Materials, technology and reliablity of low k dielectrics and copper interconnects: symposium held April 18 - 21, 2006, San Francisco, California, USA
Gespeichert in:
| Weitere Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Warrendale, Pa.
Materials Research Soc.
2006
|
| Schriftenreihe: | Materials Research Society symposium proceedings
914 |
| Schlagworte: | |
| Beschreibung: | XVII, 462 S. Ill., graph. Darst. |
Internformat
MARC
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Datensatz im Suchindex
| _version_ | 1804140630251667456 |
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| publishDate | 2006 |
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| spelling | Materials, technology and reliablity of low k dielectrics and copper interconnects symposium held April 18 - 21, 2006, San Francisco, California, USA ed.: Ting Y. Tsui ... Warrendale, Pa. Materials Research Soc. 2006 XVII, 462 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Materials Research Society symposium proceedings 914 (DE-588)1071861417 Konferenzschrift gnd-content Tsui, Ting Y. edt Materials Research Society symposium proceedings 914 (DE-604)BV001899105 914 |
| spellingShingle | Materials, technology and reliablity of low k dielectrics and copper interconnects symposium held April 18 - 21, 2006, San Francisco, California, USA Materials Research Society symposium proceedings |
| subject_GND | (DE-588)1071861417 |
| title | Materials, technology and reliablity of low k dielectrics and copper interconnects symposium held April 18 - 21, 2006, San Francisco, California, USA |
| title_auth | Materials, technology and reliablity of low k dielectrics and copper interconnects symposium held April 18 - 21, 2006, San Francisco, California, USA |
| title_exact_search | Materials, technology and reliablity of low k dielectrics and copper interconnects symposium held April 18 - 21, 2006, San Francisco, California, USA |
| title_full | Materials, technology and reliablity of low k dielectrics and copper interconnects symposium held April 18 - 21, 2006, San Francisco, California, USA ed.: Ting Y. Tsui ... |
| title_fullStr | Materials, technology and reliablity of low k dielectrics and copper interconnects symposium held April 18 - 21, 2006, San Francisco, California, USA ed.: Ting Y. Tsui ... |
| title_full_unstemmed | Materials, technology and reliablity of low k dielectrics and copper interconnects symposium held April 18 - 21, 2006, San Francisco, California, USA ed.: Ting Y. Tsui ... |
| title_short | Materials, technology and reliablity of low k dielectrics and copper interconnects |
| title_sort | materials technology and reliablity of low k dielectrics and copper interconnects symposium held april 18 21 2006 san francisco california usa |
| title_sub | symposium held April 18 - 21, 2006, San Francisco, California, USA |
| topic_facet | Konferenzschrift |
| volume_link | (DE-604)BV001899105 |
| work_keys_str_mv | AT tsuitingy materialstechnologyandreliablityoflowkdielectricsandcopperinterconnectssymposiumheldapril18212006sanfranciscocaliforniausa |