APA (7th ed.) Citation

Tsui, T. Y. (2006). Materials, technology and reliablity of low k dielectrics and copper interconnects: Symposium held April 18 - 21, 2006, San Francisco, California, USA. Materials Research Soc.

Chicago Style (17th ed.) Citation

Tsui, Ting Y. Materials, Technology and Reliablity of Low K Dielectrics and Copper Interconnects: Symposium Held April 18 - 21, 2006, San Francisco, California, USA. Warrendale, Pa: Materials Research Soc, 2006.

MLA (9th ed.) Citation

Tsui, Ting Y. Materials, Technology and Reliablity of Low K Dielectrics and Copper Interconnects: Symposium Held April 18 - 21, 2006, San Francisco, California, USA. Materials Research Soc, 2006.