Integrated circuit packaging, assembly and interconnections:
Saved in:
Bibliographic Details
Main Author: Greig, William J. (Author)
Format: Book
Language:English
Published: New York [u.a.] Springer 2007
Subjects:
Online Access:Inhaltsverzeichnis
Beschreibung für Leser
Table of contents only
Contributor biographical information
Publisher description
http://deposit.dnb.de/cgi-bin/dokserv?id=2 739571&prov=M&dok_var=1&dok_ext=htm
Item Description:Includes bibliographical references and index
Includes bibliographical references and index
Physical Description:XXIV, 296 S. Ill.
ISBN:0387281533
9780387281537

There is no print copy available.

Interlibrary loan Place Request Caution: Not in THWS collection! Indexes