Proceedings of the 7th International Microelectronics Conference: June 3 - 5, 1992, Yokohama, Japan
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| Format: | Tagungsbericht Buch |
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Tokyo
Soc. for Hybrid Microelectronics
1992
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| Beschreibung: | XIII, 622 S. Ill., graph. Darst. |
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| adam_text | PROCEEDINGS OF THE 7TH INTERNATIONAL MICROELECTRONICS CONFERENCE JUNE
3-5, 1992 PACIFICO YOKOHAMA YOKOHAMA, JAPAN SPONSORED BY SHM INVITED
PAPERS CHAIRPERSON: K.NIHEI (OKI ELECTRIC INDUSTRY CO.) 1 1.
MICROELECTRONICS FOR ELECTRONIC IMAGING, BY S.DENDA. KONICA CORP. 7 2.
FUTURE MOBILE COMMUNICATION, BY J.P.CAILE. MOTOROLA INC. 12 3. VLSI
NEURAL NETWORKS, BY Y.HIRAI, TSUKUBA UNIV. LUNCHEON SPEECH CHAIRPERSON:
F.MIYASHIRO (TOSHIBA CORP.) 20 A 4D MODEL FOR A VISUAL COMPUTER -AS THE
BASIS OF DESIGN- AND MANUFACTURING- AUTOMATION-, BY T.L.KUNII, THE UNIV.
OF TOKYO INVITED PAPERS ADVANCED HIGH DENSITY PACKAGING CHAIRPERSON:
A.LKEGAMI (TOYO SHIGYO PRINTING CO., LTD.) CHAIRPERSON: S.HONDA
(TOKUYAMA SODA CO., LTD.) 25 1. PRESENT STATE AND FUTURE TREND OF
SILICON ON SILICON TECHNOLOGY IN EUROPE, BY C.VERGNOLLE, THOMSON-CSF 30
2. MULTI CHIP MODULES FOR USE IN ADVANCED WORKSTATIONS, BY M.F.BREGMAN,
IBM CORP. 37 3. COB TECHNOLOGY, BY S.WAKAMOTO , SHARP CORP. 45 4.
PACKAGING TECHNOLOGY FOR NOTEBOOK SIZE PC, BY N.WATANABE, NEC CORP. AL
SUBSTRATE (1) CHAIRPERSON: N.MIURA (SANYO ELECTRIC CO., LTD.) 47 1.
CERAMIC COMPOSITE COPPER-CLAD LAMINATE, BY H.HASEGAWA, N.OKANO &
M.LNOUE, HITACHI CHEMICAL CO., LTD. 51 2. PATTERNING TECHNIQUES OF
PHOTOSENSITIVE POLYIMIDES ON COPPER, BY K.NIWA, M.EGUCHL & M.ASANO,
TORAY INDUSTRIES. INC. 56 3. THE APPLICATION OF EXCIMER LASER TO FINE
FEATURE INTERCONNECTIONS, T.HIRAKAWA & C.KATO, TEIJIN LTD. 60 4. A STUDY
OF MULTILAYER CONSTRUCTION OF RIGID-FLEX PRINTED CIRCUIT BOARDS, BY
K.SHLBAYAMA, H.HAMANO, H.NAGATA, M.SAKAL & T.KOJIMA, TOSHIBA CORP. A2
ORGANIC MATERIALS CHAIRPERSON: K.TANAKA (CHIBA UNIV.) 64 1. A
PHOTODEFINABLE BENZOCYCLOBUTENE RESIN FOR THIN FILM MICROELECTRONIC
APPLICATIONS, BY T.TAKAHASHI, E.W.RUTTER.JR, E.S.MOYER, C.E.MOHLER,
R.F.HARRIS & F.L.OAKS, THE DOW CHEMICAL CO. 71 2. NEW TYPE
FILM-ADHESIVES FOR MICROELECTRONICS APPLICATIONS, BY Y.SAKAMOTO,
N.TAKEDA, T.TAKEDA & A.TOKOH, SUMITOMO BAKELITE CO., LTD., D.Y.TANG,
OCCIDENTA L CHEMICAL CORP. 76 3. CYCLIZED PERFLUOROPOLYMER CPFP A LOW
K DIELECTRICS FOR MICROELECTRONICS DEVICE, BY M.NAKAMURA, K.AOSAKI,
M.UNOKI & S.YOKOTSUKA, ASAHI GLASS CO., LTD. A3 LCD MODULE CHAIRPERSON:
K.HATADA (MATSUSHITA ELECTRIC IND. CO., LTD.) 81 1. BARE-CHIP FACE-DOWN
BONDING TECHNOLOGY USING CONDUCTIVE PARTICLES AND LIGHT SETTING
ADHESIVES: ELASTIC METHOD, BY H.MATSUBARA, H.ATARASHI, K.YAMAMURA,
N.KAKIMOTO, K.NAITOH & T.NUKII, SHARP CORP. 88 2. OPTIMUM CONDITION OF
FINE PITCH BONDING BY USING ACF, BY H.MORISHITA, T.KOKOGAWA, K.ADACHI,
A.LSHIZU & H.TAKASAGO, MITSUBISHI ELECTRIC CORP. 93 3. SOLDERIESS COG
TECHNOLOGY USING ANISOTROPIC CONDUCTIVE ADHESIVE, BY W.TAKAHASHI,
K.MURAKOSHL, J.KANAZAWA, M.LKEHATA, Y.LGUCHI & T.KANAMORI, OKI ELECTRIC
INDUSTRY CO., LTD. 99 4. CHIP-ON-GLASS PACKAGING TECHNOLOGY USING
CONDUCTIVE PARTICLES, BY H.OTSUKI, T.KATO, F.MATSUKAWA, M.NUNOSHITA &
H.TAKASAGO, MITSUBISHI ELECTRIC CORP. A4 INTERCONNECTION: NEW
INTERCONNECTION CHAIRPERSON: S.NAKATA (OSAKA UNIV.) 104 1. SURFACE
ACTIVATED BONDING - A NEW APPROACH TO THE MICROBONDING AT ROOM
TEMPERATURE, BY T.SUGA, H.HOSOML, THE UNIV. OF TOKYO, Y.TAKAHASHI , MIE
UNIV. 110 2. LOW RESIDUAL STRESS FLIP CHIP BONDING METHOD, BY K.ANO,
A.TAZLMA & M.WATANABE, TEXAS INSTRUMENTS JAPAN LTD. 115 3. BONDING OF
ULTRAFINE TERMINAL-PITCH LSIS BY MICRO BUMP BONDING METHOD, BY
H.FU|IMOTO, T.OCHI & K.HATADA, MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
120 4. A FLIP-CHIP INTERCONNECTION TECHNIQUE USING INDIUM-ALLOY BUMPS
FOR A NEWLY DESIGNED CCD MODULE, BY Y.KONDOH, T.TOGASAKI & M.SAITO,
TOSHIBA CORP. A5 INTERCONNECTION: FLIP CHIP (CCB) CHAIRPERSON: T.SUGA
(THE UNIV. OF TOKYO) 127 1. C4 TECHNOLOGY OF SOS (SILICON ON SILICON)
PACKAGING, BY H. OHKUMA, S. MATSUDA & M. YAMASHITA, IBM JAPAN LTD. 136
2. FLIP-CHIP INTERCONNECTION TECHNOLOGY WITH IN-PB ALLOY SOLDER, BY
K.KARASAWA, T.NAKANISHI, M.OCHIAI & K.HASHIMOTO, FUJITSU LABS. LTD. 144
3. FLIP-CHIP COB TECHNOLOGY ON PWB, BY A.RAI, Y.DOTTA, T.NUKII &
T.OHNISHI, SHARP CORP. 150 4. FLIP CHIP BONDING WITH SN-AG SOLDER FOR
HIGH-DENSITY MULTI CHIP MODULE, BY R.SATOH, M.HARADA, R.TAKENAKA,
M.SHIRAI, K.MATSUI & T.NEZU, HITACHI LTD. A6 INTERCONNECTION: TAB, WIRE
BOND CHAIRPERSON: E.J.VARDAMAN (TECHSEARCH INT L INC.) CO-CHAIRPERSON:
T.NUKII (SHARP CORP.) 156 1. RELIABILITY OF ADHESIVELESS TAB PRODUCTS
AND THE POSSIBILITY FOR HIGH FREQUENCY APPLICATION, BY H.YAMAZAKL, M.LTO
& W.V.BALLARD, SUMITOMO 3M LTD. 163 2. NEW BUMP FORMATION TECHNOLOGY FOR
TAB INNER LEAD BONDING, BY H.KANEKO, Y.OTSUKA, M.LTOH, M.LSHIKAWA &
T.OHKUBO NEC CORP. 169 3. EVALUATION OF GOLD WIRE BONDABILITY ONTO LOW
TEMPERATURE FIREABLE COPPER THICK FILM, BY M.ARAKAWA, TOSHIBA AVE CO.,
LTD., M.SEGAWA, TOSHIBA CORP. 175 4. SCREEN-PRINTABLE THERMO-SETTING
TYPE ANISOTROPIC CONDUCTIVE PASTE INTERCONNECTION OF DISPLAY DEVICE WITH
TAB (COF), BY Y.YAMAMOTO & A.LNABA, DU PONT JAPAN LTD., H.LTO & K.KONDO,
OOGI CHEMICAL INDUSTRY CO., LTD. A7 SOLDERING: CLEAN SOLDERING
CHAIRPERSON: M.LWABUCHI (DU PONT JAPAN LTD.) 182 1. SEMICONDUCTOR LASER
SOLDERING TECHNOLOGY AND APPLICATION BY N.KAWATANI & T.KIGA, SONY CORP.
187 2. CLEAN SOLDERING WITH NO RESIDUE FLUX, BY M.KITAJIMA & K.YOKOI,
FUJITSU LTD., K.NATORI , FUJITSU LABS. LTD., I.KAWAKATOU, RIVERBOND
RESEARCH INSTITUTE 194 3. REFLOW SOLDERING: THE CONTRIBUTION OF
SYNTHETIC ATMOSPHERES TO THE NO CLEANING ISSUE, BY S.MELLUL &
M.UTURMY, L 1 AIR LIQUIDE, A.M.LAUGT-BREUIL & A.CLAUDE, PROMOSOL A8
SOLDERING: FINE PITCH SOLDERING CHAIRPERSON: T.HONDA (HONDA CONSULTING
OFFICE) 202 1. NEW SOLDERING TECHNOLOGY FOR MOUNTING COMPONENTS HANDLES
0.15MM- PITCH COMPONENTS, BY K.FUSE, Y.OBARA & H.LRIE, SUPER SOLDER
TECHNOLOGIES, INC., H.SHIROISHI & T.FUKUNAGA, THE FURUKAWA ELECTRIC CO.,
LTD., M.KOHNO & Y.NISHI, HARIMA CHEMICALS, INC. 209 2. PRINTABILITY OF
SOLDER PASTE WITH 0.3MM PITCH, BY H.MISHINA, H.OKADA & H.NAKAMURA,
HITACHI TECHNO ENGINEERING CO., LTD. 216 3. NO CLEAN MOUNTING PROCESS
FOR FINE-PITCH LSI, BY A.WAKIGAWA, KYUSHU MATSUSHITA ELECTRIC CO., LTD.
A9 TREND CHAIRPERSON: M.F.BREGMAN (IBM CORP.) CO-CHAIRPERSON: H.TOMIMURO
(NTT LABS.) 224 1. COST/PERFORMANCE TRADEOFFS IN MULTICHIP MODULE
TECHNOLOGY, BY E.J.VARDAMAN & M.W. HARTNETT, TECHSEARCH INT L INC., LEE
H.NG, IBIS ASSOCIATES, INC., P.D.FRANZON, NORTH CAROLINA STATE UNIV. 228
2. MULTICHIP MODULE PACKAGING, BY H.K.CHARLES, JR, THE JOHNS HOPKINS
UNIV. 236 3. SIMULOGIC, BY Y.DOI, MOTOROLA INC. BL MULTI CHIP MODULE
CHAIRPERSON: H.K.CHARLES, JR. (THE JOHNS HOPKINS UNIV.) CO-CHAIRPERSON:
H.TOMIMURO (NTT LABS.) 241 1. TRANSMISSION CHARACTERISTICS OF
POLYIMIDE-COPPER THIN FILM MULTILAYER SUBSTRATE, BY Y.TAKAHASHI,
Y.KASUYA, Y.UNO, Y.LGUCHI, T.KANAMORI & Y.OHNUKI, OKI ELECTRIC INDUSTRY
CO., LTD. 246 2. HIGH SPEED PERFORMANCE OF A BI-CMOS SRAM MULTICHIP
MODULE, BY T.KOYANAGAWA, T.KOHNO, O.SHLMADA, H.TANAKA, T.NISHLMURA,
S.KIMLJIMA & Y.FUKUOKA, TOSHIBA CORP. 252 3. SURFACE LAMINAR CIRCUIT AND
FLIP CHIP ATTACH PACKAGING, BY Y.TSUKADA, S.TSUCHLDA & Y.MASHIMOTO, IBM
JAPAN LTD. 259 4. EVALUATION OF COPPER/POLYIMIDE THIN FILM SUBSTRATE FOR
MULTI- CHIP MODULE, BY M.NIL, J.OMORI, T.NAKAZAWA, T.SASAKI,
J.KOBAYASHI, S.KIMI|IMA & Y.FUKUOKA, TOSHIBA CORP. B2 CERAMIC MATERIALS
(1) CHAIRPERSON: S.MAYUMI (SUMITOMO METAL INDUSTRIES, LTD.) 265 1.
ELECTRICAL AND THERMAL PROPERTIES OF LOW TEMPERATURE FIRING AIN CERAMICS
WITH ADDITIVES, BY N.LCHINOSE, H.KATAKURA & I.HAZEYAMA, WASEDA UNIV. 270
2. THE INFLUENCE OF IMPURITIES ON THE OPTICAL, THERMAL AND ELECTRICAL
PROPERTIES OF SINTERED ALUMINUM NITRIDE, BY A.K.KNUDSEN, T.A.GUITON,
N.R.NICHOLAS, L.K.MILLS, P.J.BOURNS, J.E.VOLMERING, J.L.BOARD,
D.R.BEAMAN & D.SUSNITZKY, THE DOW CHEMICAL CO., P.S.DE BARARTDA & E.RUH,
RUTGERS UNIV. 275 3. THE DEVELOPMENT AND METALLISATION OF A HIGH
STRENGTH BERYLLIA CERAMIC, BY A.J.DAWE, M.CRUTCHLEY, & J.PATTIMORE, CBL
CERAMICS LTD., R.STEVENS, UNIV OF LEEDS B3 PACKAGE CHAIRPERSON:
N.LCHINOSE (WASEDA UNIV.) 281 1. SMALL-SIZED PACKAGE FOR MONOLITHIC
MICROWAVE INTEGRATED CIRCUITS, BY H.YAMADA, T.FUSAYASU, M.TAKADA,
M.KOHARA & M.NUNOSHITA, MITSUBISHI ELECTRIC CORP. 285 2. HIGHLY THERMAL
CONDUCTIVE AIN PGA PACKAGE, BY A.SHIBUYA, Y.KUROKAWA & Y.SHIMADA, NEC
CORP. 291 3. ULTRA THIN AND HIGH PIN COUNT TAPE CARRIER PACKAGES, BY
T.TACHLKAWA, H.SHIMAMOTO, T.UEDA & H.SEKI, MITSUBISHI ELECTRIC CORP. B4
MODULE CHAIRPERSON: H.NAKAJIMA (MITSUBISHI ELECTRIC CORP.) 297 1.
DEVELOPMENT OF THE FUNCTION MODULE IN THE IMAGE- PROCESSING BOARD USING
THE COB ASSEMBLY TECHNOLOGY, BY S.MAEDA, Y.TAMURA, K.KOMATSU, K.TSUBOI &
S.NISHI, KONICA CORP. 303 2. EVALUATION OF THE COMPACT MODULE BASED BY
FR-5 GLASS EPOXY BOARD AND PSI RESIN COATING, BY T.EIMURA, M.HASEGAWA &
T.SAWAGUCHI, JAPAN RADIO CO. 309 3. A MINIATURIZED VCO USING MULTI-LAYER
CERAMIC TECHNOLOGY, BY Y.YASUKAWA, S.NAKAI, K.KAWAMURA & M.KOBAYASHL,
TDK CORP. 314 4. TWO-DIMENSIONAL OPTICAL INTEGRATED CIRCUITS FOR VSTEPS,
BY S.KAWAI, K.KASAHARA & K.KUBOTA, NEC CORP. B5 SUBSTRATE (2)
CHAIRPERSON: Y.LGUCHI (OKI ELECTRIC INDUSTRY) 320 1. ADVANCES IN MCM
FABRICATION WITH BENZOCYCLOBUTENE DIELECTRIC, BY T.TAKAHASHI,
R.H.HEISTAND II, M.R.DEVELLIS, T.A.MANIAL, A.P.KENNEDY, P.E.GARROU,
T.M.STOKICH & P.H.TOWNSEND, THE DOW CHEMICAL CO., G.M.ADEMA, M.J.BERRY &
I.TURLIK, MCNC 325 2. HIGH DENSITY MULTILAYER SUBSTRATE USING
BENZOCYCLOBUTENE DIELECTRIC, BY T.SHIMOTO, K.MATSUL, M.KIMURA &
K.UTSUML, NEC CORP. 331 3. ELECTRICAL EVALUATION OF HIGH DENSITY
MULTILAYER WIRING SUBSTRATE FOR HIGH SPEED SIGNAL TRANSMISSION, BY
M.KURODA, R.KAMBE, R.LMAI & Y.KIMURA, NGK SPARK PLUG CO., LTD. 337 4.
-SILICON ON SILICON TECHNOLOGY- PROCESS AND CHARACTERISTICS OF SI
CARRIER SUBSTRATES, BY A.KIMURA, T.TSUJIMURA, K.SAITOH & Y.KOHNO, IBM
JAPAN LTD. B6 SUBSTRATE (3) CHAIRPERSON: T.YAMAGUCHI (KEIO UNIV.) 343 1.
A NEW MULTILAYER CERAMIC SUBSTRATE FROM PRE-SINTERED ALUMINA FILM, BY
S.LNUI, T.SATO, & E.HIROSE, MITSUBISHI MATERIALS CORP. 349 2. AIN
THICK-FILM METALLIZED SUBSTRATE, BY Y.WATABE, F.MATSUMOTO, S.LWATA &
T.OHNO, TOKIN CORP. 355 3. MULTILAYER CERAMIC SUBSTRATE WITH INNER
CAPACITORS, BY Y.FUJIOKA, T.FUJISAKI, I.SAKAGUCHL, Y.YAMAKUCHL, S.SHINO,
K.ONLTSUKA & N.FUJIKAWA, KYOCERA CORP. 360 4. THE EFFECT OF THICK FILM
SUBSTRATE ON POWER MODULE THERMAL RESISTANCE, BY O.SPALDLNG, T.JAAKOLA &
R.RIKOLA, VTT ELECTRONICS LABORATORY, S.PIENLMAA, NOKIA MOBILE PHONES B7
THICK FILM MATERIALS (1) CHAIRPERSON: Y.TAKETA (NIHON UNIV.) 367 1. HIGH
RELIABILITY PT/AG COMPOSITION FOR AUTOMOTIVE THERMAL CYCLE APPLICATIONS,
BY M.H.LABRANCHE, DUPONT EXPERIMENTAL STATION, H.KOJO, Y.YAMAMOTO &
B.E.TAYLOR, DU PONT JAPAN LTD. 376 2. NEW COPPER PASTE FOR CTF
APPLICATIONS, BY A.YOKOYAMA, T.KATSUMATA, A.FUJII & T.YONEYAMA, ASAHI
CHEMICAL INDUSTRY CO., LTD. 382 3. A HIGH RELIABILITY THIN PRINT GOLD
CONDUCTOR FOR AU AND AL WIRE BONDING ON HYBRID CIRCUITS, BY O.W.BROWN,
P.S.PALANLSAMY & P.G.SAYERS, EMCA-REMEX PRODUCTS B8 THICK FILM MATERIALS
(2) CHAIRPERSON: W.J.BORLAND (DU PONT JAPAN LTD.) CO-CHAIRPERSON:
K.HASHIMOTO (FUJITSU LABS. LTD.) 390 1. THE DOUBLE LAYER COPPER THICK
FILM SYSTEM WITH RESISTORS OF HIGH ACCURACY, BY M.HASHIMOTO, & A.HAMANO,
SUMITOMO METAL INDUSTRIES. LTD. F.MATSUNO, K.KAWAGUCHI & H.FUJII,
SUMITOMO METAL CERAMICS INC. 396 2. PREPARATION OF TIN OXIDE-GLASS
COMPOSITE BY SOL-GEL PROCESS, BY K.WATANABE, H.SHIOMI & M.NAKAMURA,
KYOTO INSTITUTE OF TECHNOLOGY, J.LSHIGAME & K.FUJIMURA, SUMITOMO METAL
MINING CO., LTD. 403 3. CHARACTERIZATION OF A LOW TEMPERATURE FIREABLE
HIGH-K THICK FILM CAPACITOR SYSTEM, BY D.J.NABATIAN & P.S.PALANISAMY,
EMCA-REMEX PRODUCTS B9 THICK FILM MATERIALS (3) CHAIRPERSON: M.A.STEIN
(ELECTRO-SCIENCE LABS. INC.) CO-CHAIRPERSON: M.FUJIMOTO (TAIYO YUDEN
CO., LTD.) 411 1. APPLICATION OF AU, AU-PT-PD MOC (METALLO-ORGANIC-
COMPOUND) PASTE TO HIC FIRED ON GLASS-SUBSTRATE, BY K.NAKAYAMA, M.SANO &
K.KAWATSU, NORITAKE KIZAI CO., LTD., N.ENDO, KYUSHU NORITAKE CO., LTD.
418 2. ANALYSIS OF RESISTIVITY-FIRING TEMPERATURE CURVE OF RUO 2 - GLASS
THICK FILM RESISTORS, BY T.NAKANO, S.MIYAMATO & T.YAMAGUCHI, KEIO UNIV.
422 3. SILVER FLAKES FOR STATE OF THE ART CONDUCTIVE ADHESIVE
APPLICATIONS, BY E.M.JOST, K.MCNEILLY & P.SEXTON, CHEMET CORP. CL DESIGN
CHAIRPERSON: Y.DOI (MOTOROLA INC.) 429 1. DESIGN OF MATCHING CIRCUITS BY
THE CONJUGATE IMAGE IMPEDANCES METHOD - SOME APPLICATIONS TO THE SAW
FILTER, BY OU-HOK HUOR, M.KASAGL & N.SAKAMOTO, OKI ELECTRIC INDUSTRY
CO., LTD. 435 2. OPTIMIZED GROUND PIN ASSIGNMENT IN A MULTILAYER PACKAGE
TO MINIMIZE THE SIMULTANEOUS SWITCHING NOISE, BY Y.HIRUTA, N.HIRANO &
T.SUDO, TOSHIBA CORP. 442 3. STRESS ANALYSIS FOR MULTILAYER MULTICHIP
MODULE (MCM-D) STRUCTURES USING THE SERIES SOLUTION OF ELASTICITY
THEORY, BY R.ZHUGE, W.KJONES & S.S.MAGANTI, FLORIDA INTERNATIONAL UNIV.
449 4. SIMULTANEOUS SWITCHING NOISE ANALYSIS IN A THIN-FILM MULTICHIP
MODULE, B Y Y.FUCHKJA & T.SUDO, TOSHIBA CORP. C2 MANUFACTURING:
METALLIZE PROCESS CHAIRPERSON: M.LTO (NEC CORP.) 452 1. FUNDAMENTAL
STUDY ON JOULE HEATING INDUCED LOCAL ELECTRODEPOSITION FOR
MICROELECTRONIC CIRCUITS, BY H.KAWAMOTO, FUJI XEROX CO., LTD. 459 2.
MECHANISM OF SOLDERABILITY IMPROVEMENT FOR SILVER/PALLADIUM TERMINATION
APPLIED TO CHIP COMPONENTS, BY K.HAMADA, Y.TOKUDA & T.KASANAMI, MURATA
MANUFACTURING CO., LTD. 464 3. CHARACTERIZATION OF COPPER BONDED AIN
SUBSTRATES BY ACTIVE METAL BRAZING, BY J.GUINET, JP.MICHELET &
J.JARRIGE, TELEMECANIQUE. J.MEXMAIN, LABORATORIE DE CERAMIQUES NOUVELLES
C3 MANUFACTURING: THICK FILM PROCESS CHAIRPERSON: T.WADA (ESL-NIPPON)
470 1. DOUBLE SQUEEGEE SCREEN PRINT TECHNIQUE, EFFECT OF AIR FLOW AND
SQUEEGEE SPEED ON PRINTABILITY OF THROUGH-HOLE, BY K.TAKEDA & Y.UEMATSU,
IBM JAPAN LTD. 477 2. NOBLE STENCIL-PRINTING OF SOPHISTICATED EPOXY
RESIN ON THE FINE-PITCH SURFACE-MOUNT SUBSTRATE, A.OKUNO, JAPAN REC CO.,
LTD., E.TSUNASHLMA, MATSUSHITA ELECTRONICS CORP., E.AKIYAMA, SHIRAI
DENSI KOGYO 481 3. A NEW, PASTE-DISPENSING METHOD FOR FORMING THE
RESISTORS IN THICK-FILM THERMAL PRINT HEADS, BY T.SEINO, M.WATANABE &
K.SATO, HITACHI, LTD., K.YABUNO, HITACHI TECHNO ENGINEERING CO., LTD.
488 4. A NEW MASK-LESS PRINTING TECHNOLOGY FOR CONDUCTIVE PATTERNS ON A
GLASS-CERAMIC GREEN SHEET, BY S.ISOZAKL, M.SUGLMOTO, T.OHSHLMA, Y.KATOH,
Y.SHIMADA & H.TERAO, NEC CORP. C4 RELIABILITY: THICK FILM CHAIRPERSON:
I.TSUBATA (NAGAOKA JUNIOR COLLEGE) 494 1. ENHANCEMENT OF THE DIFFERENCE
IN QUALITY OF ELECTRON COUNTING AND ANALOG SEM IMAGES, BY
P.C.SARDESHMUKH, K.GOUHARA & Y.UCHIKAWA, NAGOYA UNIV. 501 2. HIGH
RELIABILITY THICK FILM PD/AG CONDUCTORS FOR AUTOMOTIVE APPLICATIONS, BY
H.KO|O, H.HARA, M.TSUCHIYA, Y.YAMAMOTO & B.E.TAYLOR, DU PONT JAPAN LTD.,
M.H.LABRANCHE, DUPONT EXPERIMENTAL STATION, K.YAMAMOTO, Y.SAWADA &
S.UCHIDA, TOYOTA MOTOR CORP. 508 3. AN INVESTIGATION ON LOAD LIFE OF
THICK-FILM RESISTORS IN HUMID ATOMOSPHERE, BY Y.TSURUTA, K.YAGINUMA &
S.CHIBA, SUMITOMO METAL MINING CO., LTD. C5 RELIABILITY: JOINT
CHAIRPERSON: H.OKIMURA (TOKAI UNIV.) 513 1. RELIABILITY OF NEW FLIP CHIP
INTERCONNECTIONS FOR CCD IMAGING DEVICES, BY T.TOGASAKI, Y.KONDOH &
M.SAITO, TOSHIBA CORP. 519 2. FATIGUE MECHANISM OF SOLDER JOINTS FOR QFP
BY THERMAL CYCLE TEST, BY S.BADONO, Y.KITAMURA & T.TAKAHAMA, MITSUBISHI
ELECTRIC CORP. 525 3. AN IMPROVEMENT ON SOLDER JOINT RELIABILITY FOR
ALUMINUM BASED (IMST) SUBSTRATE, BY N.SAKAMOTO, Y.LGARASHI, M.YAMAGISHI
& T.KANAI, SANYO ELECTRIC CO., LTD. 533 4. RELIABILITY EVALUATION OF
SILICON ON SILICON MULTICHIP MODULES, BY K.OKAJIMA, IBM JAPAN LTD. C6
DEVICE CHAIRPERSON: K.OGISO (TOKYO ENGINEERING UNIV.) 540 1. DEVELOPMENT
OF HIGH SPEED SERIAL TYPE THERMAL PRINTING HEAD, BY K.OISHI, H.KAMIMOTO,
K.NAKAZAWA & K.KURAMASU, MATSUSHITA ELECTRONIC COMPONENTS CO. 547 2.
DEVELOPMENT OF RU-TI-O THIN FILM RESISTOR BY THERMAL DECOMPOSITION
TECHNIQUE AND THERMAL PRINT HEAD USING THIS RESISTOR, BY K.KURAMASU &
A.HASHIMOTO, MATSUSHITA ELECTRONIC COMPONENTS CO., LTD., S.SALTO,
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 553 3. HEMT TECHNOLOGY-IMPACT
ON COMPUTERS AND COMMUNICATIONS, BY M.ABE, FUJITSU LABS. LTD. 561 4.
PIEZORESITIVITY IN HIGH GF THICK FILM RESISTORS: SENSOR DESIGN AND VERY
THIN YSZ SUBSTRATES, BY S.M.CHLTALE, C.Y.D.HUANG & S.J.STEIN,
ELECTRO-SCIENCE LABS. INC., T.WADA, ESL-NIPPON CO., LTD. C7
ENCAPSULATION MATERIALS CHAIRPERSON: I.TACHIKAWA (HOKURIKU TORYO CO.,
LTD.) 571 1. EPOXY MOLDING COMPOUNDS FOR MICROELECTRONICS INCLUDING
SURFACE MODIFIED SPHERICAL SILICA FILLERS, BY H.HOZOJI, M.OGATA,
S.EGUCHL & T.KITAMURA, HITACHI, LTD., O.HORIE, HITACHI CHEMICAL CO.,
LTD. 578 2. HIGH RELIABILITY LIQUID ENCAPSULATION OF BARE ICS FOR
SURFACE MOUNT PACKAGING, BY D.A.BURKHART, DEXTER ELECTRONIC MATERIALS
INDUSTRY 584 3. SCREEN PRINTABLE SILOXANE POLYIMIDE ENCAPSULANTS FOR
HIGH RELIABILITY HYBRID CIRCUITS, BY H.R.KUDER, D.M.SHENFIELD & J.R.
WILLIAMS, ABLESTIK LABS. C8 CERAMIC MATERIALS (2) CHAIRPERSON:
Y.NAKAMURA (NATIONAL DEFENCE ACADEMY) 588 1. PB-RELAXER BASED X7T
CERAMIC DIELECTRONICS, BY K.TSUZUKU & M.FUJIMOTO, TAIYO YUDEN CO., LTD.
595 2. CAZROJ-BASED DIELECTRIC SUBSTRATE WITH CU THICK FILM, BY
A.KANEUCHI, N.FUJIKAWA & S.KAWAGUCHI, KYOCERA CORP. 601 3. LOW
TEMPERATURE FIRING OF CORDIERITE-LEAD BOROSILICATE GLASSES, BY SHEN-LI
FU, KAOHSIUN G POLYTECHNIC INSTITUTE, LIH-SHAN CHEN, NATIONAL CHENG KUNG
UNIV. C9 MODULE: HIGH SPEED ASSEMBLE TECHNOLOGY CHAIRPERSON:
T.HARA(HOSEI UNIV.) 606 1. A HIGH-SPEED PHOTORECEIVER USING MICRO-SOLDER
BUMPS, BY H.TSUNETSUGU, K.KATSURA, T.HAYASHI, F.LSHITSUKA & S.HATA, NTT
LABS. 611 2. A 32-LEAD FLAT PCKAGE FOR HIGH SPEED GAAS DIGITAL ICS, BY
A.TOHDAKE, E.TAKAGL, K.YOSHIHARA & M.KONNO, TOSHIBA CORP. 619 3. NEW
HYBRID ASSEMBLY TECHNIQUE FOR HIGH-GAIN, WIDE-BAND AMPLIFIERS, BY
N.SATO, F.LSHITSUKA, M.HOSOYA, Y.HAKAMATA & H.KIKUCHI, NTT LABS.
|
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| spelling | International Microelectronics Conference 7 1992 Yokohama Verfasser (DE-588)5140977-X aut Proceedings of the 7th International Microelectronics Conference June 3 - 5, 1992, Yokohama, Japan Tokyo Soc. for Hybrid Microelectronics 1992 XIII, 622 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier (DE-588)1071861417 Konferenzschrift gnd-content GBV Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=018377876&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Proceedings of the 7th International Microelectronics Conference June 3 - 5, 1992, Yokohama, Japan |
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| title | Proceedings of the 7th International Microelectronics Conference June 3 - 5, 1992, Yokohama, Japan |
| title_auth | Proceedings of the 7th International Microelectronics Conference June 3 - 5, 1992, Yokohama, Japan |
| title_exact_search | Proceedings of the 7th International Microelectronics Conference June 3 - 5, 1992, Yokohama, Japan |
| title_full | Proceedings of the 7th International Microelectronics Conference June 3 - 5, 1992, Yokohama, Japan |
| title_fullStr | Proceedings of the 7th International Microelectronics Conference June 3 - 5, 1992, Yokohama, Japan |
| title_full_unstemmed | Proceedings of the 7th International Microelectronics Conference June 3 - 5, 1992, Yokohama, Japan |
| title_short | Proceedings of the 7th International Microelectronics Conference |
| title_sort | proceedings of the 7th international microelectronics conference june 3 5 1992 yokohama japan |
| title_sub | June 3 - 5, 1992, Yokohama, Japan |
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