Advanced MEMS packaging:
Gespeichert in:
Format: | Buch |
---|---|
Sprache: | English |
Veröffentlicht: |
New York [u.a.]
McGraw-Hill
2010
|
Schriftenreihe: | Electronic engineering
|
Schlagworte: | |
Online-Zugang: | Inhaltsverzeichnis |
Beschreibung: | XXIII, 552 S. Ill., graph. Darst. |
ISBN: | 9780071626231 |
Internformat
MARC
LEADER | 00000nam a2200000 c 4500 | ||
---|---|---|---|
001 | BV036733140 | ||
003 | DE-604 | ||
005 | 20101108 | ||
007 | t | ||
008 | 101021s2010 ad|| |||| 00||| eng d | ||
010 | |a 2009040456 | ||
020 | |a 9780071626231 |c alk. paper |9 978-0-07-162623-1 | ||
035 | |a (OCoLC)731596983 | ||
035 | |a (DE-599)GBV611622912 | ||
040 | |a DE-604 |b ger |e aacr | ||
041 | 0 | |a eng | |
049 | |a DE-83 | ||
082 | 0 | |a 621.381046 | |
084 | |a ZN 4192 |0 (DE-625)157372: |2 rvk | ||
245 | 1 | 0 | |a Advanced MEMS packaging |c John H. Lau ... |
264 | 1 | |a New York [u.a.] |b McGraw-Hill |c 2010 | |
300 | |a XXIII, 552 S. |b Ill., graph. Darst. | ||
336 | |b txt |2 rdacontent | ||
337 | |b n |2 rdamedia | ||
338 | |b nc |2 rdacarrier | ||
490 | 0 | |a Electronic engineering | |
650 | 0 | 7 | |a MEMS |0 (DE-588)4824724-8 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Gehäuse |0 (DE-588)4156307-4 |2 gnd |9 rswk-swf |
689 | 0 | 0 | |a MEMS |0 (DE-588)4824724-8 |D s |
689 | 0 | 1 | |a Gehäuse |0 (DE-588)4156307-4 |D s |
689 | 0 | |5 DE-604 | |
700 | 1 | |a Lau, John H. |e Sonstige |4 oth | |
856 | 4 | 2 | |m GBV Datenaustausch |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=020650766&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |3 Inhaltsverzeichnis |
999 | |a oai:aleph.bib-bvb.de:BVB01-020650766 |
Datensatz im Suchindex
_version_ | 1804143387229552640 |
---|---|
adam_text | IMAGE 1
FUNDAMENTAL OF MEMS PACKAGING
MEMS PACKAGING MEMS PATENTS OPTICAL MEMS OPTICAL MEMS IN COMMUNICATIONS
APPLICATIONS OPTICAL MEMS IN INDUSTRIAL/CONSUMERS ELECTRONICS/MEDICAL
APPLICATIONS OPTICAL MEMS BOLOMETER BIO MEMS PACKAGING BIO MEMS
PACKAGING BIOSENSOR PACKAGING INERTIAL MEMS INERTIAL MEMS-ACCELEROMETER
WAFER LEVEL ASSEMBLY, PACKAGING AND TESTING FOR MEMS APPLICATIONS RF
MEMS INTRODUCTION TO RF MEMS AND ITS PACKAGING RF MEMS SWITCHES RF MEMS
TUNABLE CIRCUITS ADVANCED PACKAGING OF RF MEMS TABLE OF CONTENTS
PROVIDED BY BLACKWELL S BOOK SERVICES AND R.R. BOWKER. USED WITH
PERMISSION.
|
any_adam_object | 1 |
building | Verbundindex |
bvnumber | BV036733140 |
classification_rvk | ZN 4192 |
ctrlnum | (OCoLC)731596983 (DE-599)GBV611622912 |
dewey-full | 621.381046 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.381046 |
dewey-search | 621.381046 |
dewey-sort | 3621.381046 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
format | Book |
fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01330nam a2200373 c 4500</leader><controlfield tag="001">BV036733140</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20101108 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">101021s2010 ad|| |||| 00||| eng d</controlfield><datafield tag="010" ind1=" " ind2=" "><subfield code="a">2009040456</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780071626231</subfield><subfield code="c">alk. paper</subfield><subfield code="9">978-0-07-162623-1</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)731596983</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)GBV611622912</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-83</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381046</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4192</subfield><subfield code="0">(DE-625)157372:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Advanced MEMS packaging</subfield><subfield code="c">John H. Lau ...</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">New York [u.a.]</subfield><subfield code="b">McGraw-Hill</subfield><subfield code="c">2010</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">XXIII, 552 S.</subfield><subfield code="b">Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Electronic engineering</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">MEMS</subfield><subfield code="0">(DE-588)4824724-8</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Gehäuse</subfield><subfield code="0">(DE-588)4156307-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">MEMS</subfield><subfield code="0">(DE-588)4824724-8</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Gehäuse</subfield><subfield code="0">(DE-588)4156307-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Lau, John H.</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">GBV Datenaustausch</subfield><subfield code="q">application/pdf</subfield><subfield code="u">http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=020650766&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA</subfield><subfield code="3">Inhaltsverzeichnis</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-020650766</subfield></datafield></record></collection> |
id | DE-604.BV036733140 |
illustrated | Illustrated |
indexdate | 2024-07-09T22:46:51Z |
institution | BVB |
isbn | 9780071626231 |
language | English |
lccn | 2009040456 |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-020650766 |
oclc_num | 731596983 |
open_access_boolean | |
owner | DE-83 |
owner_facet | DE-83 |
physical | XXIII, 552 S. Ill., graph. Darst. |
publishDate | 2010 |
publishDateSearch | 2010 |
publishDateSort | 2010 |
publisher | McGraw-Hill |
record_format | marc |
series2 | Electronic engineering |
spelling | Advanced MEMS packaging John H. Lau ... New York [u.a.] McGraw-Hill 2010 XXIII, 552 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Electronic engineering MEMS (DE-588)4824724-8 gnd rswk-swf Gehäuse (DE-588)4156307-4 gnd rswk-swf MEMS (DE-588)4824724-8 s Gehäuse (DE-588)4156307-4 s DE-604 Lau, John H. Sonstige oth GBV Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=020650766&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
spellingShingle | Advanced MEMS packaging MEMS (DE-588)4824724-8 gnd Gehäuse (DE-588)4156307-4 gnd |
subject_GND | (DE-588)4824724-8 (DE-588)4156307-4 |
title | Advanced MEMS packaging |
title_auth | Advanced MEMS packaging |
title_exact_search | Advanced MEMS packaging |
title_full | Advanced MEMS packaging John H. Lau ... |
title_fullStr | Advanced MEMS packaging John H. Lau ... |
title_full_unstemmed | Advanced MEMS packaging John H. Lau ... |
title_short | Advanced MEMS packaging |
title_sort | advanced mems packaging |
topic | MEMS (DE-588)4824724-8 gnd Gehäuse (DE-588)4156307-4 gnd |
topic_facet | MEMS Gehäuse |
url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=020650766&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
work_keys_str_mv | AT laujohnh advancedmemspackaging |