Reactive sputter deposition:
Gespeichert in:
| Weitere Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Berlin [u.a.]
Springer
2008
|
| Schriftenreihe: | Springer series in materials science
109 |
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | Literaturangaben |
| Beschreibung: | XVIII, 570 S. Ill., graph. Darst. 25 cm |
| ISBN: | 9783540766629 |
Internformat
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| 650 | 4 | |a Pulvérisation cathodique - Applications industrielles | |
| 650 | 7 | |a Pulvérisation cathodique |2 ram | |
| 650 | 4 | |a Cathode sputtering (Plating process) | |
| 650 | 4 | |a Thin films | |
| 650 | 0 | 7 | |a Magnetronsputtern |0 (DE-588)4208514-7 |2 gnd |9 rswk-swf |
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Datensatz im Suchindex
| _version_ | 1804138102446358528 |
|---|---|
| adam_text | GESCANNT DURCH CONTENTS 1 SIMULATION OF THE SPUTTERING PROCESS T. ONO,
T. KENMOTSU, AND T. MURAMOTO 1 1.1 INTRODUCTION 1 1.2 COMPUTER
SIMULATION CODES 2 1.3 TOTAL SPUTTERING YIELD 5 1.3.1 INCIDENT-ENERGY
DEPENDENCE OF SPUTTERING YIELD 5 1.3.2 INCIDENT-ANGLE DEPENDENCE OF
SPUTTERING YIELD 9 1.4 DIFFERENTIAL SPUTTERING YIELD 16 1.4.1 ENERGY
SPECTRUM OF SPUTTERED ATOMS 16 1.4.2 ANGULAR DISTRIBUTION OF SPUTTERED
ATOMS 21 1.5 SPUTTERING FROM ROUGH SURFACE 28 1.6 SPUTTERING OF COMPOUND
TARGETS 30 1.7 CONCLUSION 37 REFERENCES 39 2 ELECTRON EMISSION FROM
SURFACES INDUCED BY SLOW IONS AND ATOMS R.A. BARAGIOLA AND P. RICCARDI
43 2.1 INTRODUCTION 43 2.2 PHYSICAL MECHANISMS 44 2.2.1 EXCITATION
MECHANISMS 44 2.2.2 SEPARATION OF PEE AND KEE 46 2.2.3 ELECTRON
TRANSPORT AND ESCAPE INTO VACUUM 46 2.3 ELECTRON YIELDS 46 2.3.1
DEPENDENCE OF THE ELECTRON YIELDS ON ION VELOCITY 47 2.3.2 ELECTRON
ENERGY AND ANGULAR DISTRIBUTIONS 48 2.3.3 ELECTRON EMISSION FROM
CONTAMINANT SURFACE LAYERS 48 2.4 THE ROLE OF ION-INDUCED ELECTRON
EMISSION IN GLOW DISCHARGES ... 50 2.4.1 EFFECT OF ELECTRON RECAPTURE AT
THE CATHODE 53 2.4.2 EFFECT OF CHANGES IN THE CHEMICAL COMPOSITION OF
THE CATHODE 56 BIBLIOGRAFISCHE INFORMATIONEN HTTP://D-NB.INFO/985929553
DIGITALISIERT DURCH * * * * * * * * * * * * * * * * *
|
| adam_txt |
GESCANNT DURCH CONTENTS 1 SIMULATION OF THE SPUTTERING PROCESS T. ONO,
T. KENMOTSU, AND T. MURAMOTO 1 1.1 INTRODUCTION 1 1.2 COMPUTER
SIMULATION CODES 2 1.3 TOTAL SPUTTERING YIELD 5 1.3.1 INCIDENT-ENERGY
DEPENDENCE OF SPUTTERING YIELD 5 1.3.2 INCIDENT-ANGLE DEPENDENCE OF
SPUTTERING YIELD 9 1.4 DIFFERENTIAL SPUTTERING YIELD 16 1.4.1 ENERGY
SPECTRUM OF SPUTTERED ATOMS 16 1.4.2 ANGULAR DISTRIBUTION OF SPUTTERED
ATOMS 21 1.5 SPUTTERING FROM ROUGH SURFACE 28 1.6 SPUTTERING OF COMPOUND
TARGETS 30 1.7 CONCLUSION 37 REFERENCES 39 2 ELECTRON EMISSION FROM
SURFACES INDUCED BY SLOW IONS AND ATOMS R.A. BARAGIOLA AND P. RICCARDI
43 2.1 INTRODUCTION 43 2.2 PHYSICAL MECHANISMS 44 2.2.1 EXCITATION
MECHANISMS 44 2.2.2 SEPARATION OF PEE AND KEE 46 2.2.3 ELECTRON
TRANSPORT AND ESCAPE INTO VACUUM 46 2.3 ELECTRON YIELDS 46 2.3.1
DEPENDENCE OF THE ELECTRON YIELDS ON ION VELOCITY 47 2.3.2 ELECTRON
ENERGY AND ANGULAR DISTRIBUTIONS 48 2.3.3 ELECTRON EMISSION FROM
CONTAMINANT SURFACE LAYERS 48 2.4 THE ROLE OF ION-INDUCED ELECTRON
EMISSION IN GLOW DISCHARGES . 50 2.4.1 EFFECT OF ELECTRON RECAPTURE AT
THE CATHODE 53 2.4.2 EFFECT OF CHANGES IN THE CHEMICAL COMPOSITION OF
THE CATHODE 56 BIBLIOGRAFISCHE INFORMATIONEN HTTP://D-NB.INFO/985929553
DIGITALISIERT DURCH * * * * * * * * * * * * * * * * * |
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| callnumber-first | T - Technology |
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| dewey-full | 621.38152 667.9 671.735 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics 667 - Cleaning, color & coating technologies 671 - Metalworking & primary metal products |
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| discipline | Chemie / Pharmazie Physik Elektrotechnik / Elektronik / Nachrichtentechnik Werkstoffwissenschaften / Fertigungstechnik |
| discipline_str_mv | Chemie / Pharmazie Physik Elektrotechnik / Elektronik / Nachrichtentechnik Werkstoffwissenschaften / Fertigungstechnik |
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| index_date | 2024-07-02T22:22:00Z |
| indexdate | 2024-07-09T21:22:51Z |
| institution | BVB |
| isbn | 9783540766629 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-016791211 |
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| physical | XVIII, 570 S. Ill., graph. Darst. 25 cm |
| publishDate | 2008 |
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| series | Springer series in materials science |
| series2 | Springer series in materials science |
| spelling | Reactive sputter deposition D. Depla ... (ed.) Berlin [u.a.] Springer 2008 XVIII, 570 S. Ill., graph. Darst. 25 cm txt rdacontent n rdamedia nc rdacarrier Springer series in materials science 109 Literaturangaben Couches minces Couches minces ram Pulvérisation cathodique - Applications industrielles Pulvérisation cathodique ram Cathode sputtering (Plating process) Thin films Magnetronsputtern (DE-588)4208514-7 gnd rswk-swf Reaktives Sputtern (DE-588)7625528-1 gnd rswk-swf PVD-Verfahren (DE-588)4115673-0 gnd rswk-swf Magnetronsputtern (DE-588)4208514-7 s Reaktives Sputtern (DE-588)7625528-1 s PVD-Verfahren (DE-588)4115673-0 s DE-604 Depla, Diederik edt Springer series in materials science 109 (DE-604)BV000683335 109 DNB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=016791211&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Reactive sputter deposition Springer series in materials science Couches minces Couches minces ram Pulvérisation cathodique - Applications industrielles Pulvérisation cathodique ram Cathode sputtering (Plating process) Thin films Magnetronsputtern (DE-588)4208514-7 gnd Reaktives Sputtern (DE-588)7625528-1 gnd PVD-Verfahren (DE-588)4115673-0 gnd |
| subject_GND | (DE-588)4208514-7 (DE-588)7625528-1 (DE-588)4115673-0 |
| title | Reactive sputter deposition |
| title_auth | Reactive sputter deposition |
| title_exact_search | Reactive sputter deposition |
| title_exact_search_txtP | Reactive sputter deposition |
| title_full | Reactive sputter deposition D. Depla ... (ed.) |
| title_fullStr | Reactive sputter deposition D. Depla ... (ed.) |
| title_full_unstemmed | Reactive sputter deposition D. Depla ... (ed.) |
| title_short | Reactive sputter deposition |
| title_sort | reactive sputter deposition |
| topic | Couches minces Couches minces ram Pulvérisation cathodique - Applications industrielles Pulvérisation cathodique ram Cathode sputtering (Plating process) Thin films Magnetronsputtern (DE-588)4208514-7 gnd Reaktives Sputtern (DE-588)7625528-1 gnd PVD-Verfahren (DE-588)4115673-0 gnd |
| topic_facet | Couches minces Pulvérisation cathodique - Applications industrielles Pulvérisation cathodique Cathode sputtering (Plating process) Thin films Magnetronsputtern Reaktives Sputtern PVD-Verfahren |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=016791211&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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