Lead-free electronic solders: a special issue of the Journal of materials science: Materials in electronics
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
New York
Springer
2007
|
| Schlagworte: | |
| Online-Zugang: | http://deposit.dnb.de/cgi-bin/dokserv?id=2859640&prov=M&dok_var=1&dok_ext=htm Inhaltsverzeichnis kostenfrei kostenfrei Inhaltsverzeichnis |
| Beschreibung: | Thermodynamics and phase diagrams of lead-free solder materials /H. Ipser, et. al. --Phase diagrams of Pb-free solders and their related materials systems /Sinn-Wen Chen, et. al. --Effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints /D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications /Iver E. Anderson --Rare earth additions to lead-free electronic solders /C. M. L. Wu, et. al. --Compression stress-strain and creep properties of the 52ln-48Sn and 97lm-3Ag low-temperature Pb-free solders /Paul T. Vianco, et. al. --Sn-Zn low temperature solder /Katsuki Suganuma, et. al. --Composite lead-free electronic solders /Fu Guo --Processing and material issues related to lead-free soldering /Laura J. Turbini --Interfacial reaction issues for lead-free electronic solders /C. E. Ho, et. al. --Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys /N. Chawla, et. al. --Defo ctronics /D. R. Frear --Impact of the ROHS Directive on high-performance electronic systems Part I: need for lead utilization in exempt systems /Karl J. Puttlitz, et. al. --Impact of the ROHS Directive on high-performance electronic systems Part II: key reliability issues preventing the implementation of lead-free solders /Karl J. Puttlitz, et. al. |
| Beschreibung: | VI, 375 S. Ill., graph. Darst. |
| ISBN: | 0387484310 9780387484310 0387484337 9780387484334 |
Internformat
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| 245 | 1 | 0 | |a Lead-free electronic solders |b a special issue of the Journal of materials science: Materials in electronics |c [ed. by] K. N. Subramanian |
| 264 | 1 | |a New York |b Springer |c 2007 | |
| 300 | |a VI, 375 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
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| 500 | |a Thermodynamics and phase diagrams of lead-free solder materials /H. Ipser, et. al. --Phase diagrams of Pb-free solders and their related materials systems /Sinn-Wen Chen, et. al. --Effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints /D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications /Iver E. Anderson --Rare earth additions to lead-free electronic solders /C. M. L. Wu, et. al. --Compression stress-strain and creep properties of the 52ln-48Sn and 97lm-3Ag low-temperature Pb-free solders /Paul T. Vianco, et. al. --Sn-Zn low temperature solder /Katsuki Suganuma, et. al. --Composite lead-free electronic solders /Fu Guo --Processing and material issues related to lead-free soldering /Laura J. Turbini --Interfacial reaction issues for lead-free electronic solders /C. E. Ho, et. al. --Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys /N. Chawla, et. al. --Defo | ||
| 500 | |a ctronics /D. R. Frear --Impact of the ROHS Directive on high-performance electronic systems Part I: need for lead utilization in exempt systems /Karl J. Puttlitz, et. al. --Impact of the ROHS Directive on high-performance electronic systems Part II: key reliability issues preventing the implementation of lead-free solders /Karl J. Puttlitz, et. al. | ||
| 650 | 0 | |a Lead-free electronics manufacturing processes | |
| 650 | 0 | |a Electronics / Materials | |
| 650 | 0 | |a Solder and soldering | |
| 700 | 1 | |a Subramanian, K. N. |e Sonstige |4 oth | |
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Datensatz im Suchindex
| _version_ | 1805094632796717056 |
|---|---|
| adam_text |
IMAGE 1
CONTENTS
PREFACE K. N. SUBRAMANIAN 1
THERMODYNAMICS AND PHASE DIAGRAMS OF LEAD-FREE SOLDER MATERIALS H.
IPSER, H. FLANDORFER, CH. LUEF, C. SCHMETTERER AND U. SAEED 3
PHASE DIAGRAMS OF PB-FREE SOLDERS AND THEIR RELATED MATERIALS SYSTEMS
SINN-WEN CHEN, CHAO-HONG WANG, SHIH-KANG LIN AND CHEN-NAN CHIU 19
THE EFFECTS OF SUPPRESSED BETA TIN NUCLEATION ON THE MICROSTRUCTURAL
EVOLUTION OF LEAD-FREE SOLDER JOINTS D. SWENSON 39
DEVELOPMENT OF SN-AG-CU AND SN-AG-CU-X ALLOYS FOR PB-FREE ELECTRONIC
SOLDER APPLICATIONS IVER E. ANDERSON 55
RARE-EARTH ADDITIONS TO LEAD-FREE ELECTRONIC SOLDERS C. M. L. WU AND Y.
W. WONG 77
COMPRESSION STRESS-STRAIN AND CREEP PROPERTIES OF THE 52IN-48SN AND
97IN-3AG LOW-TEMPERATURE PB-FREE SOLDERS PAUL T. VIANCO, JEROME A.
REJENT, ARLO F. FOSSUM AND MICHAEL K. NEILSEN 93
SN-ZN LOW TEMPERATURE SOLDER KATSUAKI SUGANUMA AND KUEN-SOO KIM 121
COMPOSITE LEAD-FREE ELECTRONIC SOLDERS FU GUO 129
PROCESSING AND MATERIAL ISSUES RELATED TO LEAD-FREE SOLDERING LAURA J.
TURBINI 147
INTERFACIAL REACTION ISSUES FOR LEAD-FREE ELECTRONIC SOLDERS C. E. HO,
S. C. YANG AND C. R. KAO 155
MICROSTRUCTURE-BASED MODELING OF DEFORMATION IN SN-RICH (PB-FREE) SOLDER
ALLOYS N. CHAWLA AND R. S. SIDHU 175
DEFORMATION BEHAVIOR OF TIN AND SOME TIN ALLOYS FUQIAN YANG AND J. C. M.
LI 191
IMAGE 2
MECHANICAL FATIGUE OF SN-RICH PB-FREE SOLDER ALLOYS J. K. SHANG, Q. L.
ZENG, L. ZHANG AND Q. S. ZHU 211
LIFE EXPECTANCIES OF PB-FREE SAC SOLDER INTERCONNECTS IN ELECTRONIC
HARDWARE MICHAEL OSTERMAN AND ABHIJIT DASGUPTA 229
ASSESSMENT OF FACTORS INFLUENCING THERMOMECHANICAL FATIGUE BEHAVIOR OF
SN-BASED SOLDER JOINTS UNDER SEVERE SERVICE ENVIRONMENTS K. N.
SUBRAMANIAN 237
ELECTROMIGRATION STATISTICS AND DAMAGE EVOLUTION FOR PB-FREE SOLDER
JOINTS WITH CU AND NI UBM IN PLASTIC FLIP-CHIP PACKAGES SEUNG-HYUN CHAE,
XUEFENG ZHANG, KUAN-HSUN LU, HUANG-LIN CHAO, PAUL S. HO, MIN DING, PENG
SU, TRENT UEHLING AND LAKSHMI N. RAMANATHAN 247
ELECTROMIGRATION ISSUES IN LEAD-FREE SOLDER JOINTS CHIH CHEN AND S. W.
LIANG 259
STRESS ANALYSIS OF SPONTANEOUS SN WHISKER GROWTH K. N. TU, CHIH CHEN AND
ALBERT T. WU 269
SN-WHISKERS: TRUTHS AND MYTHS J. W. OSENBACH, J. M. DELUCCA, B. D.
POTTEIGER, A. AMIN AND F. A. BAIOCCHI 283
TIN PEST ISSUES IN LEAD-FREE ELECTRONIC SOLDERS W. J. PLUMBRIDGE 307
ISSUES RELATED TO THE IMPLEMENTATION OF PB-FREE ELECTRONIC SOLDERS IN
CONSUMER ELECTRONICS D. R. FREAR 319
IMPACT OF THE ROHS DIRECTIVE ON HIGH-PERFORMANCE ELECTRONIC SYSTEMS PART
I: NEED FOR LEAD UTILIZATION IN EXEMPT SYSTEMS KARL J. PUTTLITZ AND
GEORGE T. GALYON 331
IMPACT OF THE ROHS DIRECTIVE ON HIGH-PERFORMANCE ELECTRONIC SYSTEMS PART
II: KEY RELIABILITY ISSUES PREVENTING THE IMPLEMENTATION OF LEAD-FREE
SOLDERS KARL J. PUTTLITZ AND GEORGE T. GALYON 347
INDEX 367
VI CONTENTS |
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| id | DE-604.BV036670329 |
| illustrated | Illustrated |
| indexdate | 2024-07-20T10:46:29Z |
| institution | BVB |
| isbn | 0387484310 9780387484310 0387484337 9780387484334 |
| language | English |
| lccn | 2006935131 |
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| physical | VI, 375 S. Ill., graph. Darst. |
| publishDate | 2007 |
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| publishDateSort | 2007 |
| publisher | Springer |
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| spelling | Lead-free electronic solders a special issue of the Journal of materials science: Materials in electronics [ed. by] K. N. Subramanian New York Springer 2007 VI, 375 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Thermodynamics and phase diagrams of lead-free solder materials /H. Ipser, et. al. --Phase diagrams of Pb-free solders and their related materials systems /Sinn-Wen Chen, et. al. --Effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints /D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications /Iver E. Anderson --Rare earth additions to lead-free electronic solders /C. M. L. Wu, et. al. --Compression stress-strain and creep properties of the 52ln-48Sn and 97lm-3Ag low-temperature Pb-free solders /Paul T. Vianco, et. al. --Sn-Zn low temperature solder /Katsuki Suganuma, et. al. --Composite lead-free electronic solders /Fu Guo --Processing and material issues related to lead-free soldering /Laura J. Turbini --Interfacial reaction issues for lead-free electronic solders /C. E. Ho, et. al. --Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys /N. Chawla, et. al. --Defo ctronics /D. R. Frear --Impact of the ROHS Directive on high-performance electronic systems Part I: need for lead utilization in exempt systems /Karl J. Puttlitz, et. al. --Impact of the ROHS Directive on high-performance electronic systems Part II: key reliability issues preventing the implementation of lead-free solders /Karl J. Puttlitz, et. al. Lead-free electronics manufacturing processes Electronics / Materials Solder and soldering Subramanian, K. N. Sonstige oth http://deposit.dnb.de/cgi-bin/dokserv?id=2859640&prov=M&dok_var=1&dok_ext=htm DE-576 pdf/application http://www.gbv.de/dms/bsz/toc/bsz265439000inh.pdf 2009-01-25 kostenfrei Inhaltsverzeichnis http://www.loc.gov/catdir/enhancements/fy0825/2006935131-d.html Publisher description kostenfrei http://www.loc.gov/catdir/summary/eng0801/2006935131.html Unedited summary from book kostenfrei GBV Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=020589450&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Lead-free electronic solders a special issue of the Journal of materials science: Materials in electronics Lead-free electronics manufacturing processes Electronics / Materials Solder and soldering |
| title | Lead-free electronic solders a special issue of the Journal of materials science: Materials in electronics |
| title_auth | Lead-free electronic solders a special issue of the Journal of materials science: Materials in electronics |
| title_exact_search | Lead-free electronic solders a special issue of the Journal of materials science: Materials in electronics |
| title_full | Lead-free electronic solders a special issue of the Journal of materials science: Materials in electronics [ed. by] K. N. Subramanian |
| title_fullStr | Lead-free electronic solders a special issue of the Journal of materials science: Materials in electronics [ed. by] K. N. Subramanian |
| title_full_unstemmed | Lead-free electronic solders a special issue of the Journal of materials science: Materials in electronics [ed. by] K. N. Subramanian |
| title_short | Lead-free electronic solders |
| title_sort | lead free electronic solders a special issue of the journal of materials science materials in electronics |
| title_sub | a special issue of the Journal of materials science: Materials in electronics |
| topic | Lead-free electronics manufacturing processes Electronics / Materials Solder and soldering |
| topic_facet | Lead-free electronics manufacturing processes Electronics / Materials Solder and soldering |
| url | http://deposit.dnb.de/cgi-bin/dokserv?id=2859640&prov=M&dok_var=1&dok_ext=htm http://www.gbv.de/dms/bsz/toc/bsz265439000inh.pdf http://www.loc.gov/catdir/enhancements/fy0825/2006935131-d.html http://www.loc.gov/catdir/summary/eng0801/2006935131.html http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=020589450&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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