ERA 3
1.1 INTRODUCTION 3
1.2 NANO-CMOS TECHNOLOGY : 4
1.2.1 PROGRESS O F CMOS TECHNOLOGY 4
1.2.2 THE SECOND-ORDER EFFECTS IN SMALL-SIZE MOSFETS 5 1.2.3 NEW
STRUCTURES AND MATERIALS FOR NANO-MOSFETS 10 1.2.4 HIGH-PERFORMANCE ULSI
INTERCONNECTION 13
1.3 NON-CMOS NANOELECTRONIC DEVICES 14
1.3.1 QUANTUM-RESONANT TUNNELING DEVICES 15
1.3.2 SINGLE ELECTRON TRANSISTOR 18
1.3.3 CARBON NANOTUBES (CNT) ELECTRONICS 20
1.3.4 SPIN ELECTRONICS 22
1.3.5 SUPERCONDUCTOR ELECTRONICS 26
1.3.6 MOLECULAR ELECTRONICS * . 29
1.3.7 NANOELECTROMECHANICAL SYSTEM (NEMS) 31
1.4 QUANTUM INFORMATION PROCESSING 32
1.4.1 BASIC CONCEPT O F QUANTUM INFORMATION PROCESSING 33 1.4.2 ENERGY
ANALYSIS O F QUANTUM COMPUTERS 35
1.4.3 PHYSICAL REALIZATION O F QUANTUM COMPUTATION 38
1.5 CONCLUSION 39
REFERENCES 39
2 MICRO/NANO FLUIDICS MECHANICS AND TRANSDUCERS 45
2.1 INTRODUCTION ^ 46
2.2 PHYSICAL CONSTANTS 47
2.3 FLUIDIC SYSTEMS BASED ON HYDRODYNAMIC FORCE 50
2.4 DIRECT MANIPULATION O F BIOLOGICAL OBJ ECT BY HYDRODYNAMIC FIELD 51
2.4.1 SINGLE CELL MANIPULATION 51
2.4.2 DNA MANIPULATION 52
2.5 ELECTROKINETIC FORCE FIELDS 52
2.5.1 ELECTROTHERMAL FLOW 53
2.5.2 ELECTROOSMOSIS 53
HTTP://D-NB.INFO/1008972347
IMAGE 2
2.5.3 AC ELECTROOSMOSIS 54
2.5.4 ELECTROWETTING 56
2.5.5 ELECTROPHORESIS 56
2.5.6 DIELECTROPHORESIS 57
2.6 MICROFLUIDIC PROCESSES FOR BIOANALYSES 58
2.6.1 SAMPLE CONCENTRATION 58
2.6.2 MIXING 60
2.6.3 SEPARATION 61
2.6.4 ELECTROCHEMICAL DNA DETECTION 62
2.6.5 PROTEIN DETECTION 64
2.7 CONCLUSIONS 66
ACKNOWLEDGEMENTS 66
REFERENCES 67
3 MATERIAL ISSUES FOR MICROSYSTEMS 71
3.1 FAILURE MECHANISMS O F MATERIALS USED IN MICROSYSTEMS 72 3.1.1
FRACTURE MECHANISM 72
3.1.2 STICTION, FRICTION, AND WEAR 74
3.1.3 FRACTOGRAPHANALYSIS 75
3.2 METHODS FOR MEASURING MECHANICAL PROPERTIES OF MATERIALS USED IN
MICROSYSTEMS 76
3.2.1 MICRO TENSILE TESTING 76
3.2.2 RESONANCE FREQUENCY METHOD 79
3.2.3 BULGE L E S T 79
3.2.4 NANOINDENTATION 82
3.2.5 BEAM BENDING TEST 84
3.2.6 TEST FOR FATIGUE CHARACTERISTIC AND FRACTURE TOUGHNESS K L C O F
MEMS MATERIALS 86
3.3 STRUCTURE MATERIALS FOR MICROSYSTEMS 89
3.3.1 MECHANICAL PROPERTIES O F SILICON AND SILICIDES 89
3.3.2 PARYLENE S PROPERTIES AND ITS APPLICATIONS 99
3.4 MATERIALS FOR MICROTRIBOLOGICAL APPLICATION 105
3.4.1 SELF-ASSEMBLED MONOLAYER (SAM) FILM 105
3.4.2 EXTRA-THIN HAIRD FILM 108
REFERENCES 110
4 NANOPIEZOTRONICS AND NANOGENERATORS 115
4.1 PIEZOTRONIC PROPERTY O F ZNO NANOWIRES 115
4.1.1 CRYSTAL STRUCTURE O F ZNO 115
4.1.2 PIEZOELECTRICITY O F ZNO NANOWIRE 116
4.1.3 COMBINATION O F PIEZOELECTRIC AND SEMICONDUCTING PROPERTIES 120
VI
IMAGE 3
4.2 PIEZOTRONICS NANODEVICES FROM ZNO NANOWIRES 122
4.2.1 PE-FET AND FORCE SENSOR 122
4.2.2 CHEMICAL/HUMIDITY NANOSENSORS 126
4.2.3 MECHANICAL-ELECTRICAL STRAIN SENSORS 128
4.3 ZNO NANOWIRE NANOGENERATORS 132
4.3.1 SINGLE NANOWIRE NANOGENERATOR 132
4.3.2 DIRECT CURRENT NANOGENERATOR 135
4.3.3 FLEXIBLE NANOGENERATOR AND POWER FIBER 140
4.4 OUTLOOK 144
ACKNOWLEDGEMENTS 145
REFERENCES 145
5 ELECTRON TRANSPORT IN SINGLE MOLECULES AND NANOSTRUCTURES 149 5.1
ELECTRON TRANSPORT IN NANOSCALE JUNCTIONS 149
5.2 CONDUCTANCE MEASUREMENT 151
5.2.1 LANDAUER FORMULA AND QUANTIZED CONDUCTANCE 151
5.2.2 CONDUCTANCE O F A SINGLE ATOM 152
5.2.3 CONDUCTANCE O F A SINGLE MOLECULE 152
5.3 SINGLE BARRIER TUNNEL JUNCTION AND RESONANT TUNNELING 154 5.3.1
ELECTRON TUNNELING IN STM 154
5.3.2 SCANNING TUNNELING SPECTROSCOPY O F SINGLE MOLECULES 155 5.4
DOUBLE BARRIER TUNNEL JUNCTION AND SINGLE ELECTRON PHENOMENA 157 5.4.1
SINGLE ELECTRON PHENOMENA 157
5.4.2 THE ATOMIC-LIKE STATE IN NANOCRYSTAL QUANTUM DOTS 158 5.4.3 SET IN
3D NANOCLUSTER AND THE QUANTUM SIZE EFFECT 159 5.4.4 SET IN 2D
NANOCLUSTERS AND NONCLASSICAL CAPACITANCE 160 5.4.5 SUPPRESSION O F
QUANTUM CONFINEMENT EFFECTS IN
AMORPHOUS METAL NANOPARTICLES 161
5.4.6 SINGLE ELECTRON TUNNELING IN SINGLE MOLECULES 164
5.5 RECTIFYING EFFECT IN SINGLE MOLECULES 166
5.5.1 AVIRAM-RATNER MECHANISM FOR A SINGLE MOLECULE RECTIFIER 166 5.5.2
SINGLE MOLECULE RECTIFIER WITH AR MECHANISM 167
5.5.3 SINGLE C59N MOLECULE AS A RECTIFIER 168
5.6 NDR EFFECT. 169
5.6.1 RESONANT TUNNELING AND NDR EFFECT IN NANOSTRUCTURES 169 5.6.2 NDR
EFFECT INVOLVING TWO C60 MOLECULES 171
5.6.3 NDR EFFECT INVOLVING TWO METAL NANOPARTICLES 172 5.6.4 LOCAL
ORBITAL SYMMETRY MATCHING MECHANISM FOR NDR EFFECT 172
5.7 KONDO EFFECT 174
5.7.1 KONDO EFFECT REVISITED ON THE NANOSCALE 174
5.7.2 KONDO EFFECT IN SINGLE ATOMS ADSORBED ON SURFACES 174
VII
IMAGE 4
5.7.3 KONDO EFFECT IN SINGLE MAGNETIC MOLECULES 175
5.8 INELASTIC ELECTRON TUNNELING SPECTROSCOPY (IETS) 177
5.8.1 IETS O F SINGLE MOLECULES 177
5.8.2 SPIN-FLIP SPECTROSCOPY O F SINGLE MAGNETIC ATOMS 178
ACKNOWLEDGEMENTS 179
REFERENCES 180
MICROSYSTEM
6 INTRODUCTION TO MEMS 187
6.1 WHAT IS MEMS 187
6.2 MEMS TECHNOLOGY 188
6.2.1 STRONG TIES TO SEMICONDUCTOR TECHNOLOGY 189
6.2.2 FUNDAMENTAL MEMS TECHNIQUES 189
6.3 A BRIEF HISTORY O F MEMS 194
6.3.1 THE BEGINNING O F ELECTRONIC MINIATURIZATION 195
6.3.2 THE BEGINNING O F MECHANICAL MINIATURIZATION 195
6.3.3 MEMS APPLICATIONS AND PROSPECTS 198
6.4 FUTURE O F MEMS 199
6.4.1 MULTIDISCIPLINE AND SYSTEM AS THE KEY WORDS 199
6.4.2 PROMISING FUTURE DIRECTIONS 200
6.5 CONCLUSIONS 201
ACKNOWLEDGEMENTS 201
REFERENCES 201
7 MICROELECTROMECHANICAL SENSORS 207
7.1 INTRODUCTION 207
7.1.1 PHYSICAL SENSORS 209
7.1.2 CHEMICAL SENSORS 209
7.1.3 BIOLOGICAL SENSORS 210
7.2 RESONANT MECHANICAL SENSORS 211
7.2.1 RESONANT PRESSURE SENSORS 212
7.2.2 RESONANT ACCELEROMETERS 217
7.2.3 RESONANT GAS FLOW SENSORS 219
7.3 SILICON BASED ELECTROSTATIC FIELD SENSORS 221
7.3.1 SENSING PRINCIPLE 221
7.3.2 STRUCTURE O F MEMS EFS 223
7.3.3 ELECTRONICS AND NOISE 226
7.3.4 TESTING AND CHARACTERISTIC 226
7.4 MEMS BASED MICROGAS SENSOR 228
7.4.1 MICROHOTPLATE GAS SENSOR 228
7.4.2 MICROGAS SENSOR ARRAY 230
7.4.3 NANOFIBER BASED GAS SENSING MATERIALS 232
VIII
IMAGE 5
7.5 WAVEGUIDE-BASED NANOPOROUS THIN-FILM SENSORS FOR
CHEMICAL, BIOLOGICAL AND GAS DETECTION 234
7.6 ELECTROCHEMICAL REACTION BASED BIOCHEMICAL SENSORS 243 7.6.1
ION-SENSITIVE FIELD EFFECT TRANSISTOR (ISFET) PH SENSORS......243 7.6.2
HEMOGLOBIN BIOSENSORS BASED ON ISFET 247
7.6.3 AMPEROMETRIC IMMUNOSENSORS 251
REFERENCES 254
8 MEMS DESIGN 261
8.1 INTRODUCTION 261
8.2 MEMS DESIGN TOOLS 264
8.2.1 CAD FRAMEWORK 265
8.2.2 ANALYSIS, OPTIMIZATION AND FABRICATION TOOLS 266
8.3 BULK-MICROMACHINING BASED MEMS DESIGN 267
8.4 SURFACE-MICROMACHINING BASED MEMS DESIGN 275
8.5 FUTURE TRENDS AND SUMMARY ; 281
REFERENCES 282
9 MEMS PROCESSING AND FABRICATION TECHNIQUES AND
TECHNOLOGY-SILICON-BASED MICROMACHINING 287
9.1 SURFACE MICROMACHINING TECHNOLOGY 288
9.1.1 INTRODUCTION 288
9.1.2 STANDARD SURFACE MICROMACHINING TECHNOLOGY AND MULTILAYER
POLYSILICON 290
9.1.3 METALLIZATION 291
9.1.4 ISOLATION 298
9.1.5 MONOLITHIC INTEGRATED SURFACE MICROMACHINING TECHNOLOGY 305
9.1.6 3D SURFACE MACHING 308
9.1.7 OTHER SURFACE MICROMACHINING TECHNOLOGY 310
9.2 BULK MICROMACHINING 314
9.2.1 INTRODUCTION O F KEY PROCESSES 315
9.2.2 SETS O F BULK MICROMACHING PROCESS 319
9.2.3 COMBINING WAFER BONDING WITH DRIE 320
9.2.4 SOI MEMS 329
9.2.5 SCREAM 333
9.2.6 INTEGRATION O F BULK MICROMACHINED MEMS WITH IC 335 REFERENCES !
342
10 OPTICAL MEMS AND NANOPHOTONICS 353
10.1 ACTUATION MECHANISMS 354
10.1.1 ELECTROSTATIC ACTUATION 354
IX
IMAGE 6
10.1.2 MAGNETIC ACTUATION 355
10.1.3 THERMAL ACTUATION 356
10.1.4 OTHER ACTUATION MECHANISMS 357
10.2 APPLICATIONS 357
10.2.1 DISPLAY, IMAGING, AND MICROSCOPY 357
10.2.2 OPTICAL COMMUNICATION 369
10.2.3 NANOPHOTONICS 395
10.3 CONCLUSION 403
REFERENCES 403
11 INTRODUCTION TO MEMS PACKAGING 415
11.1 INTRODUCTION 415
11.2 MEMS PACKAGING FUNDAMENTALS 416
11.3 CONTEMPORARY MEMS PACKAGING APPROACHES 418
11.4 BONDING PROCESSES FOR MEMS PACKAGING APPLICATIONS 420 11.4.1 FUSION
BONDING FOR MEMS PACKAGING 420
11.4.2 ANODIC BONDING FOR MEMS PACKAGING APPLICATIONS 420 11.4.3 EPOXY
BONDING (ADHESIVE BONDING) 423
11.4.4 EUTECTIC BONDING 423
11.4.5 SOLDER BONDING 423
11.4.6 LOCALIZED HEATING AND BONDING 424
11.5 HERMETIC/VACUUM PACKAGING AND APPLICATIONS 425
11.5.1 INTEGRATED MICROMACHINING PROCESSES 425
11.5.2 POST-PACKAGING PROCESS 428
11.5.3 LOCALIZED HEATING AND BONDING 432
11.5.4 HYBRID APPROACH 434
11.6 PACKAGING RELIABILITY AND ACCELERATED TESTING 434
11.7 FUTURE TRENDS AND SUMMARY 439
REFERENCES 441
NANOTECHNOLOGY
12 ADVANCEMENT OF LASER-ASSISTED AND ROLLER-BASED NANOIMPRINTING
TECHNOLOGY 449
12.1 INTRODUCTION.... . 449
12.2 FUNDAMENTAL MECHANISM O F LASER-ASSISTED DIRECT IMPRINTING (LADI)
453
12.2.1 ELASTODYNAMIC MODELING O F IMPRINTING PROCESS 454 12.2.2
NUMERICAL SIMULATION RESULTS 457
12.2.3 EXPERIMENTAL VERIFICATION O F LADI S MECHANISM 459 12.3
ROLLER-BASED LASER-ASSISTED DIRECT IMPRINTING 463
12.3.1 EXPERIMENTAL SETUP FOR ROLLER-BASED LADI 465
12.3.2 EXPERIMENTAL RESULTS O F ROLIER-BASED LADI 466
X
IMAGE 7
12.3.3 ANALYSIS AND CONCLUSION 469
12.4 LASER-ASSISTED DIRECT METAL FILM PATTERNING (LAMP) 471 12.4.1
DIRECT METAL FILM PATTERNING USING IR LASER HEATING 471 12.4.2
EXPERIMENTAL DETAILS AND RESULTS 473
12.4.3 DISCUSSIONS 479
12.5 CONTACT TRANSFER AND MASK EMBEDDED LITHOGRAPHY (CMEL) 480 12.5.1
BASIC IDEA AND EXPERIMENTAL SETUP 480
12.5.2 EXPERIMENTAL DETAILS AND RESULTS 481
12.5.3 DISCUSSIONS AND CONCLUSIONS 487
12.6 CONCLUSIONS AND FUTURE PERSPECTIVES 487
ACKNOWLEDGEMENTS 490
REFERENCES 490
13 THE APPLICATION OF STM AND AFM IN NANOPROCESS AND FABRICATION ....
495 13.1 INTRODUCTION 495
13.2 THE MANIPULATION AND PROCESSING OF SINGLE ATOMS AND MOLECULES 496
13.3 NANOLITHOGRAPHY ON SURFACES 500
13.4 NANOSCALE SURFACE PROCESSING BASED ON ELECTROCHEMICAL REACTIONS 502
13.5 METAL NANOSTRUCTURES FABRICATED WITH FIELD EVAPORATION 503 13.6
DIP-PEN NANOLITHOGRAPHY 504
13.7 NANOGRAFTING 506
13.8 NANOPROCESS WITH HEATABLE AFM TIPS 507
13.9 SUMMARY AND PERSPECTIVE 508
REFERENCES 508
14 NANOSCALE FABRICATION 513
14.1 INTRODUCTION.... 513
14.2 ELECTRON BEAM LITHOGRAPHY (EBL) 515
14.2.1 PROJECTION PRINTING EBL 515
14.2.2 DIRECT WRITING AND LIFT-OFF PROCESS 517
14.3 ION BEAM LITHOGRAPHY (IBL) 520
14.3.1 IBL PROJECTION PRINTING 521
14.3.2 FIBL DIRECT WRITING/MILLING 523
14.3.3 FIBL DIRECT WRITING/IMPLANTATION 525
14.3.4 FIBL DIRECT WRITING/DEPOSITION 526
14.4 NANOIMPRINT LITHOGRAPHY (NIL) 529
14.4.1 DEVELOPMENT O F NIL 529
14.4.2 VARIATIONS IN NIL 531
14.4.3 CRITICAL PARAMETERS AND CHALLENGES 533
14.5 SCANNING TUNNELING MICROSCOPIC LITHOGRAPHY (STML) 535
XI
IMAGE 8
14.5.1 NANOSCALE MANIPULATION 535
14.5.2 MATERIAL MODIFICATION 540
14.5.3 MATERIAL DEPOSITION 541
14.5.4 MATERIAL REMOVAL AND ETCHING 543
14.6 ATOMIC FORCE MICROSCOPIC LITHOGRAPHY (AFML) 544
14.6.1 NANOSCALE MANIPULATION 544
14.6.2 MATERIAL MODIFICATIONS 547
14.6.3 MATERIAL OXIDATION 547
14.6.4 MATERIAL REMOVAL 550
14.6.5 PARALLEL PROCESSING 554
14.7 DIP-PEN NANOLITHOGRAPHY (DPN) 555
14.7.1 BIOLOGICAL-BASED NANOSTRUCTURES BY DPN 556
14.7.2 DPN O F CHEMICAL MATERIALS 557
14.7.3 PARALLEL PROCESSING O F DPN 559
14.8 SELF-ASSEMBLY/BOTTOM-UP APPROACH 560
14.8.1 PATTERN FORMATION AND TRANSFER MEDIATED BY SELF-ASSEMBLY 560
14.8.2 TEMPLATED SELF-ASSEMBLY USING BIOLOGICAL STRUCTURES 561 14.8.3
FORCE FIELD DIRECTED SELF-ASSEMBLY 562
14.9 CONCLUDING REMARKS 564
ACKNOWLEDGEMENTS ! 567
REFERENCES 567
15 INTEGRATED NANOTECHNOLOGY BASED ON MEMS 579
15.1 INTRODUCTION 579
15.1.1 REVIEW O F MEMS FABRICATION TECHNOLOGIES 579 15.1.2 MEMS
TECHNIQUES FOR NANOMETRIC FABRICATION 583 15.1.3 POTENTIAL AND
CAPABILITY O F MEMS FOR THE DOWN-SCALE INTEGRATION 584
15.2 TECHNICAL TREND FROM MEMS TO NEMS 585
15.3 INTEGRATED NANOMACHINING TECHNOLOGIES 587
15.4 NANOELECTROMECHANICAL SIZE-EFFECT 593
15.5 TYPICAL MEMS-MADE NEMS DEVICES 599
15.6 PROSPECT O F NEMS TECHNOLOGY 602
REFERENCES 603
APPLICATION ISSUES
16 APPLICATIONS OF MICROELECTRO-MECHANICAL SYSTEMS 609
16.1 BRIEF HISTORY AND TRENDS O F MICROELECTRO-MECHANICAL SYSTEM 609
16.2 APPLICATION O F MEMS 613
16.3 AN IMPORTANT OPENING APPLICATION FIELD-BIO-MEDICAL APPLICATIONS 614
XII
IMAGE 9
16.4 APPLICATIONS O F IMPLANTABLE MEMS-PHYSICAL THERAPY,
MEDICAL CARE AND DRUG DEVELOPMENTS 615
REFERENCES 617
17 MICROELECTROMECHANICAL SENSOR-BASED SYSTEM 619
17.1 INTRODUCTION 619
17.1.1 MICROELECTRO-MECHANICAL SYSTEMS (MEMS) 619 17.1.2
MICROELECTROMECHANICAL SENSOR-BASED SYSTEM 620 17.1.3 COORDINATE
RELATION O F A MICROELECTROMECHANICAL SENSOR-BASED SYSTEM 624
17.2 COORDINATE TRANSFORMATION AND ATTITUDE MEASUREMENT IN 3D SPACE 625
17.2.1 ROTARY COORDINATE SYSTEM 625
17.2.2 SENSITIVE COMPONENTS O F SENSOR IN EARTH COORDINATE SYSTEM 629
17.2.3 DETERMINATION O F ATTITUDE ANGLES BY USING OUTPUTS OF SENSOR
FIXED ON A MOVING OBJECT 631
17.3 ATTITUDE ESTIMATION ALGORITHM O F MULTI-SENSOR SYSTEM 633 17.4
ASSEMBLY ORTHOGONAL ERROR COMPENSATION TECHNOLOGY FOR SENSING SYSTEM 638
17.5 MICROELECTROMECHANICAL SENSOR-BASED APPLICATION SYSTEMS 641 17.5.1
AIRSPEED METER 642
17.5.2 DIGITAL COMPASS 643
17.5.3 MICROELECTROMECHANICAL ATTITUDE MEASUREMENT SYSTEM 645 17.5.4
RELATIONSHIP BETWEEN TWO ROTATION COORDINATE SYSTEMS, AND APPLICATION O
F CERVICAL VERTEBRA ATTITUDE MEASUREMENT 647
17.5.5 MICROAUTOPILOT 648
17.6 CONCLUDING REMARKS 649
ACKNOWLEDGEMENTS 650
REFERENCES 650
18 A SURFACE MICROMACHINED ACCELEROMETER WITH INTEGRATED CMOS DETECTION
CIRCUITRY 653
18.1 INTRODUCTION 654
18.2 BACKGROUND-LITERATURE 654
18.2.1 ACCELEROMETER THEORY 655
18.2.2 ACCELEROMETER MODELING 670
18.2.3 ACCELEROMETER EXAMPLES 674
18.3 EXPERIMENTAL DESIGN: ACCELEROMETER DESIGN 678
18.3.1 SENSING ELEMENT 679
18.3.2 MECHANICAL SUSPENSION 680
XIII
IMAGE 10
18.3.3 CAPACITIVE BRIDGE 683
18.3.4 INPUT BUFFER 684
18.3.5 FEEDBACK DESIGN 686
18.3.6 ELECTROMECHANICAL E-A MODULATION 689
18.4 FABRICATION TECHNOLOGY 695
18.4.1 PROCESS INTEGRATION 697
18.4.2 TEMPERATURE REQUIREMENTS 699
18.4.3 TUNGSTEN METALLIZATION 699
18.5 EXPERIMENTAL RESULTS 705
18.5.1 CALIBRATION TECHNIQUES 709
18.5.2 ELECTRICAL AND MECHANICAL MEASUREMENT 709
18.5.3 ACCELEROMETER MEASUREMENT-STATIC RESPONSE 710 18.5.4 DYNAMIC
RESPONSE ; 711
18.5.5 TURNOVER TEST 712
18.6 CONCLUSIONS AND FUTURE RESEARCH 713
18.6.1 FUTURE RESEARCH 714
REFERENCES 715
19 MEMS IN AUTOMOBILES 721
19.1 OVERVIEW O F AUTOMOTIVE MEMS 721
19.2 ESSENCE O F MEMS TECHNOLOGY 726
19.2.1 IC TECHNOLOGY 726
19.2.2 MEMS CAD 727
19.2.3 MICROMACHINING TECHNOLOGY 727
19.2.4 MATERIALS 730
19.2.5 PACKAGING AND TESTING 731
19.3 AUTOMOTIVE MEMS 733
19.3.1 PRESSURE SENSOR 734
19.3.2 ACCELEROMETER 739
19.3.3 SOLID-STATE GYROSCOPE 742
19.3.4 AUTOMOTIVE VISION ASSISTANT DETECTOR SYSTEMS 746 19.3.5 OTHER
MEMS-BASED AUTOMOTIVE DEVICES 751
19.4 CONCLUDING REMARK 753
ACKNOWLEDGEMENTS 755
REFERENCES 755
20 BIOCHIP 759
20.1 INTRODUCTION 759
20.2 HISTORICAL BACKGROUND AND PRESENT CONDITION 761
20.3 MICROARRAY CHIP 762
20.4 FABRICATION AND DETECTION O F MICROARRAY CHIP 765
20.4.1 FABRICATION METHODS 765
XIV
IMAGE 11
20.4.2 DETECTION METHODS 767
20.5 SAMPLE PRETREATMENT MICROFLUIDIC CHIP 770
20.5.1 PARTICLE/CELL SEPARATION BIOCHIP 771
20.5.2 CELL LYSIS BIOCHIP 776
20.5.3 SOLID PHASE EXTRACTION CHIP (SPE-CHIP) 778
20.5.4 OTHER EXTRACTION BIOCHIPS 781
20.5.5 MIXING BIOCHIP 782
20.6 PCR BIOCHIP 783
20.7 CAPILLARY ELECTROPHORESIS MICROFLUIDIC CHIP 787
20.7.1 STRUCTURE AND DEVELOPMENT 787
20.7.2 INTEGRATED CE CHIP 790
20.7.3 APPLICATION 791
20.8 CHROMATOGRAPHY CHIP 794
20.8.1 GAS CHROMATOGRAPHY 794
20.8.2 LIQUID CHROMATOGRAPHY 795
20.9 MICROFLUIDIC HYBRIDIZATION AND IMMUNOASSAY BIOCHIPS 795 20.9.1
MICROFLUIDIC HYBRIDIZATION BIOCHIP 796
20.9.2 MICROFLUIDIC IMMUNOASSAY BIOCHIP 796
20.10 MICRO TOTAL ANALYSIS SYSTEM 798
20.10.1 INTRODUCTION 798
20.10.2 APPLICATION 799
20.11 TECHNOLOGIES FOR MICROFLUIDIC CHIP 802
20.11.1 SUBSTRATE MATERIAL FOR MICROFLUIDIC CHIP 802
20.11.2 PROCESSING TECHNOLOGY FOR JJTAS CHIP 803
20.11.3 LIQUID PUMPING AND CONTROLLING TECHNOLOGY IN (ITAS ....805
20.11.4 PACKAGING, INTEGRATION AND STORAGE TECHNOLOGY FOR (J.TAS CHIP
806
20.11.5 SPECIAL PROBLEMS IN JXTAS CHIPS 806
20.11.6 DETECTION TECHNIQUE FOR MICROFLUIDIC CHIPS 807 20.12
PERSPECTIVES 810
REFERENCES 810
21 MICRO/NANO TECHNOLOGIES AND THEIR BIOLOGICAL AND MEDICAL APPLICATIONS
819
21.1 INTRODUCTION 819
21.2 BIOLOGICAL AND MEDICAL APPLICATIONS 822
21.2.1 DNA/RNA EXTRACTION AND PURIFICATION 822
21.2.2 NUCLEIC ACID AMPLIFICATION 824
21.2.3 DNA SEPARATION AND DETECTION 829
21.2.4 DNA MANIPULATION 832
21.2.5 CELL CULTURE, COUNTING AND SORTING 834
XV
IMAGE 12
21.2.6 DISEASE DIAGNOSIS 837
21.3 CONCLUSIONS AND FUTURE PROSPECTIVE 842
ACKNOWLEDGEMENTS 842
REFERENCES 842
22 MICROFLUIDIC PLATFORMS FOR LAB-ON-A-CHIP APPLICATIONS 853 22.1
INTRODUCTION: THE NEED FOR MICROFLUIDIC PLATFORMS 853
22.2 CAPILLARY DRIVEN TEST STRIPS 857
22.2.1 LATERAL FLOW ASSAYS 857
22.2.2 UNIT OPERATIONS 858
22.2.3 APPLICATION EXAMPLES 860
22.2.4 STRENGTHS AND CHALLENGES O F THE PLATFORM 860
22.3 MICROFLUIDIC LARGE-SCALE INTEGRATION (LSI) 861
22.3.1 UNIT OPERATIONS ON THE PLATFORM 862
22.3.2 APPLICATION EXAMPLES 863
22.3.3 STRENGTHS AND CHALLENGES O F THE PLATFORM 865
22.4 CENTRIFUGAL MICROFLUIDICS 865
22.4.1 UNIT OPERATIONS ON THE PLATFORM 866
22.4.2 APPLICATION EXAMPLES 869
22.4.3 STRENGTHS AND CHALLENGES O F THE PLATFORM 870
22.5 ELECTROKINETIC PLATFORMS 871
22.5.1 UNIT OPERATIONS ON THE PLATFORM 872
22.5.2 APPLICATION EXAMPLES 874
22.5.3 STRENGTHS AND CHALLENGES O F THE PLATFORM 874
22.6 DROPLET-BASED MICROFLUIDIC PLATFORMS 874
22.6.1 PRESSURE-DRIVEN UNIT OPERATIONS AND APPLICATIONS 875 22.6.2
ELECTROWETTING-DRIVEN UNIT OPERATIONS AND APPLICATIONS 878
22.6.3 SURFACE ACOUSTIC WAVE-DRIVEN UNIT OPERATIONS AND APPLICATIONS 881
22.6.4 STRENGTHS AND CHALLENGES O F THE PLATFORM 882
22.7 FREE SCALABLE NON-CONTACT DISPENSING 883
22.7.1 UNIT OPERATIONS ON THE PLATFORM 883
22.7.2 APPLICATION EXAMPLES 885
22.7.3 STRENGTHS AND CHALLENGES O F THE PLATFORM 887
22.8 CONCLUSION 887
REFERENCES 888
DEVELOPMENT AND PROSPECTS
23 DEVELOPMENT AND PROSPECTS 899
23.1 MICROSYSTEMS TECHNOLOGIES: MEMS AND NEMS 899
23.1.1 MICRO- AND NANO-TECHNOLOGIES 900
XVI
IMAGE 13
23.1.2 SILICON MICROMACHINING 901
23.1.3 NEW MATERIALS, NEW TECHNOLOGIES 902
23.1.4 COMPUTER-AIDED DESIGN 904
23.1.5 CONCLUSIONS 904
23.2 SOME CONSIDERATIONS O F MEMS IN THE PAST AND THE FUTURE 904 23.2.1
INTRODUCTION 904
23.2.2 COMPARISON TO MICROELECTRONICS 905
23.2.3 THE SYSTEMS APPROACH TO MEMS 907
23.2.4 FUTURE APPLICATIONS 908
23.3 HISTORY, EXPERIENCE AND VISION ON MICROMACHINING AND MEMS 909
23.3.1 INTRODUCTION 909
23.3.2 HISTORY AND OUR EXPERIENCE 909
23.3.3 MY VISION 913
23.4 NOT NEARLY ENOUGH...PAST EXPERIENCE AND FUTURE PREDICTIONS FOR
EMERGING MICRO-NANO TECHNOLOGIES 914
23.4.1 BACKGROUND INFLUENCES 915
23.4.2 BASIC WISDOMS 916
23.4.3 EXPERIENCE-THE 50-YEAR COURSE 917
23.4.4 PREDICTING THE FUTURE 926
REFERENCES 928
INDEX COLOR FIGURES 931
XVII
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| title | Microsystems and nanotechnology |
| title_auth | Microsystems and nanotechnology |
| title_exact_search | Microsystems and nanotechnology |
| title_full | Microsystems and nanotechnology Zhaoying Zhou ... [Eds.] |
| title_fullStr | Microsystems and nanotechnology Zhaoying Zhou ... [Eds.] |
| title_full_unstemmed | Microsystems and nanotechnology Zhaoying Zhou ... [Eds.] |
| title_short | Microsystems and nanotechnology |
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| topic | Nanotechnologie (DE-588)4327470-5 gnd Mikrosystemtechnik (DE-588)4221617-5 gnd |
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