Materials, technology and reliablity of low k dielectrics and copper interconnects: symposium held April 18 - 21, 2006, San Francisco, California, USA
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Bibliographic Details
Other Authors: Tsui, Ting Y. (Editor)
Format: Book
Language:English
Published: Warrendale, Pa. Materials Research Soc. 2006
Series:Materials Research Society symposium proceedings 914
Subjects:
Physical Description:XVII, 462 S. Ill., graph. Darst.

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