Encapsulation technologies for electronic applications:
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Oxford
Elsevier
2009
|
| Schriftenreihe: | Materials and processes for electronic application
|
| Schlagworte: | |
| Beschreibung: | XVII, 480 S. Ill., graph. Darst. 23cm |
| ISBN: | 9780815515760 0815515766 |
Internformat
MARC
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|---|---|---|---|
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| 003 | DE-604 | ||
| 005 | 20100322 | ||
| 007 | t | ||
| 008 | 100308s2009 ad|| |||| 00||| eng d | ||
| 020 | |a 9780815515760 |9 978-0-8155-1576-0 | ||
| 020 | |a 0815515766 |c (hbk.) : £99.99 hbk. : £99.99 : CIP entry (June) |9 0-8155-1576-6 | ||
| 024 | 3 | |a 9780815515760 | |
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| 084 | |a ZN 4192 |0 (DE-625)157372: |2 rvk | ||
| 100 | 1 | |a Ardebili, Haleh |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Encapsulation technologies for electronic applications |c Haleh Ardebili ; Michael G. Pecht |
| 264 | 1 | |a Oxford |b Elsevier |c 2009 | |
| 300 | |a XVII, 480 S. |b Ill., graph. Darst. |c 23cm | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 0 | |a Materials and processes for electronic application | |
| 650 | 4 | |a Electronic apparatus and appliances / Plastic embedment | |
| 650 | 0 | 7 | |a Mikroelektronik |0 (DE-588)4039207-7 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Verkapseln |0 (DE-588)4139497-5 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Gehäuse |0 (DE-588)4156307-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |2 gnd |9 rswk-swf |
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| 689 | 0 | 1 | |a Mikroelektronik |0 (DE-588)4039207-7 |D s |
| 689 | 0 | 2 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |D s |
| 689 | 0 | 3 | |a Gehäuse |0 (DE-588)4156307-4 |D s |
| 689 | 0 | |8 1\p |5 DE-604 | |
| 700 | 1 | |a Pecht, Michael |e Verfasser |4 aut | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-018958649 | ||
| 883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
Datensatz im Suchindex
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| author | Ardebili, Haleh Pecht, Michael |
| author_facet | Ardebili, Haleh Pecht, Michael |
| author_role | aut aut |
| author_sort | Ardebili, Haleh |
| author_variant | h a ha m p mp |
| building | Verbundindex |
| bvnumber | BV036067308 |
| classification_rvk | ZN 4192 |
| ctrlnum | (OCoLC)916887910 (DE-599)BSZ309516455 |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV036067308 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T22:10:45Z |
| institution | BVB |
| isbn | 9780815515760 0815515766 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-018958649 |
| oclc_num | 916887910 |
| open_access_boolean | |
| owner | DE-83 |
| owner_facet | DE-83 |
| physical | XVII, 480 S. Ill., graph. Darst. 23cm |
| publishDate | 2009 |
| publishDateSearch | 2009 |
| publishDateSort | 2009 |
| publisher | Elsevier |
| record_format | marc |
| series2 | Materials and processes for electronic application |
| spelling | Ardebili, Haleh Verfasser aut Encapsulation technologies for electronic applications Haleh Ardebili ; Michael G. Pecht Oxford Elsevier 2009 XVII, 480 S. Ill., graph. Darst. 23cm txt rdacontent n rdamedia nc rdacarrier Materials and processes for electronic application Electronic apparatus and appliances / Plastic embedment Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Verkapseln (DE-588)4139497-5 gnd rswk-swf Gehäuse (DE-588)4156307-4 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Verkapseln (DE-588)4139497-5 s Mikroelektronik (DE-588)4039207-7 s Elektronisches Bauelement (DE-588)4014360-0 s Gehäuse (DE-588)4156307-4 s 1\p DE-604 Pecht, Michael Verfasser aut 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Ardebili, Haleh Pecht, Michael Encapsulation technologies for electronic applications Electronic apparatus and appliances / Plastic embedment Mikroelektronik (DE-588)4039207-7 gnd Verkapseln (DE-588)4139497-5 gnd Gehäuse (DE-588)4156307-4 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| subject_GND | (DE-588)4039207-7 (DE-588)4139497-5 (DE-588)4156307-4 (DE-588)4014360-0 |
| title | Encapsulation technologies for electronic applications |
| title_auth | Encapsulation technologies for electronic applications |
| title_exact_search | Encapsulation technologies for electronic applications |
| title_full | Encapsulation technologies for electronic applications Haleh Ardebili ; Michael G. Pecht |
| title_fullStr | Encapsulation technologies for electronic applications Haleh Ardebili ; Michael G. Pecht |
| title_full_unstemmed | Encapsulation technologies for electronic applications Haleh Ardebili ; Michael G. Pecht |
| title_short | Encapsulation technologies for electronic applications |
| title_sort | encapsulation technologies for electronic applications |
| topic | Electronic apparatus and appliances / Plastic embedment Mikroelektronik (DE-588)4039207-7 gnd Verkapseln (DE-588)4139497-5 gnd Gehäuse (DE-588)4156307-4 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| topic_facet | Electronic apparatus and appliances / Plastic embedment Mikroelektronik Verkapseln Gehäuse Elektronisches Bauelement |
| work_keys_str_mv | AT ardebilihaleh encapsulationtechnologiesforelectronicapplications AT pechtmichael encapsulationtechnologiesforelectronicapplications |