Digest of technical papers: June 16 - 19, 1997, Chicago, Illinois, USA 1 Sessions 1A1 - 2D3, papers 1A1.01 - 2D3.14PL
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| 245 | 1 | 0 | |a Digest of technical papers |b June 16 - 19, 1997, Chicago, Illinois, USA |n 1 |p Sessions 1A1 - 2D3, papers 1A1.01 - 2D3.14PL |c 1997 International Conference on Solid State Sensors and Actuators |
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| adam_text | TRANSDUCERS C H I C A G O 1997 INTERNATIONAL CONFERENCE ON SOLID-STATE
SENSORS AND ACTUATORS JUNE 16-19, 1997 CHICAGO, ILLINOIS USA DIGEST OF
TECHNICAL PAPERS VOLUME 1 SESSIONS 1A - 2D3 PAPERS 1A1.O1 - 2D3.14PL
CONTENTS DATE: 6/16*97 1A1 PLENARY-1 STEPHEN D. SENTURIA, MASSACHUSETTS
INSTITUTE OFTECHRTOTOGY UNCONVENTIONAL METHODS AND UNCONVENTIONAL
MATERIALS FOR MICROFABRICATION G. WHITESIDES, HARVARD UNIVERSITY,
CAMBRIDGE, MA DATE: 6/16/97 1A2 PLENARY * 8 HSROYUM FUJTTA, UNIVERSITY
OF TOKYO HELMUT SEIDELTEMLC/DAIMTER-BENZ ACHIEVEMENTS OF JAPANESE
MICROMACHINE PROJECTS T. HATTORI, DENSO CORPORATION, AICHI, JAPAN 1A1.01
1A2.01 THE TWO-DIMENTIONAL MICRO-CONVEYER 1A2.02 M. EDO, Y. WATANABE, H.
NAKAZAWA, O. MORITA AND E. YONEZAWA, FUJI DATE: 6/16/97 1 A3 ACTUATORS-J
KRIS PISTER, UNIVERSITY OF CALIFORNIA BERKELEY HIROSRTI ADACHI,
MURORAN INSTITUTE OF TECHNOLOGY THE TWO-DIMENTIONAL MICRO-CONVEYER
1A3.01 M. EDO, Y. WATANABE, H. NAKAZAWA, O. MORITA AND E. YONEZAWA, FUJI
ELECTRIC CORPORATE RESEARCH AND DEVELOPMENT, LTD. TWO DIMENSIONAL MICRO
CONVEYANCE SYSTEM WITH THROUGH HOLES FOR ELECTRICAL AND FLUIDIC
INTERCONNECTION 1A3.02 M. EDO, Y. WATANABE, H. NAKAZAWA, O. MORITA AND
E. YONEZAWA, FUJI ELECTRIC CORPORATE RESEARCH AND DEVELOPMENT, LTD.
ELECTROSTATIC SURFACE DRIVES: THEORETICAL CONSIDERATIONS AND FABRICATION
1A3.03 Y. MITA, S. KONISHI AND H. FUJITA, THE UNIVERSITY OF TOKYO,
TOKYO, JAPAN MICRO BELLOW ACTUATORS 1A3.04 X. YANG AND Y. TAI,
CALIFORNIA INSTITUTE OF TECHNOLOGY, PASADENA, CA A CYLINDRICAL MICRO
ULTRASONIC MOTOR FABRICATED BY IMPROVED HYDROTHERMAL METHOD 1A3.05 T.
MORITA, M. KUROSAWA AND T. HIGUCHI, UNIVERSITY OF TOKYO, TOKYO, JAPAN
THE ELECTROSTATIC ULTRASONIC MICROMOTOR 1A3.06P J. DANEL, P. CHARVET, P.
ROBERT AND P. VILLARD, LETI - CEA, GRENOBLE, CEDEX, FRANCE OPTIMIZATION
OF SILICON LONGITUDINAL MODE ULTRASONIC ACTUATORS, WITH APPLICATION TO
SURGERY 1A3.07P A. LAI AND R. WHITE, UNIVERSITY OF CALIFORNIA AT
BERKELEY, BERKELEY, CA ANGULAR AND LINEAR MICROVIBROMOTOR 1A3.08PL P.
HELIN, V. SADAUNE, C. DRUON, INSTITUTE D ELECTRONIQUE ET DE
MICROELECTRONIQUE DU NORD, VILLENEUVE D ASCQ, FRANCE DATE: 6/16/97 1B3
RESONANT STRUCTURES PAUL ZAVRACKY, NORTHEASTERN UNIVERSITY WOLFGANG
BENECKE, IMSAS BREMEN LOW PRESSURE ENCAPSULATED RESONANT STRUCTURES
EXCITED ELECTROSTATICALLY 1B3.01 T. CORMAN, P. ENOKSSON AND G. STEMME,
ROYAL INSTITUTE OF TECHNOLOGY, STOCKHOLM, SWEDEN ANALYTICAL MODELING OF
MICROMACHINED RESONATOR SENSOR ACTIVATED BY CW LASER IRRADIATION K.
HANE, TOHOKU UNIVERSITY, SENDAI, JAPAN 1B3.02 FREQUENCY TRIMMING AND
Q-FACTOR ENHANCEMENT OF MICROMECHANICAL RESONATORS VIA LOCALIZED
FILAMENT ANNEALING 1B3.03 K.WANG AND C. NGUYEN, UNIVERSITY OF MICHIGAN,
ANN ARBOR, ML 3TI FREQUENCY TUNING OF A LATERALLY DRIVEN MICRORESONATOR
USING AN ELECTROSTATIC COMB ARRAY OF LINEARLY VARIED LENGTH 1 B3.04 K.
LEE AND Y. CHO, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY,
TAEJON, REPUBLIC OF KOREA TACTILE SENSOR USING PIEZOELECTRIC RESONATOR 1
B3.05 M. MAEZAWA, T. IMAHASHI, Y. KURODA, H. ADACHI AND K. YANAGISAWA,
OLYMPUS OPTICAL COMPANY, LTD., TOKYO, JAPAN MICROMACHINED VISCOSITY
SENSOR FOR REAL-TIME POLYMERIZATION MONITORING 1B3.06P O. BRAND, J.
ENGLISH, S. BIDSTRUP AND M. ALLEN, GEORGIA INSTITUTE OF TECHNOLOGY,
ATLANTA, GA MONITORING DESK-JET INKS AND SILICON OILS WITH THICKNESS
SHEAR MODE RESONATOR 1B3.07P S. KOLLER, J. KORVINK AND H. BALTES, ETH
ZURICH, SWITZERLAND TACTILE SENSING BASED ON ACOUSTIC RESONANCE TENSOR
CELL 1B3.08P H. SHINODA, K. MATSUMOTO, TOKYO UNIVERSITY OF AGRICULTURE &
TECHNOLOGY, TOKYO, JAPAN, AND S. ANDO, UNIVERSITY OF TOKYO, JAPAN DATE:
6/16/97 1C3 MTCROCNERNICAL REACTORS PETER HESKETH, UNIVERSITY OF
ILLINOIS AT CHICAGO PIET BERGVEID, UNIVERSITY OF TWENTE CHEMICAL
PERFORMANCE AND HIGH TEMPERATURE CHARACTERIZATION OF MICROMACHINED
CHEMICAL REACTORS 1C3.01 R. SRINIVASAN, S. FIREBAUGH, I. HSING, K.
JENSEN, M. SCHMIDT, MASSACHUSETTS INSTITUTE OF TECHNOLOGY, CAMBRIDGE,
MA, AND J. RYLEY, DUPONT CENTRAL R&D, WILMINGTON, DE MICROFLUIDIC
SUB-MILLISECOND MIXERS FOR THE STUDY OF CHEMICAL REACTION KINETICS
1C3.02 A. DESAI, X. YANG, Y. TAI, E. MARZLUFF, D. BOEKENKAMP AND S.
MAYO, CALIFORNIA INSTITUTE OF TECHNOLOGY, PASADENA, CA ON CHIP DETECTION
OF ELECTROGENERATED CHEMILUMINESCENCE OF RU(BPY) AT PT INTERDIGITATED
MICROELECTRODE ARRAYS 1C3.03 C. FIACCABRINO, P. ZWAHLEN, P. THIEBAUD, G.
RACINE, N. DE ROIJ AND M. KOUDELKA-HEP, UNIVERSITY OF NEUCHATEL,
NEUCHATEL, SWITZERLAND DNA QUANTIFICATION WITH AN ELECTROCHEMILUMINESCE
MICROCELL 1C3.04 Y. HSUEH, S. COLLINS AND R. SMITH, UNIVERSITY OF
CALIFORNIA, DAVIS, CA HIGHLY SENSITIVE DETECTION OF MORPHINE BY USING
IMMUNO- SENSOR BASED ON SURFACE-PRASMON-RESONANCE 1C3.05 G. SAKAI, K.
OGATA, N. MIURA, N. YAMAZOE, KYUSHU UNIVERSITY, FUKUOKA, JAPAN, AND T.
UDA, HIROSHIMA PREFECTURAL UNIVERSITY, JAPAN 6/16/97 103 PROCESS
TECHNOLOGY MICHAEL HUFF, CASE WESTERN RESERVE UNIVERSITY ERNST
OBERMEIER, TECHNICAL UNIVERSITY BERLIN DESIGN AND FABRICATION OF
MICROMIRROR ARRAY SUPPORTED BY VERTICAL SPRINGS 1D3.01 J. SHIN, Y. KIM,
SEOUL NATIONAL UNIVERSITY, SEOUL, KOREA, AND B. CHOI, SAMSUNG
ELECTRONICS INDUSTRIAL FABRICATION TECHNOLOGY FOR CMOS INFRARED SENSOR
ARRAYS 1 D3.02 U. MUNCH, D. JAEGGI, K. SCHNEEBERGER, O. PAUL, H. BALTES,
ETH ZURICH, ZURICH, SWITZERLAND, AND J. JASPER, EM MICROELECTRONIC-
MARIN, MARIN, SWITZERLAND CONFORMAL COATING BY PHOTORESIST OF SHARP
CORNERS OF ANISOTROPICALLY ETCHED THROUGH-HOLES IN SILICON 1 D3.03 M.
HESCHEL AND S. BOUWSTRA, TECHNICAL UNIVERSITY OF DENMARK, LYNGBY,
DENMARK TRANSDUCERS 97 1997 INTERNATIONAL CONFERENCE ON SOLID-STATE
SENSORS AND ACTUATORS CHICAGO, JUNE 16-19, 1997 THICK OXIDIZED POROUS
SILICON AS THERMO-LNSULATING MATERIAL FOR HIGH TEMPERATURE OPERATING
THIN AND THICK FILM GAS SENSORS 1D3.04 P. MACCAGNANI, R. ANGELUCCI, P.
POZZI, A. POGGI, L. DORI, G. CARDINALI AND P. NEGRINI, CNR-LAMEL
INSTITUTE, BOLOGNA, ITALY PECVD SILICON CARBIDE FOR MICROMACHINED
TRANSDUCERS 1 D3.05 A. FLANNERY, C. STORMENT, G. KOVACS, STANFORD
UNIVERSITY, STANFORD, CA, AND S. TSAI, CHEM TRACE CORPORATION, HAWYARD,
CA A SILICON MICROSUSPENSION FOR DISK DRIVE APPLICATIONS 1D3.06P M.
NARBUTOVSKIH, L. FIELD, G. CLIFFORD, D. HENZE, D. BURRIESCI, J. WILLIAMS
AND P. BECK, HEWLETT PACKARD LABORATORIES, PALO ALTO, CA SACRIFICIAL
OXIDE ETCHING COMPATIBLE WITH ALUMINUM METALLIZATION 1D3.07P P.
GENNISSEN AND P. FRENCH, DELFT UNIVERSITY OF TECHNOLOGY, DELFT, THE
NETHERLANDS MEASURING AND MODELING ELECTROSTATIC ADHESION IN
MICROMACHINES SECTION 2 - MATERIALS AND TECHNOLOGY: PERFORMANCE AND
RELIABILITY 1 D3.08P M. DE BOER, M. TABBARA, M. DUGGER AND T. MICHALSKE,
SANDIA NATIONAL LABORATORIES, ALBUQUERQUE, NM OFFSET REDUCTION OF HALL
PLATES IN THREE DIFFERENT CRYSTAL PLANES 1D3.09P S. BELLEKOM, DELFT
UNIVERSITY OF TECHNOLOGY, DELFT, THE NETHERLANDS, AND L. SARRO, DELFT
INSTITUTE OF MICROELECTRONICS AND SUBMICRONTECHNOLOGY, DELFT, THE
NETHERLANDS THERMALLY INSULATED STRUCTURES FOR IR BOLOMETERS, MADE OF
POLYCRYSTALLINE SILICON GERMANIUM ALLOYS 1D3.10P P. FIORINI, S. SEDKY,
M. CAYMAX AND A. VERBIST, C. BAERT, IMEC, LEUVEN, BELGIUM A HIGH-YIELD
DRYING PROCESS FOR SURFACE MICROSTRUCTURES USING ACTIVE LEVITATION 1
D3.11P C. LIU, UNIVERSITY OF ILLINOIS, URBANA, IL, T. TSAO AND Y. TAI,
CALIFORNIA INSTITUTE OF TECHNOLOGY, PASADENA, CA THIN TEFLON-LIKE FILMS
FOR ELIMINATING ADHESION IN RELEASED POFYSILICON MICROSTRUCTURES 1D3.12P
B. SMITH AND J. SNIEGOWSKI, SANDIA NATIONAL LABORATORIES, ALBUQUERQUE,
NM PREDICTION OF RELEASE-ETCH TIMES FOR SURFACE MICROMACHINED STRUCTURES
1D3.13P W. EATON, R. JARECKI AND J. SMITH, SANDIA NATIONAL LABORATORIES,
ALBUQUERQUE, NM HEMISPHERICAL-GRAINED LPCVD-POLYSILICON FILMS IN USE FOR
MEMS APPLICATIONS K. SUZUKI, NEC CORPORATIOIN, IBARAKI, JAPAN 1D3.14P
1A4 OPTICAL MICROSYSTEMS * I YU-CHONG TAI, CAMORNIA INSTITUTE OF
TECHNOLOGY HIROKI KUWANO, NTT INTEGRATED INFORMATION & ENERGY SYSTEMS
LABORATORIES A NEW, COMPACT AND QUICK-RESPONSE DYNAMIC FOCUSING LENS
1A4.01 T. KANEKO, T. OHMI, A. YAMAMOTO, N. KAWAHARA, T. IDOGAKI AND T.
HATTORI, DENSO CORPORATION, AICHI, JAPAN A MICRO SHUTTER FOR
APPLICATIONS IN OPTICAL AND THERMAL DETECTORS 1A4.02 T. KRAUS, M.
BALTZER AND E. OBERMEIER, TECHNICAL UNIVERSITY OF BERLIN, BERLIN,
GERMANY HIGH-SPEED MICRO-ELECTROMECHANICAL LIGHT MODULATION ARRAYS 1
A4.03 G. PERREGAUX, P. WEISS, J. THIEBAUD AND B. KLOECK, CSEM CENTRE
SUISSE D ELECTRONIQUE ET DE MICROTECHNIQUE SA, NEUCHATEL, SWITZERLAND
TRANSDUCERS W 1997 INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS AND
ACTUATORS CHICAGO, JUNE 16-19, 1997 INFRARED MICROMIRROR ARRAY WITH
LARGE PIXEL SIZE AND LARGE DEFLECTION ANGLE 1A4.04 B. WAGNER, A.
MACIOSSEK, K. REIMER, H. QUENZER AND U. HOFMANN, FRAUNHOFER INSTITUTE
FOR SILICON TECHNOLOGY, ITZEHOE, GERMANY OPTICAL REFRACTOMETRY USING A
MONOLITHICALLY INTEGRATED MACH-ZEHNDER INTERFEROMETER 1A4.05L B.
MAISENHOLDER, H. ZAPPE, R. KUNZ, M. MOSER, AND P. RIEL, PAUL SCHERRER
INSTITUTE, ZURICH, SWITZERLAND SILICON MIRRORS AND MICROMIRROR ARRAYS
FOR SPATIAL LASER BEAM MODULATION 1A4.06P W. DOTZEL, T. GESSNER, R.
HAHN, C. KAUFMANN, K. KEHR, S. KURTH AND J. MEHNER, TECHNICAL UNIVERSITY
CHEMNITZ-ZWICKAU, CHEMNITZ, GERMANY SURFACE-MICROMACHINED FREE-SPACE
FIBER OPTIC SWITCHES WITH INTEGRATED MICROACTUATORS FOR OPTICAL FIBER
COMMUNICATION SYSTEMS 1A4.07P S. LEE AND M. WU, UNIVERSITY OF
CALIFORNIA, LOS ANGELES, CA AN ELECTROMAGNETIC MEMS 2X2 FIBER OPTIC
BYPASS SWITCH 1A4.08P R. MILLER, Y. TAI, CALIFORNIA INSTITUTE OF
TECHNOLOGY, PASADENA, CA, BATCH-MICROMACHINED, HIGH ASPECT RATIO SI
MIRROR ARRAY FOR OPTICAL SWITCHING APPLICATIONS 1A4.09P R. MILLER, Y.
TAI, CALIFORNIA INSTITUTE OF TECHNOLOGY, PASADENA, CA; G. XU, J. BARTHA
AND F. LIN, PHYSICAL OPTICS CORPORATION HIGH MODULATION EFFICIENCY USING
OPTICAL FIBER COATED WITH ZNO PIEZOELECTRIC ACTUATOR 1A4.10P C.
WUTHRICH, C. MULLER, G. FOX AND N. SETTER, ECOLE POLYTECHNIQUE FEDERALE
DE LAUSANNE, LAUSANNE, SWITZERLAND OATE: 6/1687 1B4 FORCE AND FLOW
SENSORS GARY REDDER, CARNEGIE METTON UNIVERSITY RYSZARD S. JACTTOWICZ,
WARSAW UNIVERSITY OF TECHNOLOGY NEW PIEZO-TUNNELING STRAIN SENSOR WITH
VERY LOW TEMPERATURE SENSITIVITY 1B4.01 A. FRIEDRICH, P. BESSE, R.
POPOVIC, SWISS FEDERAL INSTITUTE OF TECHNOLOGY, AND C. ASHRUF, DELFT
UNIVERSITY OF TECHNOLOGY, DELFT, THE NETHERLANDS MICROMACHINED SENSORS
FOR STATIC AND DYNAMIC SHEAR-STRESS MEASUREMENTS IN AERODYNAMIC FLOWS A.
PADMANABHAN, M. SHEPLAK, K. BREUER AND M. SCHMIDT, MASSACHUSETTS
INSTITUTE OF TECHNOLOGY, CAMBRIDGE, MA 1B4.02 TORSIONAL FORCE PROBES
OPTIMIZED FOR HIGHER ORDER MODE SUPPRESSION 1 B4.03 T. STOWE, K.
YASUMURA, T. PFAFMAN, T. KENNY, STANFORD UNIVERSITY, STANFORD, CA, D.
BOTKIN AND D. RUGAR, IBM RESEARCH DIVISION A NEW BI-DIRECTIONAL GAS-FLOW
SENSOR BASED ON LIFT FORCE N. SVEDIN, E. STEMME AND G. STEMME, ROYAL
INSTITUTE OF TECHNOLOGY, STOCKHOLM, SWEDEN 1B4.04 ANALYSIS OF FLUIDIC
AND MECHANICAL MOTION IN MEMS BY USING HIGH SPEED X-RAY MICRO-IMAGING
TECHNIQUES 1 B4.05L T.-S. LEU, A.-M. LANZILLOTTO, M. AMABILE AND R.
WILDES, DAVID SARNOFF RESEARCH CENTER, PRINCETON, NJ DESIGNING,
REALIZATION AND CHARACTERIZATION OF A NOVEL CAPACITIVE PRESSURE / FLOW
SENSOR 1 B4.06P R. OOSTERBROEK, T. LAMMERINK, J. BERENSCHOT AND M.
ELWENSPOEK, UNIVERSITY OF TWENTE, ENSCHEDE, THE NETHERLANDS THE PRANDTL
MICRO FLOW SENSOR (PMFS): A NOVEL SILICON DIAPHRAGM CAPACITIVE SENSOR
FOR FLOW VELOCITY MEASUREMENT 1 B4.07 O. BERBERIG, K. NOTTMEYER, ZEXEL
CORPORATION, HANNOVER, GER- MANY, J. MIZUNO, Y. KANAI AND T. KOBAYASHI,
ZEXEL CORPORATION 10 DESIGN AND FABRICATION OF A LOW COST WATER FLOW
METER 1B4.08P L CASTANER, V. JIMENEZ, M. DOMINGUEZ, F. MASANA AND A.
RODRIGUEZ, UNIVERSIDAD POLITECNICA DE CATALUNA, SPAIN DATE: 6/16/97 1C4
IMRMINOSENSORS TOGEMAR LUNDSTRINVUNKTPING UNIVERSITY MFCTAEI RAMSEY, OAK
RIDGE NATIONAL LABORATORY MICROFLUIDIC SYSTEMS FOR CLINICAL DIAGNOSTICS
N. CHIEM, C. COLYER AND D. HARRISON, UNIVERSITY OF ALBERTA, EDMONTON,
AB, CANADA 1C4.01 SHEAR HORIZONTAL SURFACE ACOUSTIC WAVE BASED
HNMUNOSENSING SYSTEM 1C4.02 A. CAMPITELLI, W. WLODARSKI, ROYAL MELBOURNE
INSTITUTE OF TECHNOLOGY, VICTORIA, AUSTRALIA, M. HOUMMADY, UNIVERSITY OF
TOKYO, JAPAN, AND W. SAWYER, UNIVERSITY OF MELBOURNE, AUSTRALIA A
SILICON-BASED ULTRASONIC IMMUNOASSAY FOR DETECTION OF BREAST CANCER
ANTIGENS 1C4.03 A. WANG, R. WHITE, UNIVERSITY OF CALIFORNIA AT BERKELEY,
BERKELEY, CA, R. KIWAN AND R. CERIANI, CANCER RESEARCH FUND OF CONTRA
COSTA DISPOSABLE THICK-FILM LIPOSOME IMMUNOSENSOR FOR THEOPHYLLINE USING
IMMUNOCHROMATOGRAPHIC MATRIX 1C4.04 K. LEE, H. YEE AND J. PARK, LG
ELECTRONICS RESEARCH CENTER, SEOUL, KOREA SINGLE HEART CELL FORCE
MEASURES IN STANDARD CMOS 1 C4.05L G. LIN, K. ROOS, UNIVERSITY OF
CALIFORNIA, LOS ANGELES, CA, R. PALMER AND K. PISTER, UNIVERSITY OF
CALIFORNIA, BERKELEY, CA DATE: 6/16/97 104 PACKAGING TECHNOLOGY
MASAYOSHI ESASNLTOHOKU UNIVERSITY OWW MONK, MOTOROLA A GENERIC
MICROMACHINED SILICON PLATFORM FOR LOW-POWER, LOW-LOSS MINIATURE
TRANSCEIVERS 1 D4.01 B. ZIAIE, N. KOCAMAN AND K. NAJAFI, UNIVERSITY OF
MICHIGAN, ANN ARBOR, ML ADVANCED MULTICHIP MODULE PACKAGING OF
MICROELECTROMECHANICAL SYSTEMS 1 D4.02 J. BUTLER, V. BRIGHT AND J.
COMTOIS, AIR FORCE INSTITUTE OF TECHNOLOGY, WRIGHT-PATTERSON AFB, OH
BATCH TRANSFER OF MICROSTRUCTURES USING FLIP-CHIP SOLDER BUMP BONDING
1D4.03 A. SINGH, D. HORSLEY, M. CONN, A. PISANO AND R. HOWE, BERKELEY
SENSOR & ACTUATOR CENTER, BERKELEY, CA WIRE BONDING OVER INSULATING
SUBSTRATES BY ELECTROPOLYMERIZATION OF POLY PYRROLE USING SCANNING
MICRO-NEEDLE 1D4.04 S. SHIRATORI, S. MORI AND K. IKEZAKI, KEIO
UNIVERSITY, YOKOHAMA-SHI, JAPAN MICROJOINERY: MICROMACHINED TRANSLATIONS
STAGES FOR OPTOMECHANICAL DEVICES AND SYSTEMS 1 D4.05L C. GONZALEZ AND
S. COLLINS, DAMIEN ASSOCIATES, DAVIS, CA NOVEL PACKAGING TECHNIQUE AND
ITS APPLICATION TO A WET/WET DIFFERENTIAL PRESSURE SILICON SENSOR 1
D4.06P H. KRASSOW, D. HEIMLICH, F. CAMPABADAL AND E. LORA-TAMAYO, CENTRA
NACIONAL DE MICROELECTRONICA CNM-IMB, BALLATERRA, SPAIN MICROMOTOR
ASSEMBLY USING HIGH ACCURATE OPTICAL VISION FEEDBACK FOR MICROROBOT
RELATIVE 3D DISPLACEMENT IN SUBMICRON RANGE 1 D4.07P A. SULZMANN, J.
BREGUET AND J. JACOT, SWISS FEDERAL INSTITUT OF TECHNOLOGY, LAUSANNE,
SWITZERLAND ACCELERATED TESTING OF ANODICALLY BONDED GLASS-SILICON
PACKAGES IN SALT WATER 1 D4.08P M. DOKMECI, J. VON ARX AND K. NAJAFI,
UNIVERSITY OF MICHIGAN, ANN ARBOR, ML INTEGRATED SENSOR WAFER-LEVEL
PACKAGING S. AUDET AND K. EDENFELD, MOTOROLA, INC., MESA, AZ 1D4.09P
DATE: 6/17/97 2A1 INTELLIGENT SYSTEMS KHAJIF NAJAFI, UNIVERSITY OF
MICHIGAN CLMOO SONG, SAMSUNG ADVANCED INSTITUTE OF TECHNOLOGY
INTELLIGENT SENSOR SYSTEMS S. ANDO, UNIVERSITY OF TOKYO, TOKYO, JAPAN
2A1.01 AN ADAPTIVE CALIBRATION TECHNIQUE FOR MICROMACHINED PRESSURE
SENSORS 2A1.02 J. LLOYD, H. LEE, L. PARAMESWARAN, M. SCHMIDT AND C.
SODINI, MASSACHUSETTS INSTITUTE OF TECHNOLOGY, CAMBRIDGE, MA
SELF-CALIBRATING ELECTROCHEMICAL GASSENSOR 2A1.03 L. MAKADMINI AND M.
HORN, UNIVERSITAT DER BUNDESWEHR MUNCHEN, MUNICH, GERMANY A CHEMICAL
MICROANALYSIS SYSTEM AS A MICROFLUID SYSTEM DEMONSTRATOR 2A1.04 M.
RICHTER, M. EBERL, P. WOIAS, FRAUNHOFER-LNSTITUTE FOR SOLID STATE
TECHNOLOGY (IFT), MUNICH, GERMANY, A. PARK, H. LEEUWIS, 3T B.V.,
ENSCHEDE, THE NETHERLANDS, J. NAUNDORF AND A. STECKENBORN, SIEMENS AG,
BERLIN, GERMANY ULTRAFAST CORRELATION IMAGE SENSOR: CONCEPT, DESIGN, AND
APPLICATIONS 2A1.05P S. ANDO, T. NAKAMURA AND T. SAKAGUCHI, THE
UNIVERSITY OF TOKYO, TOKYO, JAPAN COMFORT SENSING SYSTEM FOR INDOOR
ENVIRONMENT 2A1.06P J. KANG, Y. KIM, H. KIM, S. PARK, KYUNGPOOK NATIONAL
UNIVERSITY, TAEGU, KOREA, AND J. JEONG, ORIENTAL ELECTRONICS COMPANY,
LTD. AN INTEGRATED MEMS SYSTEM FOR TURBULENT BOUNDARY LAYER CONTROL
2A1.07P T. TSAO, F. JIANG, B. GUPTA, R. GOODMAN, Y. TAI, CALIFORNIA
INSTITUTE OF TECHNOLOGY, PASADENA, CA, S. TUNG AND C. HO, UNIVERSITY OF
CALIFORNIA, LOS ANGELES, CA 6/17/97 281 MAGNETIC SENSORS MARK ALIEN,
GEORGIA INSTITUTE OF TECHNOLOGY R. F. WORFFENBUTTEI, DELFT UNIVERSITY OF
TECHNOLOGY HALL DEVICES FOR MAGNETIC SENSOR MICROSYSTEMS R. POPOVIC,
EPFL, LAUSANNE, SWITZERLAND 2B1.01 11 OFFSET REDUCTION IN HALL DEVICES
BY CONTINUOUS SPINNING CURRENT METHOD 2B1.02 R. STEINER, A. HABERLI, F.
STEINER AND H. BALTES, PHYSICAL ELECTRONICS LABORATORY, ETH ZURICH,
SWITZERLAND CONTACTLESS ANGLE MEASUREMENT USING FOUR HALL DEVICES ON
SINGLE CHIP 2B1.03 M. METZ, A. HABERLI, M. SCHNEIDER, R. STEINER AND H.
BALTES, PHYSICAL ELECTRONICS LABORATORY, ETH ZURICH, SWITZERLAND COIN
RECOGNITION USING AN INDUCTIVE PROXIMITY SENSOR MICROSYSTEM 2B1.04 P.
PASSERAUB, P. BESSE, C. DE RAAD, O. DEZUARI, F. QUINET AND R. POPOVIC,
SWISS FEDERAL INSTITUTE OF TECHNOLOGY, LAUSANNE, SWITZERLAND LINEARIZING
INTEGRATED HALL DEVICES 2B1.05P C. SCHOTT AND R. POPOVIC, SWISS FEDERAL
INSTITUTE OF TECHNOLOGY LAUSANNE (EPFL), ECUBLENS, SWITZERLAND A
MICROMACHINED ANGLED HALL MAGNETIC FIELD SENSOR USING NOVEL IN-CAVITY
PATTERNING 2B1.06 M. PARANJAPE, IRST, TRENTO, ITALY & UC BERKELEY,
BERKELEY, CA, L. LANDSBERGER, M. KAHRIZI, B. NIKPOUR, CONCORDIA
UNIVERSITY, MONTREAL, CANADA, F. GIACOMOZZI, B. MARGESIN AND M. ZEN,
IRST, TRENTO, ITALY TRANSDUCERS 97 1997 INTERNATIONAL CONFERENCE ON
SOLID-STATE SENSORS AND ACTUATORS CHICAGO, JUNE 16-19, 1997 LOW-COST
2DEG MAGNETIC SENSOR WITH METROLOGICAL PERFORMANCES FOR MAGNETIC FIELD
AND CURRENT SENSING 2B1.07P V. MOSSER, S. ABOULHOUDA, SCHLUMBERGER-ETL,
MONTROUGE, FRANCE, F. KOBBI, SCHLUMBERGER INDUSTRIES, W. UNION, SC, S.
CONTRERAS, J. MERCY, J. ROBERT, UNIV. MONTPELLIER II, MONTPELLIER,
FRANCE, J. CHEVRIER, PICOGIGA, LESULIS, FRANCE, AND D. ADAM,
THOMPSON-CSF, ORSAY, FRANCE MICROMECHANICAL RESONANT MAGNETIC SENSOR IN
STANDARD CMOS 2B1.08P B. EYRE, UNIVERSITY OF CALIFORNIA AT LOS ANGELES,
CA AND K. PISTER, UNIVERSITY OF CALIFORNIA AT BERKELEY, CA
NON-DESTRUCTIVE EVALUATION USING THE SQUID WITH INTEGRATED GRADIOMETER
2B1.09P H. NAKANE, MURORAN INSTITUTE OF TECHNOLOGY, MURORAN, JAPAN
GARNET TRANSDUCERS FOR MAGNETIC REID TOPOLOGY IMAGING 2B1.10P V.
VISHNEVSKI, S. DUBINKO, A. NEDVIGA, A. PROKOPOV, SIMFEROPOL STATE
UKRAINE, ANDS. LEVY, NATIONAL TECHNICAL UNIVERSITY KIEV POLYTECHNICAL
INSTITUTE , UKRAINE MAGNETORESISTANCE EFFECT OF INAS DEEP QUANTUM WELL
STRUCTURES GROWN ON GAAS SUBSTRATES BY MOLECULAR BEAM EPITAXY 2B1.11PL
T. YOSHIDA, S. MURAMATSU, ASAHIKASEI ELECTRONICS CO., LTD., SHIZUOKA,
JAPAN, A. OKAMOTO, N. KUZE AND I. SHIBASAKI, ASAHI CHEMICAL INDUSTRY
CO., LTD., JAPAN FABRICATION OF ULTRASENSITIVE PIEZORESITIVE CANTILEVERS
FOR TORQUE MAGNETOMETRY 2B1.12PL J. BRUGGER, C. ROSSEL, P. VETTIGER, IBM
ZURICH RESEARCH LABORATORY, RUSCHLIKON, SWITZERLAND, M.WILLEMIN,
UNIVERSITY OF ZURICH, ZURICH, SWITZERLAND, AND G. BELJAKOVIC, UNIVERSITY
OF NEUCHATEL, NEUCHATEL, SWITZERLAND DATE: 6/17/97 2C1 BIOANALYTICAF
SYSTEMS JED HARRISON, UNIVERSITY OF ALBERTA TOYOSAKA MORLIXUTNL TOKYO
INSTITUTE OF TECHNOLOGY MOLECULAR SURGERY BASED ON MICROSYSTEMS
M.WASHIZU, KYOTO UNIVERSITY, KYOTO, JAPAN 2C1.01 MICROFLUIDIC
BIOCHEMICAL ANALYSIS SYSTEM 2C1.02 R. ANDERSON, G. BOGDAN, Z. BARNIV, J.
WINKLER, K. ROY AND T. DAWES, AFFYMETRIX, INC., SANTA CLARA, CA
THREEDIMENSIONALLY STRUCTURED TRANSDUCERS FOR CHEMICAL AND BIOCHEMICAL
SENSORS 2C1.03 N. CONRATH, N. CZUPOR, R. STEINKUHL, C. SUNDERMEIER,
D.TRAU, M. WITTKAMPF, H. HINKERS, M. MEUSEL, G. GHEMNITIUS, M. KNOLL, F.
SPENER AND K. CAMMANN, INSTITUT FUR CHEMO-UND BIOSENSORIK (ICB),
MUNSTER, GERMANY A BIO/MAGNETIC BEAD SEPARATOR ON GLASS CHIPS USING
SEMI-ENCAPSULATED SPIRAL ELECTROMAGNETS 2C1.04 T. LIAKOPOULOS, J. CHOI
AND C. ANN, UNIVERSITY OF CINCINNATI, CINCINNATI, OH A NOVEL APPLICATION
OF LAPS FOR THE DETERMINATION OF SEROTONIN 2C1.05P X. JUN, W. PING AND
F. WUWEI, ZHEJIAN UNIVERSITY, HANGZHOU, CHINA PECULIARITIES OF DNA
DETECTION USING EVANESCENT FIELD BIOSENSING 2C1.07P T. BORCHERS, F.
SPENER, INSTITUTE OF CHEMICAL AND BIOCHEMICAL SENSOR RESEARCH, MUNSTER,
GERMANY, B. SPECHT, INVENTUS BIOTEC, MUNSTER, GERMANY, A. KRUCHININ AND
Y. VLASOV, ST. PETERSBURG STATE UNIVERSITY, SAINT PETERSBURG, RUSSIA
BIO-OPTOELECTRONICAL TONGUE FOR DETECTION OF PESTICIDE CONTAMINATION
OF WATER 2C1.08P P. NIKITIN, T. KSENEVICH AND N. KALABINA, GENERAL
PHYSICS INSTITUTE, MOSCOW, RUSSIA TRANSDUCERS 97 1997 INTERNATIONAL
CONFERENCE ON SOLID-STATE SENSORS AND ACTUATORS CHICAGO, JUNE 16-19,
1997 DATE: 6/17/97 2DT MECHANICAL PROPERTIES HENRY GUCKEL, UNIVERSITY OF
WISCONSIN OSAMU TABATA, RITSURFLEIKAN UNIVERSITY MATERIALS RELIABILITY
IN MEMS DEVICES 2D1.01 S. BROWN, W. VAN ARSDELL, C. MUHLSTEIN, FAILURE
ANALYSIS ASSOCIATES, FRAMINGHAM, MA MICRO TENSILE-TEST OF SILICON FILM
HAVING DIFFERENT CRYSTALLOGRAPHIC ORIENTATIONS 2D1.02 K. SATO, M.
SHIKIDA, T. YOSHIOKA, T. ANDO, NAGOYA UNIVERSITY, NAGOYA, JAPAN, AND T.
KAWABATA, OMRON CORPORATION, JAPAN MECHANICAL CHARACTERIZATION OF
MICROGRIPPERS REALIZED BY UGA TECHNIQUE 2D1.03 S. BASROUR, S.
BALLANDRAS, L. ROBERT AND D. HAUDEN, INSTITUT DES MICROTECHNIQUES DE
FRANCHE-COMTE, BESANCON, FRANCE FABRICATION AND CHARACTERIZATION OF
U-SHAPED BEAMS FOR THE DETERMINATION OF YOUNG S MODULUS MODIFICATION DUE
TO JOULE HEATING OF POLYSILICON MICROSTRUCTURES 2D1.04 E. YANG AND H.
FUJITA, THE UNIVERSITY OF TOKYO, TOKYO, JAPAN MECHANICAL PROPERTIES OF
LIGA-DEPOSITED NICKEL FOR MEMS TRANSDUCERS 2D1.05P W. SHARPE, JR., D.
LAVAN AND R. EDWARDS, THE JOHNS HOPKINS UNIVERSITY, BALTIMORE, MD
MECHANICAL BEHAVIOR OF STRUCTURES FOR MICROELECTRO- MECHANICAL SYSTEMS
W. SUWITO, M. DUNN, UNIVERSITY OF COLORADO, BOULDER, CO, AND S.
CUNNINGHAM, FORD MICROELECTRONICS, INC. 2D1.06P APPLICATIONS OF DYNAMIC
TECHNIQUES FOR ACCURATE DETERMINATION OF SILICON NITRIDE YOUNG S MODULI
2D1.07P M. HOUMMADY, E. FARNAULT, H. KAWAKATSU AND T. MASUZAWA,
UNIVERSITY OF TOKYO, TOKYO, JAPAN THERMOELECTRIC TEST STRUCTURES TO
MEASURE THE HEAT CAPACITY OF CMOS LAYER SANDWICHES M. VON ARX, O. PAUL
AND H. BALTES, ETH ZURICH, ZURICH, SWITZERLAND IMPACT OF LONG, HIGH
TEMPERATURE ANNEALS ON RESIDUAL STRESS IN POLYSILICON Y. GIANCHANDANI,
K. NAJAFI, UNIVERSITY OF MICHIGAN, ANN ARBOR, ML, AND M. SHINN, SAMSUNG
ADVANCED INSTITUTE OF TECHNOLOGY, SUWON, KOREA 2D1.08P 2D1.09PL 6/17/97
2A2 OPTICAL MICROSYSTEMS - H MEHRAN MEHREGANY, CASE WESTERN RESERVE
UNIVERSITY YOSHMOBU SUGIYAMA, R&D ASSOCIATION FOR FUTURE ELECTRON
DEVICES (FED) SELF-ASSEMBLED MICROACTUATED XYZ STAGES FOR OPTICAL
SCANNING AND ALIGNMENT 2A2.01 L. FAN, M. WU, UNIVERSITY OF CALIFORNIA,
LOS ANGELES, CA, AND K. CHOQUETTE, SANDIA NATIONAL LABORATORIES ACTUATED
POLYSILICON MICROMIRRORS FOR RASTER- SCANNING DISPLAYS 2A2.02 M. KIANG,
D. FRANCIS, C. CHANG-HASNAIN, K. LAU, R. MULLER, UNIVERSITY OF
CALIFORNIA AT BERKELEY, BERKELEY, CA, AND O. SOLGAARD, UNIVERSITY OF
CALIFORNIA AT DAVIS, CA A NOVEL TWO AXIS ACTUATOR FOR HIGH SPEED LARGE
ANGULAR ROTATION 2A2.03 V. DHULER, M.WALTERS, R. MAHADEVAN, K.MARKUS,
MCNC, RTP, NC, M. JHONSON AND N. LOEBEL, MEDCAM, INC., BELLVIEW, WA
MICRO-OPTICAL GATE FOR FIBER OPTIC COMMUNICATION 2A2.04 E. HASHIMOTO, Y.
UENISHI, S. NAGAOKA, NTT OPTO-ELECTRONICS LABORATORIES, TOKYO, JAPAN,
AND K. HONMA, NTT ADVANCED TECHNOLOGY 12 INVESTIGATION OF THE MAXIMUM
OPTICAL POWER RATING FOR A MICRO-ELECTRO-MECHANICAL DEVICE 2A2.05 D.
BURNS AND V. BRIGHT, AIR FORCE INSTITUTE OF TECHNOLOGY, WRIGHT PATTERSON
AFB, OH THE 2-DIMENSIONAL MICRO SCANNER INTEGRATED WITH PZTTHIN FILM
ACTUATOR 2A2.06P T. KAWABATA, M. IKEDA, M. SAKATA, H. GOTO, M. MATSUMOTO
AND T. YADA, OMRON CORPORATION, IBARAKI PREF., JAPAN
SURFACE-MICROMACHINED DIFFRACTION GRATINGS FOR SCANNING SPECTROSCOPIC
APPLICATIONS M. KIANG, J. NEE, K. LAU AND R. MULLER, UNIVERSITY OF
CALIFORNIA AT BERKELEY, CA 2A2.07P AUTOMATED ASSEMBLY OF FLIP-UP
MICROMIRRORS 2A2.08P J. REID, V. BRIGHT AND J. COMTOIS, AIR FORCE
INSTITUTE OF TECHNOLOGY, WRIGHT PATTERSON AFB, OH DATE: 6/17/97 2B2
ACOUSTIC DEVICES RICHARD MAILER, UNIVERSITY OF CALIFORNIA * BERKELEY
RONALD 8. ZMOOD, ROYAL MELBOURNE INSTITUTE OF TECHNOLOGY MICROMACHINED
FERROELECTRIC TRANSDUCERS FOR ACOUSTIC IMAGING 2B2.01 J. BERNSTEIN, K.
HOUSTON, L. NILES, S. FINBERG, CHARLES STARK DRAPER LAB., CAMBRIDGE, MA,
L. CROSS, PENNSYLVANIA STATE UNIV., H. CHEN, SARNOFF RESEARCH CTR.,
PRINCETON, NJ, K. LI, NZ APPLIED TECHNOLOGIES, WOBURN, MA, AND K.
UDAYAKUMAS, TEXAS INSTRUMENTS, INC., DALLAS, TX A MICROMACHINED
THIN-FILM TEFLON ELECTRET MICROPHONE 2B2.02 W. HSIEH, T. HSU AND Y. TAI,
CALIFORNIA INSTITUTE OF TECHNOLOGY, PASADENA, CA A MICRO-MACHINED
LOUDSPEAKER FOR THE HEARING IMPAIRED 2B2.03 M. HARRADINE, T. BIRCH, J.
STEVENS AND C. SHEARWOOD, THE UNIVERSITY OF SHEFFIELD, SHEFFIELD, UNITED
KINGDOM PARTIALLY IMPLANTABLE VIBRATING OSSICULAR PROSTHESIS 2B2.04 T.
DIETZ, G. BALL AND R. KATZ, SYMPHONIX DEVICES, INC., SAN JOSE, CA THE
MICROFABRICATION OF CAPACITIVE ULTRASONIC TRANSDUCERS 2B2.05 X. JIN, I.
LADABAUM AND B. KHURI-YAKUB, STANFORD UNIVERSITY, STANFORD, CA
ULTRASOUND TRANSDUCER FOR DISTANCE MEASUREMENT 2B2.06P M. HORNUNG, O.
PAUL, H. BALTES, ETH ZURICH, SWITZERLAND, AND O. BRAND, GEORGIA
INSTITUTE OF TECHNOLOGY, ATLANTA, GA A POLYMER CONDENSER MICROPHONE ON
SILICON WITH ON-CHIP CMOS AMPLIFIER 2B2.07PL M. PEDERSEN, W. OLTHUIS,
AND P. BERGVELD, UNIVERSITY OF TWENTE, ENSCHEDE, THE NETHERLANDS DATE:
6/17/97 2C2 ANALYTICAL SYSTEMS -1 CARLOS MASTRANGETO, UNIVERSITY OF
MICHIGAN GIORGIO SBERVEGIIERL UNIVERSITA DI BRESCIA AN ELECTROPHORETIC
SERIAL TO PARALLEL CONVERTER 2C2.01 L. BOUSSE, A. KOPF-SILL AND J.
PARCE, CALIPER TECHNOLOGIES CORPORATION, PALO ALTO, CA LARGE VOLUME
INTEGRATED CAPILLARY ELECTROPHORESIS STAGE FABRICATED USING
MICROMACHINING OF PLASTICS ON SILICON SUBSTRATES 2C2.02 J.WEBSTER AND C.
MASTRANGELO, UNIVERSITY OF MICHIGAN, ANN ARBOR, ML A CHEMICAL MICRO
ANALYSIS SYSTEM FOR MEASUREMENT OF PRESSURE, FLOW RATE, TEMPERATURE,
CONDUCTIVITY, UV-ABSORPTION AND FLUORESCENCE 2C2.03 P. NORLIN, L.
FORSSEN, INDUSTRIAL MICROELECTRONICS CENTER, KISTA, SWEDEN, O. OHMAN AND
B. EKSTROM, PHARMACIA BIOTECH AB, UPPSALA, SWEDEN NOVEL MICROSTRUCTURES
AND TECHNOLOGIES APPLIED IN CHEMICAL ANALYSIS TECHNIQUES 2C2.04 V.
SPIERING, A. VAN DEN BERG, MESA RESEARCH INSTITUTE, ENSCHEDE, THE
NETHERLANDS, H. VAN DER MOOLEN, UNIVERSITY OF AMSTERDAM, AND G. BURGER,
TWENTE MICROPRODUCTS ENHANCED CHROMATOGRAPHIC PERFORMANCE OF SILICON-
MICROMACHINED CAPILLARY-COLUMN WITH CLEAN STRUCTURE AND INTERACTIVE
PLASMA ORGANIC FILMS 2C2.05 S. HANNOE, I. SUGIMOTO, K. YANAGISAWA AND H.
KUWANO, NTT INTEGRATED INFORMATION & ENERGY SYSTEMS LABORATORIES, TOKYO,
JAPAN INTEGRATED MICROCHANNEL WITH METALLIC AND POLYMERIC CHANNEL
SECTIONS 2C2.06P J. HUNT AND A. FRAZIER, UNIVERSITY OF UTAH, SALT LAKE
CITY, UT ISO-THERMAL DNA REACTIONS AND ASSAYS IN MICROFABRICATED
CAPILLARY ELECTROPHORESIS SYSTEMS 2C2.07P T. TANG, G. OCVIRK, D.
HARRISON, UNIVERSITY OF ALBERTA, EDMONTON, AB, CA FLUIDIC INTERCONNECTS
FOR MODULAR ASSEMBLY OF CHEMICAL MICROSYSTEMS 2C2.08P C. GONZALEZ, S.
COLLINS AND R. SMITH, UNIVERSITY OF CALIFORNIA, DAVIS, CA DIFFERENTIAL
BLOOD CELL COUNTS OBTAINED USING A MICROCHANNEL BASED FLOW CYTOMETER
2C2.09P E. ALTENDORF, D. ZERBERT, M. HOOL AND P. YAGER, UNIVERSITY OF
WASHINGTON, SEATTLE, WA A METHOD FOR DETERMINATION OF PH USING AT-SENSOR
2C2.10P P. GALAMBOS, F. FORSTER AND B. WEIGL, UNIVERSITY OF WASHINGTON,
SEATTLE, WA A MICRO-FLUID CHANNEL CALORIMETER USING BISB/SB THIN FILM
THERMOPILES 2C2.11P M. ZIEREN AND J. KOHLER, INSTITUTE OF PHYSICAL HIGH
TECHNOLOGY, JENA, GERMANY MEASURING CONDUCTIVITY, TEMPERATURE AND
HYDROGEN PEROXIDE CONCENTRATION USING A SINGLE SENSOR STRUCTURE 2C2.12P
G. LANGEREIS, W. OLTHUIS AND P. BERGVELD, UNIVERSITY OF TWENTE,
ENSCHEDE, THE NETHERLANDS 6/17/S7 2D2 BONDED FT HARM TECHNOLOGY DAVID
EDDY, GENERAL MOTORS R&D CENTER ROBERT PETERS, CATHOLIC U. LEUVEN IC
PROCESS COMPATIBILITY OF SEALED CAVITY SENSORS L. PARAMESWARAN, C. HSU
AND M. SCHMIDT, MASSACHUSETTS INSTITUTE OF TECHNOLOGY, CAMBRIDGE, MA
2D2.01 CMOS COMPATIBLE WAFER SCALE ADHESIVE BONDING FOR CIRCUIT TRANSFER
2D2.02 S. VAN DER GROEN, M. ROSMEULEN, P. JANSEN, L. DEFERM AND K.
BAERT, IMEC, HEVERLEE, BELGIUM HIGH ASPECT RATIO SINGLE CRYSTALLINE
SILICON MICROSTRUCTURES FABRICATED WITH MULTI LAYER SUBSTRATES 2D2.03 C.
GUI, H. JANSEN, M. DE BOER, J. GARDENIERS AND M. ELWENSPOEK, UNIVERSITY
OF TWENTE, ENSCHEDE, THE NETHERLANDS EMBEDDED INTERCONNECT AND
ELECTRICAL ISOLATION FOR HIGH-ASPECT-RATIO, SOI INERTIAL INSTRUMENTS
2D2.04 T. BROSNIHAN, J. BUSTILLO, A. PISANO AND R. HOWE, UNIVERSITY OF
CALIFORNIA AT BERKELEY, BERKELEY, CA TRANSDUCERS 97 *1 Q 1997
INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS AND ACTUATORS ^
CHICAGO, JUNE 16-19, 1997 FABRICATION PROCESS OF HIGH ASPECT RATIO
ELASTIC STRUCTURES FOR PIEZOELECTRIC MOTOR APPLICATIONS 2D2.05 L
DELLMAN, S. ROTH, G. RACINE, N. DE ROOIJ, UNIVERSITY OF NEUCHATEL,
NEUCHATEL, SWITZERLAND, H. LORENZ, P. RENAUD, SWISS FEDERAL INSTITUTE OF
TECHNOLOGY, SWITZERLAND, AND P. VETTIGER, IBM ZURICH INVESTIGATION OF
THE LIGA PROCESS TO FABRICATE MICROCHANNEL PLATE 2D2.06P R. LIU,
UNIVERSITY OF ILLINOIS, URBANA/CHAMPAIN, IL AND M. VASILE, INSTITUTE FOR
MICROMANUFACTURING A MICROCATALYTIC SUPPORT REALISED BY LIGA TECHNIQUE:
THE DEVIL S COMB 2D2.07P S. BASROUR, P. BERNEDE, W. DANIAU, INSTITUT DES
MICROTECHNIQUES DE FRANCHE-COMTE, BESANCON, FRANCE, P. MOUGIN, M. PONS
AND J.VILLERMAUX, CNRS-ENSIC-INPL, NANCY, FRANCE A NOVEL SIC ON
INSULATOR TECHNOLOGY USING WAFER BONDING 2D2.08P K. VINOD, C. ZORMAN AND
M. MEHREGANY, CASE WESTERN RESERVE UNIVERSITY, CLEVELAND, OH LOW
TEMPERATURE DIRECT BONDING OF SILICON AND SILICON DIOXIDE BY THE SURFACE
ACTIVATION METHOD 2D2.09P H.TAKAGI, R. MAEDA, AIST-MITI, IBARAKI, JAPAN,
T. CHUNG AND T. SUGA, UNIVERSITY OF TOKYO, JAPAN SI-TO-SI WAFER BONDING
USING EVAPORATED GLASS 2D2.1 OP R. DE REUS AND M. LINDAHL,
MIKROELEKTRONIK CENTRET, DTU, LYNGBY, DENMARK DATE: 6/17/97 2A3
MTEROPUMPS SHUTEHI SHOJI, WASEDA UNIVERSITY JEFFRY SNIEGOWSKI, SANDIA
NATIONAL LABORATORIES THE SELFPRIMING VAMP 2A3.01 M. STEHR, H.
STRAATMANN, S. MESSNER, H. SANDMAIER AND R. ZENGERLE,
HAHN-SCHICKARD-GESELLSCHAFT, INSTITUT FUR MIKRO- UND
INFORMATIONSTECHNIK, VILLINGEN-SCHWENNINGEN, GERMANY A NOVEL
MICROMACHINED PUMP BASED ON THICK-FILM PIEZOELECTRIC ACTUATION 2A3.02 M.
KOCH, N. HARRIS, A. EVANS, N. WHITE AND A. BRUNNSCHWEILER, UNIVERSITY OF
SOUTHAMPTON, UNITED KINGDOM PUMPING GASES BY A SILICON MICRO PUMP WITH
DYMAMIC PASSIVE VALVES 2A3.03 T. GERLACH, TECHNICAL UNIVERSITY OF
LLMENAU, LLMENAU, GERMANY A TITANIUM-NICKEL SHAPE-MEMORY ALLOY ACTUATED
MICROPUMP 2A3.04 W. BENARD, H. KAHN AND M. HUFF, CASE WESTERN RESERVE
UNIVERSITY, CLEVELAND, OH LONG-TERM PERFORMANCE ANALYSIS OF
THERMO-PNEUMATIC MICROPUMP ACTUATORS 2A3.05 W. SCHOMBURG, R. AHRENS, W.
BACHER, J. MARTIN, FORSCHUNGSZENTRUM KARLSRUHE, KARLSRUHE, GERMANY, S.
ENGEMANN AND P. KREHL, ERNST- MACH-LNSTITUT DER FRAUNHOFER-GESELLSCHAFT,
FREIBURG, GERMANY EXPERIMENTS AND ANALYSIS FOR MICRO-NOZZLE/DIFFUSER
FLOW AND MICRO VALVELESS PUMPS 2A3.06P X. JIANG, X. HUANG, C. LIU,
NANYANG TECHNOLOGICAL UNIVERSITY, SINGAPORE, Z. ZHOU, Y. LI AND Y. YANG,
TSINGHUA UNIVERSITY, BEIJING, CHINA FABRICATION AND EXPERIMENT OF PLANAR
MICRO ION DRAG PUMP 2A3.07P S. AHN AND Y. KIM, SEOUL NATIONAL
UNIVERSITY, SEOUL, KOREA TRANSDUCERS 97 1997 INTERNATIONAL CONFERENCE
ON SOLID-STATE SENSORS AND ACTUATORS CHICAGO, JUNE 16-19, 1997 DATE:
6/17/97 2B3 AFM & RELATED SENSORS THOMAS KENNY, STANFORD UNIVERSITY PER
OHTCKERE, SENSONOR ASA, AND UNIVERSITY OF OSLO 5 MHZ, 2N/M
PIEZORESISTIVE CANTILEVERS WITH INCISIVE TIPS 2B3.01 R. RIED, H. MAMIN,
B. TERRIS, L. FAN AND D. RUGAR, IBM RESEARCH DIVISION, SAN JOSE, CA TIP
INTEGRATION ON ARRAYS OF SILICON MICRO CANTILEVERS WITH SELF EXCITING
PIEZOELECTRIC SENSOR FOR PARALLEL ATOMIC FORCE MICROSCOPY APPLICATIONS
2B3.02 P. INDERMUHLE, G. SCHURMANN, G. RACINE AND N. DE ROOIJ,
UNIVERSITY OF NEUCHATEL, NEUCHATEL, SWITZERLAND SCALING TORSIONAL
CANTILEVERS FOR SCANNING PROBE MICROSCOPE ARRAYS: THEORY AND EXPERIMENT
2B3.03 S. MILLER, K. TURNER AND N. MACDONALD, CORNELL UNIVERSITY,
ITHACA, NY NEW DYNAMIC SCANNING FORCE MICROSCOPES USING PIEZOELECTRIC
PZT MICROCANTILEVERS 2B3.04 T. ITOH, J. CHU, I. MISUMI, K. KATAOKA AND
T. SUGA, THE UNIVERSITY OF TOKYO, TOKYO, JAPAN FABRICATION OF AN
ALL-METAL ATOMIC FORCE MICROSCOPE PROBE 2B3.05 P. TANG, J. RASMUSSEN, O.
HANSEN, P. MOLLER, TECHNICAL UNIVERSITY OF DENMARK, LYNGBY, DENMARK, AND
C. SANDER, DANIS MICRO ENGINEERING DME A/S, DENMARK STUDY OF TUNNELING
NOISE USING SURFACE MICROMACHINED TUNNELING TIP DEVICES J. WANG, P.
ZAVRACKY, N. MCGRUER AND R. MORRISON, NORTHEASTERN UNIVERSITY, BOSTON,
MA 2B3.06P CHARACTERIZATION OF A HIGH-SENSITIVITY MICROMACHINED
TUNNELING ACCELEROMETER 2B3.07PL C. LIU, J. GRADE, A. BARZILAI, J.
REYNOLDS, A. PARTRIDGE, T. KENNY, STANFORD UNIVERSITY, STANFORD, CA, AND
H. ROCKSTAD, JET PROPULSION LABORATORY, PASADENA, CA DATE: 6/17/97 2C3
GAS SENSORS SHTH-CHIA CHANG, GENERAL MOTORS FT 4 D CENTER MAKOTO
EGASHIRA, NAGASAKI UNIVERSITY CO-SENSOR FOR DOMESTIC USE BASED ON HIGH
TEMPERATURE STABLE GA2O3THIN FILMS 2C3.01 T. SCHWEBEL, M. FLEISCHER AND
H. MEIXNER, SIEMENS AG, MUNICH, GERMANY THE USE OF NANO-CRYSTALLINE
OXIDES AS GAS SENSING MATERIALS 2C3.02 G. WILLIAMS, G. COLES, UNIVERSITY
OF WALES, SWANSEA, UNITED KINGDOM, H. FERKEL AND W. RIEHMANN, TECHNICAL
UNIVERSITY OF CLAUSTHAL DETECTION OF OFF-ODORS USING A HYBRID SENSOR
SYSTEM 2C3.03 H. ULMER, J. MITROVICS, U. WEIMAR AND W. GOPEL, UNIVERSITY
OF TUBINGEN, TUBINGEN, GERMANY REMOTE SENSING AND LOCALIZATION OF
GAS/ODOR SOURCE AND DISTRIBUTION USING MOBILE SENSING SYSTEM H. ISHIDA,
T. NAKAMOTO AND T. MORIIZUMI, TOKYO INSTITUTE OF TECHNOLOGY, TOKYO,
JAPAN 2C3.04 A BULK MICROMACHINED HUMIDITY SENSOR BASED ON POROUS
SILICON 2C3.05 G. O HALLORAN, P. SARRO, J. GROENEWEG, P. TRIMP AND P.
FRENCH, TECHNICAL UNIVERSITY OF DELFT, DELFT, THE NETHERLANDS TUNGSTEN
TRIOXIDE GAS SENSOR ARRAY CONSTRUCTED FROM PARTITIONED LAYERS OF THE
METAL OXIDE 2C3.06P T. SCHNEIDER, G. SCHUTT, J. GOSCHNICK, B. BRUNS AND
H. ACHE, FORSCHUNGSZENTRUM KARLSRUHE, KARLSRUHE, GERMANY 14 A NOVEL
SEMICONDUCTOR NO GAS SENSOR OPERATING AT ROOM TEMPERATURE 2C3.07P Z.
WENYI, T. KATSUBE, SAITAMA UNIVERSITY, URAWA-SHI, JAPAN, T. NAKATSUBO,
TEXAS INSTRUMENTS JAPAN OYAMA PLANT SENSOR GROUP, AND Y. NISHIOKA, T.I
TSUKUBA RESEARCH AND DEVELOPMENT CENTER SOL-GEL PREPARED LN2O3 THIN
FILMS FOR OZONE SENSING 2C3.08P W. WLODARSKI, H. SUN, ROYAL MELBOURNE
INSTITUTE OF TECHNOLOGY, VICTORIA, AUSTRALIA, A. GURLO AND W. GOPEL,
UNIVERSITY OF TUBINGEN, TUBINGEN, GERMANY ROOM TEMPERATURE OZONE SENSING
WITH CONDUCTIVITY AND WORK FUNCTION SENSORS BASED ON INDIUM OXIDE
2C3.09P T. DOLL, A. FUCHS, I. EISELE, UNIVERSITY OF THE BUNDESWEHR
MUNICH, NEUBIBERG, GERMANY, G. FAGLIA, S. GROPPELLI AND G. SBERVEGLIERI,
UNIVERSITY OF BRESCIA, ITALY THIN FILM POROUS MEMBRANES FOR CATALYTIC
SENSORS 2C3.10P R. HUGHES, T. BOYLE, T. GARDNER, C. BRINKER, SANDIA
NATIONAL LABORATORIES, ALBUQUERQUE, NM, AND R.THOMAS, ELTRON RESEARCH,
INC., BOULDER, CO A HIGH PERFORMANCE ETHANOL GAS SENSOR BASED ON
CDO-FE2O3 SEMICONDUCTING MATERIALS 2C3.11P X. LIU, Z. XU AND Y. SHEN,
UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA, HEFEI, CHINA 2C3.12P
AMPEROMETRIC GAS SENSOR IMPROVEMENTS I N | | W. PENRO^Q8|FF1|NF^LRWR
SOLUTIONS, INC., NAPERVILLE, IL AND K. SCHROEDER^MRLDBCER RESEARCH, INC.
NOVEL AMORPHOUS MOW20O20AND MOW8O11 SENSORS MADE PHOTOCHEMICALLY AT ROOM
TEMPERATURE FOR SUB-PPM NO2 DETECTION 2C3.13PL C. CHU, M. DEEN AND R.
HILL, SIMON FRASER UNIVERSITY, BURNABY, B.C., CANADA DATE: 8/17/97
MINHANG BAA, FUDAN UNIVERSITY LJ. *CH*P SPANGTER, FORD MICROELECTRONICS
CONTROLLED PULSE-ETCHING WITH XENON DIFLUORIDE 2D3.01 P. CHU, J. HUANG,
J. CHEN, M. JACKSON, G. LIN, B. WARNEKE, R. YEH AND K. PISTER,
UNIVERSITY OF CALIFORNIA AT LOS ANGELES, CA GAS-PHASE SILICON ETCHING
WITH BROMINE TRIFLUORIDE 2D3.02 X.WANG, X.YANG AND Y. TAI, CALIFORNIA
INSTITUTE OF TECHNOLOGY, PASADENA, CA THIN BEAM BULK MICROMACHINING
BASED ON RIE AND XENON DIFLUORIDE SILICON ETCHING 2D3.03 R. TODA, K.
MINAMI AND M. ESASHI, TOHOKU UNIVERSITY, MIYAGI, JAPAN NEW ROBUST SMALL
RADIUS JOINTS BASED ON THERMAL SHRINKAGE OF POIYIMIDE IN V-GROOVES
2D3.04 T. EBEFORS, E. KALVESTEN, G. STEMME, ROYAL INSTITUTE OF
TECHNOLOGY, STOCKHOLM, SWEDEN, AND C. VIEIDER, INDUSTRIAL
MICROELECTRONICS CENTER, KISTA, SWEDEN A NEW PROCESS FOR COMBINING
ANISOTROPIC BULK ETCHING WITH SUBSEQUENT PRECISION LITHOGRAPHY 2D3.05 C.
VIEIDER, J. HOLM, L. FORSSEN, H. ELDERSTIG, S. LINDGREN AND H. AHLFELDT,
INDUSTRIAL MICROELECTRONICS CENTER, KISTA, SWEDEN EFFECT OF THE SILICON
CONTENT IN AQUEOUS KOH ON THE ETCHING BEHAVIOR OF CONVEX CORNERS IN
100 SINGLE CRYSTALLINE SILICON 2D3.06P 0. DORSCH AND E. OBERMEIER,
TECHNICAL UNIVERSITY OF BERLIN, BERLIN, GERMANY EFFECTS OF METALLIC
IMPURITIES ON ANISOTROPIC ETCHING OF SILICON IN AQUEOUS KOH-SOLUTIONS
2D3.07P A. HEIN AND E. OBERMEIER, TECHNICAL UNIVERSITY OF BERLIN,
BERLIN, GERMANY PATTERNS FOR CONCAVE CORNER COMPENSATION BETWEEN
VERTICAL (010H001) PLANES ON SI(100) ANISOTROPICALLY ETCHED IN TMAH
2D3.08P B. NIKPOUR, L. LANDSBERGER, M. KAHRIZI, A. IFTIMIE, CONCORDINA
UNIVERSITY, MONTREAL, QUEBEC, CANADA, T. HUBBARD, TECHNICAL UNIVERSITY
OF NOVA SCOTIA, NOVA SCOTIA, CANADA FIUOROCARBON FILM FOR PROTECTION
FROM ALKALINE ETCHANT AND ELIMINATION OF IN-USE STICTION 2D3.09P Y.
MATSUMOTO, K. YOSHIDA AND M. ISHIDA, TOYOHASHI UNIVERSITY OF TECHNOLOGY,
TOYOHASHI, JAPAN MASKLESS ANISOTROPIC ETCHING - A NOVEL MICROMACHINING
TECHNOLOGY FOR MULTILEVEL MICROSTRUCTURES 2D3.10P X. LI AND M. BAO,
FUDAN UNIVERSITY, SHANGHAI, CHINA FABRICATION OF MICROMECHANICAL
STRUCTURES WITH A NEW ELECTRODELESS ELECTROCHEMICAL ETCH STOP 2D3.11P C.
ASHRUF, P. FRENCH, P. SARRO, TECHNICAL UNIVERSITY OF DELFT, DELFT, THE
NETHERLANDS, M. NAGAO AND M. ESASHI, TOHOKU UNIVERSITY IN SITU
MEASUREMENT OF ETCH RATE OF SINGLE CRYSTAL SILICON 2D3.12P E.
STEINSLAND, T. FINSTAD, S. LILLETUN, UNIVERSITY OF OSLO, BLINDERN,
NORWAY, A. FERBER AND A. HANNEBORG, SINTEF, BLINDERN, NORWAY HIGH YIELD
WAFER CHUCK FOR SINGLE-SIDED WET ETCHING OF MEMS-STRUCTURES 2D3.13P G.
BELJAKOVIC, ZURICH RESEARCH LAB. & UNIVERSITY NEUCHATEL, SWITZERLAND, M.
DESPONT, J. BRUGGER, H. BIEBUYCK, P. VETTIGER, ZURICH RESEARCH
LABORATORY, RUSCHLIKON, SWITZERLAND, AND N. DEROOIJ, UNIVERSITY
NEUCHATEL, NEUCHATEL, SWITZERLAND A MODEL FOR THE ETCH STOP LOCATION ON
REVERSED BIASED PN JUNCTIONS 2D3.14PL D. LAPADATU, G. KITTILSLAND, M.
NESE, S. NILSEN AND H. JAKOBSEN, SENSONOR ASA, HORTEN, NORWAY DATE:
6/18/97 3A1 ACTUATORS - IT H. F. DE ROOIJ, UNIVERSITY OF NEUCHITET A.
BRUNO FRAZIER, UNIVERSITY OF UTAH POWER MEMS AND MICROENGINES 3A1.01 A.
EPSTEIN, S. SENTURIA, G. ANATHASURESH, A. AYON, K. BREUER, K.-S. CHEN,
F. EHRICH, G. GAUBA, R. GHODSSI, C. GROSHENRY, S. JACOBSON, J. LANG,
C.-C. MEHRA, J. MUR MIRANDA, S. NAGLE, D. ORR, E. PIEKOS, M. SCHMIDT, G.
SHIRLEY, S. SPEARING, C. TAN, Y.-S. TZENG AND I. WAITZ, MIT, CAMBRIDGE,
MA DEVELOPMENT OF LIGA FABRICATED, SELF-PRIMING IN-LINE GEAR PUMP 3A1.02
A. DEWA, K. DENG, D. RITTER, C. BONHAM, CONCIS, L.L.C., VANCOUVER, WA,
H. GUCKEL AND S. MASSOOD-ANSARI, UNIVERSITY OF WISCONSIN COMBINATION OF
A FLUIDIC MICRO-OSCILLATRO AND MICRO- ACTUATOR IN LIGA-TECHNIQUE FOR
MEDICAL APPLICATION 3A1.03 U. GEBHARD, H. HEIN, E. JUST AND P. RUTHER,
FORSCHUNGSZENTRUM KARLSRUHE GMBH, KARLSRUHE, GERMANY DESIGN AND
FABRICATION OF A LIGA MILLIENGINE E. GARCIA, T. CHRISTENSON, M. POLOSKY
AND A. JOJOLA, SANDIA NATIONAL LABORATORIES, ALBUQUERQUE, NM 3A1.04
CHARACTERIZATION OF ELECTROTHERMAL ACTUATORS AND ARRAYS FABRICATED IN A
FOUR-LEVEL, PLANARIZED SURFACE- MICROMACHINED POLYCRYSTALLINE SILICON
PROCESS 3A1.05P J. COMTOIS, M. MICHALICEK, U.S. AIR FORCE PHILLIPS
LABORATORY, KIRTLAND AFB, NM, AND C. BARRON, SANDIA NATIONAL
LABORATORIES 15 TRANSDUCERS 97 1997 INTERNATIONAL CONFERENCE ON
SOLID-STATE SENSORS AND ACTUATORS CHICAGO, JUNE 16-19, 1997 6/18/97 3B1
INERTIA! SENSORS - I TADASHI HATTORI, DENSO CORPORATION G. BENJAMIN
HOCKAR, HONEYWELL COMMERCIAL VISION OF SILICON BASED INERTIAL SENSORS C.
SONG, SAMSUNG ADVANCED INSTITUTE OF TECHNOLOGY, KYUNGGIDO, S. KOREA
3B1.01 AN INTEGRATED RESONANT ACCELEROMETER MICROSYSTEM FOR AUTOMOTIVE
APPLICATIONS 3B1.02 P. OHLCKERS, R. HOLM, H. JACOBSEN, T. KVISTEROY, G.
KITTILSLAND, M. NESE, S. NILSON, SENSONOR, HORTEN, NORWAY, AND A.
FERBER, SINTEF ELECTRONICS AND CYBERNETICS, OSLO, NORWAY A PRECISION YAW
RATE SENSOR IN SILICON MICROMACHINING 3B1.03 M. LUTZ, W. GODERER, J.
GERSTENMEIER, J. MAREK, B. MAIHOFER, S. MAHLER AND U. BISCHOF, ROBERT
BOSCH GMBH, REUTLINGEN, GERMANY A CMOS INTEGRATED SURFACE MICROMACHINED
ANGULAR RATE SENSOR: ITS AUTOMOTIVE APPLICATIONS 3B1.04 D. SPARKS, S.
ZARABADI, Q. JIANG, J. JOHNSON, M. CHIA, O. LARSEN, W. HIGDON AND P.
CASTILLO-BORELLY, DELCOELECTRONICS CORPORATION, KOKOMO, IN DATE: 6/18/97
3C1 BIOSENSORS MARC MADOU, UNIVERSITY OF CALIFORNIA - BERKELEY TOYOSAKA
MORIIZUMT, TOKYO INSTITUTE OF TECHNOLOGY BIOSENSORS AND THEIR
APPLICATIONS F. SCHELLER, UNIVERSITY OF POTSDAM, POTSDAM, GERMANY 3C1.01
A MICRO-PLANAR AMPEROMETRIC GLUCOSE SENSOR UNSUSCEPTIBLE TO INTERFERENCE
SPECIES 3C1.02 T. MATSUMOTO, M. FURUSAWA, H. FUJIWARA, Y. MATSUMOTO, N.
ITO, NEC CORPORATION, KAWASAKI, KANAGAWA, JAPAN NANOSCALED
INTERDIGITATED ELECTRODE ARRAYS FOR BIOCHEMICAL SENSORS 3C1.03 P. VAN
GERWEN, W. LAUREYS, G. HUYBERECHTS, M. DE BEECK, K. BAERT, L HERMANS, R.
MERTENS, IMEC, HEVERLEE, BELGIUM, A. VARLAN, INNOGENETICS, GENT,
BELGIUM, AND W. SANSEN, CATHOLIC UNIVERSITY MINIATURIZED ISFET GLUCOSE
SENSOR INCLUDING A NEW STRUCTURE ACTUATION SYSTEM H. SEO, KOREA
UNIVERSITY OF TECHNOLOGY & EDUCATION, CHUNGNAM, KOREA, C. LEE, C. KIM
AND B. SOHN, KYUNGPOOK NATIONAL UNIVERSITY, KOREA 3C1.04 6/18/97 3D1
TELEMETRY SYSTEMS GROG KOVACS, STANFORD UNIVERSITY RADLVOJE S. POPOVIC,
SWISS FEDERAL INSTITUTE OF TECHNOLOGY - LAUSANNE CMOS SENSOR SYSTEM
3D1.01 B. HOSTICKA, FRAUNHOFER INSTITUTE OF MICROELECTRONIC CIRCUITS AND
SYSTEMS, DUISBURG, GERMANY A NEW PASSIVE CMOS TELEMETRY CHIP TO RECEIVE
POWER AND TRANSMIT DATA FOR A WIDE RANGE OF SENSOR APPLICATIONS 3D1.02
D. DUDENBOSTEL, K. KRIEGER, C. CANDLER AND R. LAUR, UNIVERSITY OF
BREMEN, BREMEN, GERMANY ON-CHIP COILS WITH INTEGRATED CORES FOR REMOTE
INDUCTIVE POWERING OF INTEGRATED MICROSYSTEMS 3D1.03 J. VON ARX AND K.
NAJAFI, UNIVERSITY OF MICHIGAN, ANN ARBOR, ML A VERY LOW-POWER
CONSUMPTION WIRELESS ECG MONITORING SYSTEM USING BODY AS A SIGNAL
TRANSMISSION MEDIUM 3D1.04 T. HANDA, S. SHOJI, S. IKE, WASEDA
UNIVERSITY, TOKYO, JAPAN, S. TAKEDA AND T. SEKIGUCHI, NIHON KOHDEN
CORPORATION TRANSDUCERS 97 1997 INTERNATIONAL CONFERENCE ON SOLID-STATE
SENSORS AND ACTUATORS CHICAGO, JUNE 16-19, 1997 DESIGN AND FABRICATION
OF MICROMACHINED PASSIVE FILTERING ELEMENTS IN CMOS TECHNOLOGY 3D1.05P
V. MILANOVIC, M. ZAGHLOUL, THE GEORGE WASHINGTON UNIVERSITY, WASHINGTON,
DC, M. GAITAN, N.TEA, NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY,
GAITHERSBURG, MD, AND E. BOWEN, RF MICROSYSTEMS, INTEGRATED MEMS FOR
PRESSURE TRANSPONDER 3D1.06P H. KIM AND K. CHUN, SEOUL NATIONAL
UNIVERSITY, SEOUL, KOREA DATE: 6/18/97 3A2 ACTUATORS - ML TOSHIRO
HIGUCHI, UNIVERSITY OF TOKYO PWT BARTH, HEWLETT PACKARD A QUANTITATIVE
ANALYSIS OF SCRATCH DRIVE ACTUATION FOR INTEGRATED X/Y MOTION SYSTEM
3A2.01 P. LANGLET, D. COLLARD, H. FUJITA, THE UNIVERSITY OF TOKYO,
TOKYO, JAPAN, AND T. AKIYAMA, UNIVERSITY OF NEUCHATEL, NEUCHATEL,
SWITZERLAND THE SHUFFLE MOTOR: A HIGH FORCE, HIGH PRECISION LINEAR
ELECTROSTATIC STEPPER MOTOR 3A2.02 J. TAS, J. WISSINK, T. LAMMERINK, M.
ELWENSPOEK, UNIVERSITY OF TWENTE, ENSCHEDE, THE NETHERLANDS, AND L.
SANDER, PHILIPS RESEARCH, EINDHOVEN, THE NETHERLANDS A LINEAR STEPPING
ACTUATOR IN SURFACE MICROMACHINING TECHNOLOGY FOR LOW VOLTAGES AND LARGE
DISPLACEMENTS 3A2.03 M. BALTZER, T. KRAUS AND E. OBERMEIER, TECHNICAL
UNIVERSITY OF BERLIN, BERLIN, GERMANY LINEAR MICROACTUATORS BASED ON THE
SHAPE MEMORY EFFECT 3A2.04 M. KOHL AND K. SKROBANEK, FORSCHUNGSZENTRUM
KARLSRUHE GMBH, KARLSRUHE, GERMANY SINGLE FLUX-PATH BIDIRECTIONAL LINEAR
ACTUATORS 3A2.05 N. TABAT, J. KLEIN AND H. GUCKEL, UNIVERSITY OF
WISCONSIN- MADISON, MADISON, WL A LARGE-FORCE, FULLY-INTEGRATED MEMS
MAGNETIC ACTUATOR 3A2.06P J.WRIGHT, Y. TAI, CALIFORNIA INSTITUTE OF
TECHNOLOGY, PASADENA, CA, AND S. CHANG, GM RESEARCH ANDDEVELOPMENT
CENTER A MAGNETIC LEVITATION ACTUATOR FOR MICRO-ASSEMBLY 3A2.07P X. YE,
Y. HUANG AND Z. ZHOU, TSINGHUA UNIVERSITY, BEIJING, CHINA DATE: 6/18/97
3B2 INERTIA! SENSORS * X ROBERT SULOUFF, ANALOG DEVICES WEI-YUAN WANG,
SHANGHAI INSTITUTE OF METALLURGY NEW RESONANT ACCELEROMETER BASED ON
RIGIDITY CHANGE 3B2.01 Y. OMURA, Y. NONOMURA, TOYOTA CENTRAL RESEARCH
AND DEVELOPMENT LABORATORIES, INC., AICHI-KEN, JAPAN, AND O. TABATA,
RITSUMEIKAN UNIVERSITY, JAPAN SURFACE-MICROMACHINED RESONANT
ACCELEROMETER 3B2.02 T. ROSSIG, R. HOWE, A. PISANO, UNIVERSITY OF
CALIFORNIA AT BERKELEY, BERKELEY, CA, AND J. SMITH, SANDIA NATIONAL
LABORATORIES, ALBUQUERQUE, NM A SURFACE ACOUSTIC WAVE GYRO SENSOR 3B2.03
M. KUROSAWA, M. TAKASAKI, THE UNIVERSITY OF TOKYO, TOKYO, JAPAN, Y.
FUKUDA AND T. HIGUCHI, KANAGAWA ACADEMY OF SCIENCE AND TECHNOLOGY,
KANAGAWA, JAPAN DEVELOPMENT OF A MODAL ANALYSIS ACCELEROMETER BASED ON A
TUNNELING DISPLACEMENT TRANSDUCER 3B2.04 P. SCHEEPER, BRUEL & KJAER
SOUND AND VIBRATION MEASUREMENT, NAERUM, DENMARK, J. REYNOLDS AND J.
KENNY, STANFORD UNIVERSITY, CALIFORNIA 16 LOW FREQUENCY DRIFT IN TUNNEL
SENSORS 3B2.05 J. GRADE, A. BARZILAI , J. REYNOLDS, C. LIU, A.
PARTRIDGE, T. KENNY, STANFORD UNIVERSITY, STANFORD, CA, L. MILLER AND J.
PODOSEK, JET PROPULSION LABORATORY DATE: 6/18/97 3C2 ANALYTICAL SYSTEMS
- FL ROSEMARY SMITH, UNIVERSITY OF CALIFORNIA - DAVIS MASAO WASHIZU,
KYOTO UNIVERSITY PARALLEL CAPILLARIES FOR HIGH THROUGHPUT IN
ELECTROPHORETIC SEPARATIONS AND ELECTROOSMOTIC DRUG DISCOVERY SYSTEMS
3C2.01 A. MANZ AND H. BECKER, IMPERIAL COLLEGE OF SCIENCE, LONDON,
UNITED KINGDOM APPLICATIONS OF PRECISE FLUID CONTROL ON MICROCHIPS J.
RAMSEY, A. HADD AND S. JACOBSON, OAK RIDGE NATIONAL LABORATORY, OAK
RIDGE, TN 3C2.02 UNDERSTANDING FLUID MECHANICS WITHIN ELECTROKINETICALLY
PUMPED MICROFLUIDIC CHIPS 3C2.03 X. QIU, L HU, J. MASLIYAH AND D.
HARRISON, UNIVERSITY OF ALBERTA, EDMONTON, AB, CANADA A MEMS
ELECTROSPRAY NOZZLE FOR MASS SPECTROSCOPY 3C2.04 A. DESAI, Y. TAI, M.
CALIFORNIA INSTITUTE OF TECHNOLOGY & BECKMAN INSTITUTE, PASADENA, CA, M.
DAVIS AND T. LEE, CITY OF HOPE RESEARCH CENTER MICROANALYTICAL SYSTEM
FOR ENVIRONMENTAL CONTROL 3C2.05 S. DROST, W. WORMANN, P. WOIAS, FHG-IFT
MUNICH, B. ROSS, ICB MUNSTER, O. KOSTER, FHG-IMS DUISBURG, W. KONZ,
FHG-IPM FRIEBURG, B. EDLER, EBI UNIVERSITY KARLSRUHE, W. SCHUHMANN,
ACB-TU MUNICH, L. MEIXNER, LIS-TU DATE: 6/18/97 302 DEVICE MODELING
HENRY BALTES, ETH AROFCIA NATHAN, UNIVERSITY OF WATERLOO FINITE ELEMENT
SIMULATION STRATEGIES FOR MICROFLUIDIC DEVICES WITH CHEMICAL REACTIONS
3D2.01 I. HSING, R. SRINIVASAN, K. JENSEN, M. SCHMIDT, MASSACHUSETTS
INSTITUTE OF TECHNOLOGY, CAMBRIDGE, MA, AND M. HAROLD, DUPONT CENTRAL
RESEARCH AND DEVELOPMENT, WILMINGTON, DE ELECTRO-FLUIDIC MICROSYSTEM
MODELING BASED ON KIRCHHOFFIAN NETWORK THEORY 3D2.02 P. VOIGT AND G.
WACHUTKA, TECHNICAL UNIVERSITY OF MUNICH, MUNICH, GERMANY A MODULAR
ENVIRONMENT FOR THE DESIGN OF MICROMACHINED SILICON DEVICES 3D2.03 L.
STEFFENSEN, O. THAN AND S. BUTTGENBACH, TECHNICAL UNIVERSITY OF
BRAUNSCHWEIG, BRAUNSCHWEIG, GERMANY FISHBONE ARCHITECTURE: AN EQUIVALENT
MECHANICAL MODEL OF COCHLEA AND ITS APPLICATION TO SENSOR AND ACTUATOR
3D2.04 S. ANDO, K. TANAKA AND M. ABE, THE UNIVERSITY OF TOKYO, TOKYO,
JAPAN MAGNETICALLY EXCITED FLEXURAL PLATE WAVE DEVICE 3D2.05 M. BUTLER,
S. MARTIN, J. SPATES, M. MITCHELL AND W. SCHUBERT, SANDIA NATIONAL
LABORATORIES, ALBUQUERQUE, NM ASPECTS OF STATIONARY AND DYNAMIC MICRO
DIFFUSER FLOW 3D2.06P T. GERLACH, TECHNICAL UNIVERSITY OF LLMENAU,
LLMENAU, GERMANY SIMULATION STUDIES OF DIFFUSER AND NOZZLE ELEMENTS FOR
VALVE-LESS MICROPUMPS 3D2.07P A. OLSSON, G. STEMME AND E. STEMME, ROYAL
INSTITUTE OF TECHNOLOGY, STOCKHOLM, SWEDEN COUPLED
FLUID-THERMO-STRUCTURES SIMULATION METHODOLOGY FOR MEMS APPLICATIONS M.
ATHAVALE, H.YANG AND A. PRZEKWAS, CFD RESEARCH CORPORATION, HUNTSVILLE,
AL 3D2.08P LINEAR ULTRASONIC MOTORS USING SURFACE ACOUSTIC WAVES:
MECHANICAL MODEL FOR ENERGY TRANSFER 3D2.09P P. HELIN, V. SADAUNE, C.
DRUON, INSTITUT D ELECTRONIQUE ET DE MICROELECTRONIQUE DU NORD,
VILLENEUVE D ASCQ CEDEX, FRANCE, AND J. TRITSCH, LABORATOIRE DE
MECANIQUE DE LILLE, FRANCE SIMULATION OF INTEGRATED ELECTROMAGNETIC
DEVICE SYSTEMS 3D2.10P B. ROMANOWICZ, P. LERCH, P. RENAUD, SWISS FEDERAL
INSTITUTE OF TECHNOLOGY (EPFL), LAUSANNE, SWITZERLAND, E. FULLIN AND Y.
DE COULON, CENTRE SUISSE D ELECTRONIQUE ET DE MICROTECHNIQUE S.A., GPP
EFFICIENT DESIGN AND OPTIMIZATION OF MEMS BY INTEGRATING COMMERCIAL
SIMULATION TOOLS 3D2.11P 0. NAGLER, M.TROST, B. HILLERICH, F. KOZLOWSKI,
FRAUNHOFER INSTITUTE FOR SOLID STATE TECHNOLOGY, MUNICH, GERMANY, AND A.
HEEGE, TSE GMBH, REUTLINGER, GERMANY DATE: 6/18/9? 3A3 MICROFLUIDIC
DEVICES KURT PETERSEN, CEPHEID KAZUO SATO, NAGOYA UNIVERSITY
CHARACTERISTICS OF LIQUIDS ATOMIZATION USING SURFACE ACOUSTIC WAVE
3A3.01 T. HIGUCHI, M. KUROSAWA AND A. FUTAMI, THE UNIVERSITY OF TOKYO,
TOKYO, JAPAN MICRO-ACTUATORS EMPLOYING ACOUSTIC STREAMING CAUSED BY
HIGH-FREQUENCY ULTRASONIC WAVES 3A3.02 K. HASHIMOTO, G. ZHANG, K.
IKEKAME AND M. YAMAGUCHI, CHIBA UNIVERSITY, CHIBA-SHI, JAPAN DROPLET
GENERATOR WITH EXTRAORDINARY HIGH FLOW RATE AND WIDE OPERATING RANGE
3A3.03 1. EDERER, J. GRASEGGER AND C. TILLE, TECHNISCHE UNIVERSITAET
MUENCHEN, MUNICH, GERMANY A NOVEL CMOS-COMPATIBLE INKJET HEAD 3A3.04 D.
WESTBERG AND G. ANDERSSON, CHALMERS UNIVERSITY OF TECHNOLOGY, GOTEBORG,
SWEDEN LATCHED VALVE MANIFOLDS FOR EFFICIENT CONTROL OF PNEUMATICALLY
ACTUATED VALVE ARRAYS 3A3.05 J. PAN, D. VERLEE, ABBOTT LABORATORIES,
ABBOTT PARK, IL, AND M. MEHREGANY, ADVANCED MICROMACHINES, INC.
ELECTROMAGNETICALLY DRIVEN MICROVALVE FABRICATED IN SILICON 3A3.06P A.
MECKES, J. BEHRENS AND W. BENECKE, UNIVERSITY OF BREMEN (IMSAS), BREMEN,
GERMANY A THERMOPNEUMATICALLY ACTUATED MICROVALVE FOR LIQUID EXPANSION
AND PROPORTIONAL CONTROL 3A3.07P A. HENNING, J. FITCH, E. FALSKEN, D.
HOPKINS, L. LILLY, R. FAETH AND M. ZDEBLICK, REDWOOD MICROSYSTEMS, INC.,
MENLO PARK, CA SURFACE MICROMACHINE TURBINES 3A3.08P C. TSAI AND A.
HENNING, DARTMOUTH COLLEGE, HANOVER, NH INTEGRABLE ACTIVE MICROVALVE
WITH SURFACE MICROMACHINED CURLED-UP ACTUATOR 3A3.09P J. BABAEI, C.
KWOK, UNIVERSITY OF NEW SOUTH WALES, SYDNEY, NSW, AUSTRALIA, AND R.
HUANG, NATIONAL TSING HUA UNIVERSITY, TAIWAN MICROFLUIDIC MOTION
GENERATION WITH LOOSELY-FOCUSED ACOUSTIC WAVES 3A3.10PL X. ZHU AND E.
KIM, UNIVERSITY OF HAWAII, HONOLULU, HI TRANSDUCERS 97 *1 7 1997
INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS AND ACTUATORS 1
CHICAGO, JUNE 16-19, 1997 DATE: 6/18/97 3B3 VIBRATORY GYROSCOPES CLARK
NGUYEN, UNIVERSITY OF MICHIGAN JAN SFDERKVIST, COLTBRI PRO DEVELOPMENT
AB A BULK MICROMACHINED SILICON ANGULAR RATE SENSOR 3B3.01 H. KUISMAN,
J. LAHDENPERA, E. PUNKKA, S. RUOTSALAINEN, VTI HAMLIN OY, HELSINKI,
FINLAND, T. RYHANEN, NOKIA TELECOMMUNICATIONS, T. SILLINPAA AND H.
SEPPA, TECHNICAL RESEARCH CENTRE OF FINLAND, VTT AUTOMATION, GPP SILICON
ANGULAR RATE SENSOR FOR AUTOMOTIVE WITH PIEZOELECTRIC DRIVE AND
PIEZORESISTIVE READ-OUT 3B3.02 R. VOSS, K. BAUER, W. KUPKE, M. ROSE, J.
SCHALK, H. SEIDEL AND E. STENZEL, DAIMLER-BENZ AG, MUNICH, GERMANY DUAL
AXIS OPERATION OF A MICROMACHINED RATE GYROSCOPE 3B3.03 T. JUNEAU AND A.
PISANO, UNIVERSITY OF CALIFORNIA AT BERKELEY, BERKELEY, CA
TWO-DIMENSIONAL MICROMACHINED GYROSCOPE 3B3.04 T. FUJITA, R. KENNY, K.
MAENAKA AND M. MAEDA, HIMEJI INSTITUTE OF TECHNOLOGY, HYOGO, JAPAN, AND
T. MIZUNO, NGK SPERKPLUG COMPANY, LTD., JAPAN DESIGN AND CHARACTERISTICS
OF TWO-GIMBAL MICRO- GYROSCOPES FABRICATED WITH QUASI-LIGA PROCESS
3B3.05 M. NIU, X. WANG, J. JIE, W. WANG, CHINES ACADEMY OF SCIENCES,
SHANGHAI, CHINA, AND S. WANG, TONJI UNIVERSITY, SHANGHAI, CHINA A
PIEZOELECTRIC-PLATE MICROGYROSCOPE 3B3.06P G. HE, C. NGUYEN, J. HUI, M.
WONG, H. LUONG AND C. LING, THE HONG KONG UNIVERSITY OF SCIENCE AND
TECHNOLOGY, CLEAR WATER BAY, HONG KONG DATE: 6/18/97 3C3 HIGH TEMP. GAS
SENSORS GREG FRYE, SANDIA NATIONAL LABORATORIES WOLFGANG GOSPEL,
UNIVERSITY OF TUEBINGSN COMBINED RESISTIVE AND CALORIMETRIC SENSING OF
GASES USING A SINGLE SILICON MICROMACHINED DEVICE 3C3.01 H. SHIN, C.
LLOYD AND J. GARDNER, UNIVERSITY OF WARWICK, COVENTRY, UNITED KINGDOM A
LOW-POWER CMOS COMPATIBLE INTEGRATED GAS SENSOR USING MASKLESSTIN OXIDE
SPUTTERING 3C3.02 L. SHGNE, J. WU, P. CHAN AND J. SIN, HONG KONG
UNIVERSITY OF SCIENCE AND TECHNOLOGY, CLEAR WATER BAY, KOWLOON, HONG
KONG NOVEL GAS SENSOR DEVICE BASED ON THIN MOO3 FILM AND LOW-POWER
CONSUMPTION MICROMACHINED SI-BASED STRUCTURE 3C3.03 G. SBERVEGLIERI, P.
NELLI, UNIVERSITY DI BRESCIA, BRESCIA, ITALY, V. GUIDI, M. FERRONI, G.
MARTINELLI, UNIVERSITY DI FERRARA, FERRARA, ITALY, L. DORI AND G.
CARDINAL!, CNR-LAMEL INSTITUTE, BOLOGNA, ITALY THEORY OF METAL OXIDE GAS
SENSORS FOR MEASURING COMBUSTIBLES 3C3.04 A. BRAILSFORD, M. YUSSOUFF AND
E. LOGOTHETIS, SCIENTIFIC RESEARCH LABORATORY, FORD MOTOR COMPANY,
DEARBORN, ML COMPACT AMPEROMETRIC SOLID-ELECTROLYTE SENSOR FOR DETECTION
OF NO2 IN PPB RANGE 3C3.05 N. MIURA, M. ONO, G. LU, K. SHIMANOE AND N.
YAMAZOE, KYUSHU UNIVERSITY, FUKUOKA, JAPAN ENHANCEMENT OF SENSITIVITY
AND CONDUCTIVITY OF SEMICONDUCTING GA2O3 GAS SENSORS BY DOPING WITH SNO2
3C3.06P J. FRANK, M. FLEISCHER, M. MEIXNER, SIEMENS AG, MUNICH, GERMANY,
AND A. FELTZ, SIEMENS-MATSUSHITA COMPONENTS HIGHLY SENSITIVE AND
SELECTIVE AMMONIA GAS SENSOR 3C3.07P D. YUN, C. KWON, H. HONG, S. KIM,
K. LEE, LG ELECTRONICS RESEARCH CENTER, SEOUL, SOUTH KOREA, H. SONG AND
J. KIM, LG ELECTRO-COMPONENTS, LTD TRANSDUCERS 97 1997 INTERNATIONAL
CONFERENCE ON SOLID-STATE SENSORS AND ACTUATORS CHICAGO, JUNE 16-19,
1997 AIR MONITORING BY A COMBINED RESISTIVE AND FIELD EFFECT SENSOR
DEVICE 3C3.08P M. HAUSNER, U. STORM, H. KARAGOZOGLU, J. BINDER,
UNIVERSITY OF BREMEN (IMSAS), BREMEN, GERMANY, J. ZACHEJA, COLLEGE OF
ADVANCED TECHNOLOGY (FH) BOCHUM, GERMANY NOVEL TECHNIQUE USING RESPONSE
CHARACTERISTICS TO IDENTIFY VOLATILE ORGANIC COMPOUNDS M. SRIYUDTHSAK,
N. LERTNIMITTHUM AND S. NAKPEERAYUTH, CHULALONGKORN UNIVERSITY, BANGKOK,
THAILAND 3C3.09P QUANTITATIVE VAPOR ANALYSIS USING THE TRANSIENT
RESPONSE OF NON-SELECTIVE THICK-FILM TIN OXIDE GAS SENSORS 3C3.1 OP E.
LLOBET, J. BREZMES, X. VILANOVA AND X. CORREIG, UNIVERSITAT ROVIRA I
VIRGILI, TARRAGONA, SPAIN COMMERCIALIZATION OF SILICON-BASED GAS SENSORS
R. LYLE AND D. WALTERS, MOTOROLA, INC., PHOENIX, AZ 3C3.11P HIGH
SENSITIVITY AND TEMPERATURE TOLERANT MICROELECTRONIC O2 GAS SENSOR
3C3.12P Y. GURBUZ, W. KANG, J. DAVIDSON, D. KERNS AND B. HENDERSON,
VANDERBILT UNIVERSITY, NASHVILLE, TN THEORY OF THE THIN FILM GAS SENSOR
DESIGN 3C3.13P V. BRYNZARI, S. DMITRIEV AND G. KOROTCHENCOV, TECHNICAL
UNIVERSITY OF MOLDOVA, CHISINAU, MOLDOVA DILUTE HYDROGEN SULFIDE SENSING
PROPERTIES OF COPPER OXIDE-TIN OXIDE THIN FILM PREPARED BY LOW-PRESSURE
EVAPORATION 3C3.14P J. TAMAKI, Y. YAMADA, Y. YAMAMOTO, RITSUMEIKAN
UNIVERSITY, SHIGA, JAPAN, K. SHIMANOE, N. MIURA AND N. YAMAZOE, KYUSHU
UNIVERSITY, JAPAN 6/18/97 303 CHEMICAL SENSORS JORDAN MECLAY, UNIVERSITY
OF HLINDIS AT CHICAGO J. FT. MORANTE, UNIVERSITAT DE BARCELONA DYNAMIC
SURFACE TENSION MEASURED WITH AN INTEGRATED SENSOR-ACTUATOR DEVICE USING
ELECTROLYTICALLY GENERATED GAS BUBBLES 3D3.01 W. OLTHUIS, P. BERGVELD,
UNIVERSITY OF TWENTE, ENSCHEDE, THE NETHERLANDS, AND A. VOLANSCHI,
UNILEVER RESEARCH LABORATORY VLAARDINGEN, VLAARDINGEN, THE NETHERLANDS
CONDUCTIVE POLYMER SENSOR MEASUREMENTS 3D3.02 P. HARRIS, M. ANDREWS AND
A. PARTRIDGE, INDUSTRIAL RESEARCH LIMITED, LOWER HUTT, NEW ZEALAND
GOLAY-CELL TYPE OF MINIATURIZED INFRARED SENSOR USING SI-DIAPHRAGM
3D3.03 K. YAMASHITA, A. MURATA AND M. OKUYAMA, OSAKA UNIVERSITY, OSAKA,
JAPAN CAPACITIVE SENSOR FOR ON-LINE DETECTION OF ENGINE OIL QUALITY
3D3.04 M. KLEIN, DAIMLER-BENZ AG, ULM/DONAU, GERMANY, E. IRON, TEMIC,
KIRCHHEIM/TECK, GERMANY, K. LAND AND T. GURTLER, MERCEDES-BENZ AG,
STUTTGART, GERMANY HIGH TEMPERATURE SEMICONDUCTOR SENSOR FOR THE
DETECTION OF FLUORINE 3D3.05 W. MORITZ, L. BARTHOLOMAUS, T. GABUSJAN,
HUMBOLDT-UNIVERSITY BERLIN, BERLIN, GERMANY, V. FILLIPOV, A. TERENTJEV,
A. VASILIEV AND S. YAKIMOV, RUSSIAN RESEARCH CENTRE (KURCHATOV-LNSTITUTE
MOSCOW DATE; 6/19/97 4A1 DATA STORAGE GILLES DELAPIERRE, LET1 - CEA
GRENOBLE HAL JERMAN, QUINTA PLANAR SILICON HEADS FOR THE DISC DRIVE
INDUSTRY J. LAZZARI, SILMAG, SITE THOMSON, ST. EGREVE, FRANCE 4A1.01 18
AN ELECTROSTATIC MICRO ACTUATOR FOR A MAGNETIC HEAD TRACKING SYSTEM OF
HARD DISK DRIVES 4A1.02 S. NAKAMURA, K. SUZUKI, M. ATAKA AND H. FUJITA,
THE UNIVERSITY OF TOKYO, TOKYO, JAPAN MICROMACHINED HEATERS WITH 1-US
THERMAL TIME CONSTANTS FOR AFM THERMOMECHANICAL DATA STORAGE 4A1.03 B.
CHUI, K. GOODSON, T. KENNY, STANFORD UNIVERSITY, STANFORD, CA, H. MAMIN,
B. TERRIS AND D. RUGAR, IBM ALMADEN RESEARCH CENTER, SAN JOSE, CA GIANT
MAGNETOSTRICTIVE MULTILAYERS FOR THIN FILM ACTUATORS 4A1.04 E. QUANDT
AND A. LUDWIG, FORSCHUNGSZENTRUM KARLSRUHE GMBH, KARLSRUHE, GERMANY
DATE: 6/19/97 4B1 INERTIA! SENSORS-HI ROGER HOWE, UNIVERSITY OF
CALIFORNIA - BERKELEY SIMON MIDDETHOEK, DELFT UNIVERSITY OF TECHNOLOGY
ELECTRONICS FOR MICROMACHINED INERTIAL SENSORS B. BOSER, UNIVERSITY OF
CALIFORNIA, BERKELEY, CA 4B1.01 A MONOLITHICALLY INTEGRATED THREE AXIAL
ACCELEROMETER USING STRESS SENSITIVE CMOS DIFFERENTIAL AMPLIFIERS 4B1.02
H. TAKAO, Y. MATSUMOTO AND M. ISHIDA, TOYOHASHI UNIVERSITY OF
TECHNOLOGY, TOYOHASHI, JAPAN CHARACTERISATION OF A HIGHLY SYMMETRICAL
MINIATURE CAPACITIVE TRIAXIAL ACCELEROMETER J. LOTTERS, W. OLTHUIS, P.
VELTINK AND P. BERGVELD, UNIVERSITY OF TWENTE, ENSCHEDE, THE NETHERLANDS
4B1.03 AN ALL-SILICON SINGLE-WAFER FABRICATION TECHNOLOGY FOR PRECISION
MICROACCELEROMETERS 4B1.04 N.YAZDI AND K. NAJAFI, UNIVERSITY OF
MICHIGAN, ANN ARBOR, ML DATE: 6/19*97 4C1 WHOLE CEIL SYSTEMS ROBERT
HUBER, UNIVERSITY OF UTAH FRIEDRICH SCHELLER, UNIVERSITY OF POTSDAM
NANOPORE MICROFABRICATED STRUCTURES FOR FRACTIONATION OF DNA 4C1.01 R.
AUSTIN, PRINCETON UNIVERSITY, PRINCETON, NJ MICROMACHINED CELLULAR
CHARACTERIZATION SYSTEM FOR STUDYING THE BIOMECHANICS OF INDIVIDUAL
CELLS H. AYLIFFE, A. FRAZIER, R. RABBITT P. TRESCO AND A. FRAZIER,
UNIVERSITY OF UTAH, SALT LAKE CITY, UT 4C1.02 BIOLOGICAL CELL ASSAYS ON
AN ELECTROKINETIC MICROCHIP 4C1.03 P. ANDERSSON, P. LI, Y. NING, D.
HARRISON, UNIVERSITY OF ALBERTA, EDMONTON, AB, CANADA, R. SMITH, ALBERTA
RESEARCH COUNCIL, EDMONTON, AB, CANADA, AND R. SZARKA A FLEXIBLE
MICROMACHINED ELECTRODE ARRAY FOR A COCHLEAR PROSTHESIS T. BELL, K. WISE
AND D. ANDERSON, UNIVERSITY OF MICHIGAN, ANN ARBOR, ML 4C1.04 MICROCHIP
COULTER PARTICLE COUNTER 4C1.05P U. LARSEN, G. BLANKENSTEIN, S.
OSTERGAARD, TECHNICAL UNIVERSITY OF DENMARK, LYNGBY, DENMARK, AND J.
BRANEBJERG, DANFOOS A/S DATE: 6/19/97 4D1 ARTIFTCAL NOSES RUEY-SHING
HUANG, NATIONAL TSING HUA UNIVERSITY ROBERT HUGHES, SANDIA NATIONAL
LABORATORIES FUNCTIONAL DESIGN OF SEMICONDUCTOR GAS SENSORS FOR
MEASUREMENT OF SMELL AND FRESHNESS M. EGASHIRA, NAGASAKI UNIVERSITY,
NAGASAKI, JAPAN 4D1.01 THE PREDICTION OF ORGANOLEPTIC FLAVOUR NOTES
USING MULTI-SENSOR ARRAYS 4D1.02 T. PEARCE, UNIVERSITY OF DERBY, DERBY,
UNITED KINGDOM AND J. GARDNER, UNIVERSITY OF WARWICK, UNITED KINGDOM
CHIRAL DISCRIMINATION BY SIMPLE GAS SENSORS 4D1.03 K. BODENHOFER, A.
HIERLEMANN AND W. GOPEL, UNIVERSITY OF TUBINIGEN, TUBINGEN, GERMANY
MULTICOMPONENT POLYMER ELECTROLYTES: NEW EXTREMELY VERSATILE RECEPTOR
MATERIALS FOR GAS SENSORS (VOC MONITORING) AND ELECTRONIC NOSES (ODOUR
IDENTIFICATION/DISCRIMINATION) 4D1.04 K. CAMMANN, K. BUHLMANN, B.
SCHLATT, H. MULLER AND A. CHOULGA, INSTITUTE FUR CHEMO- UND BIOSENSORIK
E.V., MUNSTER, GERMANY DATE: 6/19/97 4A2 DYNAMIC DEVICE MODELING SHIGERU
ANDO, UNIVERSITY OF TOKYO PHILIP CONGDON, TEXAS INSTRUMENTS EFFECT OF
AIR DAMPING ON THE DYNAMICS OF NONUNIFORM DEFORMATIONS OF
MICROSTRUCTURES 4A2.01 Y. YANG, S. SENTURIA, MASSACHUSETTS INSTITUTE OF
TECHNOLOGY, CAMBRIDGE, MA, AND M. GRETILLAT, UNIVERSITY OF NEUCHATEL
MODEL FOR GAS FILM DAMPING IN A SILICON ACCELEROMETER 4A2.02 T. VEIJOLA,
HELSINKI UNIVERSITY OF TECHNOLOGY, ESPOO, FINLAND, H. KUISMA AND J.
LAHDENPERA, VTI HAMLIN OY LOW-ORDER MODELS FOR FAST DYNAMICAL SIMULATION
OF MEMS MICROSTRUCTURES 4A2.03 E. HUNG, Y. YANG AND S. SENTURIA,
MASSACHUSETTS INSTITUTE OF TECHNOLOGY, CAMBRIDGE, MA THE AUTONOMOUS
IMPACT RESONATOR: A NEW OPERATION PRINCIPLE FOR A SILICON RESONANT
STRAIN GAUGE 4A2.04 R. PUERS, J. BIENSTMAN, AND J. VANDEWALL, KATHOLIEKE
UNIVERSITEIT LEUVEN, HEVERLEE, BELGIUM AUTOMATED OPTIMAL SYNTHESIS OF
MICRORESONATORS T. MUKHERJEE AND G. FEDDER, CARNEGIE MELLON UNIVERSITY,
PITTSBURGH, PA 4A2.05 COMPACT ANALYTICAL MODELS FOR SQUEEZE FILM DAMPING
WITH ARBITRARY VENTING CONDITIONS 4A2.06 R. DARLING AND J.YANG,
UNIVERSITY OF WASHINGTON, SEATTLE, WA ANALYTICAL MODELING OF
SQUEEZE-FILM DAMPING IN ACCELEROMETERS 4A2.07P C. BOURGEOIS, F. PORRET
AND A. HOOGERWERF, CSEM CENTRE SUISSE D ELECTRONIQUE ET DE
MICROTECHNIQUE SA, NEUCHATEL, SWITZERLAND RESISTIVE DAMPING OF
PULSE-SENSED CAPACITIVE POSITION SENSORS 4A2.08P M. VARGHESE AND S.
SENTURIA, MASSACHUSETTS INSTITUTE OF TECHNOLOGY, CAMBRIDGE, MA THE
EFFECT OF RELEASE-ETCH HOLES ON THE ELECTROMECHANICAL BEHAVIOR OF MEMS
STRUCTURES 4A2.09 V. RABINOVICH, R. GUPTA AND S. SENTURIA, MASSACHUSETTS
INSTITUTE OF TECHNOLOGY, CAMBRIDGE, MA NEW DESIGNS OF MICROMACHINED
VIBRATING RATE GYROSCOPES WITH DECOUPLED OSCILLATION MODES 4A2.10P W.
GEIGER, B. FOLKMER, U. SOBE, H. SANDMAIER AND W. LANG,
HAHN-SCHICKARD-LNSTITUTE OF MICRO- AND INFORMATIONTECHNOLOGY IMIT,
VILLINGEN-SCHWENNINGEN, GERMANY STABILIZATION OF ELECTROSTATICALLY
ACTUATED MECHANICAL DEVICES 4A2.11P J. SEEGER AND S. CRARY, UNIVERSITY
OF MICHIGAN, ANN ARBOR, ML TRANSDUCERS 97 I Q 1997 INTERNATIONAL
CONFERENCE ON SOLID-STATE SENSORS AND ACTUATORS ** CHICAGO, JUNE
16-19, 1997 6/19/97 4B2 ACCBLEROMETERS JONATHAN BERNSTEIN, DRAPER
LABORATORIES KAZUHJRO HANE,TOHOKU UNIVERSITY A 3-AXIS FORCE BALANCED
ACCELEROMETER USING A SINGLE PROOF-MASS 4B2.01 M. LEMKIN, B. BOSER, D.
AUSLANDER, UNIVERSITY OF CALIFORNIA AT BERKELEY, BERKELEY, CA, AND J.
SMITH, SANDIA NATIONAL LABORATORIES, ALBUQUERQUE, NM A SURFACE
MICROMACHINED LATCHING ACCELEROMETER 4B2.02 X. SUN, S. ZHOU AND W. CARR,
NEW JERSEY INSTITUTE OF TECHNOLOGY, NEWARK, NJ EIGHT-BEAM PIEZORESISTIVE
ACCELEROMETER FABRICATED BY USING A SELECTIVE POROUS SILICON ETCHING
METHOD 4B2.03 J. SIM, S. HAHM, J. LEE, J. LEE, KYUNGPOOK NATIONAL
UNIVERSITY, TAEGU, KOREA, I. YU, KYUNGDON COLLEGE, AND J. KIM, INJE
UNIVERSITY SILICON BULK MICROMACHINED ACCELEROMETER WITH SIMULTANEOUS
LINEAR AND ANGULAR SENSITIVITY 4B2.04 J. MIZUNO, K. NOTTMEYER, T.
KOBAYASHI, ZEXEL CORPORATION, SAITAMA, JAPAN, K. MINAMI AND M. ESASHI,
TOHOKU UNIVERSITY, JAPAN A PIEZORESISTIVE ACCELEROMETER WITH A NOVEL
VERTICAL BEAM STRUCTURE 4B2.05 H. CHEN, M. BAO, H. ZHU AND S. SHEN,
FUDAN UNIVERSITY, SHANGHAI, CHINA A FULLY SURFACE-MICROMACHINED
PIEZOELECTRIC ACCELEROMETER 4B2.06P D. DEVOE AND A. PISANO, UNIVERSITY
OF CALIFORNIA AT BERKELEY, BERKELEY, CA TEMPERATURE DEPENDENCE AND DRIFT
OF A THERMAL ACCELEROMETER 4B2.07P U. DAUDERSTADT, DELFT UNIVERSITY OF
TECHNOLOGY, DELFT, THE NETHERLANDS, P. SARRO AND S. MIDDLEHOEK, DIMES
MICROMACHINED TUNNELING ACCELEROMETER WITH A LOW-VOLTAGE CMOS INTERFACE
CIRCUIT 4B2.08P C. YEH AND K. NAJAFI, THE UNIVERSITY OF MICHIGAN, ANN
ARBOR, ML DYNAMIC BEHAVIOR OF A NEW TWO-AXIS ACCELEROMETER T. VELTEN, C.
HE AND E. OBERMEIER, TECHNICAL UNIVERSITY OF BERLIN, BERLIN, GERMANY
4B2.09P THREE AXIS PIEZORESISTIVE ACCELEROMETER USING POLYSILICON LAYE
4B2.10P K. KWON AND S. PARK, KYUNGPOOK NATIONAL UNIVERSITY, TAEGU, KOREA
A NEW TYPE OPTICAL FIBER VIBRATION-SENSOR 4B2.11P M. KIMURA AND K.
TOSHIMA, TOHOKU-GAKUIN UNIVERSITY, MIYAGI, JAPAN FORCE -BALANCED
ACCELEROMETER WITH MG RESOLUTION, FABRICATED USING SILICON FUSION
BONDING AND DEEP REACTIVE ION ETCHING 4B2.12PL B. VAN DRIEENHUIZEN, N.
MALUF, I. OPRIS, LUCAS NOVASENSOR, FREMONT, CA, I. OPRIS AND G. KOVACS,
CENTER FOR INTEGRATED SYSTEMS, STANFORD, CA NEW BULK ACCELEROMETER FOR
TRIAXIAL DETECTION J. PLAZA, H. CHEN, J. ESTEVE, CENTRO NACIONAL DE
MICROELECTRONICA (CNM) CSIC, BARCELONA, SPAIN 4B2.13PL 6/19/97 4C2
ACOUSTIC CHEMICAL SENSORS LUC BOUSSE, CALIPER TECHNOLOGIES ARI LAHTO.VTT
ELECTRONICS OPTIMIZING SURFACE ACOUSTIC WAVE SENSORS FOR TRACE CHEMICAL
DETECTION 4C2.01 G. FRYE, R. KOTTENSTETTE, E. HELLER, C. BRINKER AND S.
CASULNUOVO, SANDIA NATIONAL LABORATORIES, ALBUQUERQUE, NM TRANSDUCERS
97 1997 INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS AND ACTUATORS
CHICAGO, JUNE 16-19, 1997 SENSITIVE DETECTION OF ORGANIC POLLUTANTS IN
WATER USING SELF-ASSEMBLED MONOIAYERS OF
P-TERT-BUTYLCALIX[4]ARENETETRATHIOL ON A QUARTZ CRYSTAL MICROBALANCE
4C2.02 G. COLLINS, NAVAL RESEARCH LABORATORY, WASHINGTON, DC AND C.
GUTSCHE, TEXAS CHRISTIAN UNIVERSITY, TEXAS SAW ORGANOPHOSPHORUS SENSORS
COATED WITH FLUORPOLYOL ISOMERS: ROLE OF HUMIDITY AND TEMPERATURE ON THE
SENSITIVITY 4C2.03 D. REBIERE, C. DEJOUS, J. PISTRE, UNIVERSITE BORDEAUX
I, TALENCE CEDEX, FRANCE, AND R. PLANADE, CENTRE D ETUDES DU BOUCHET,
FRANCE A COMPARISON BETWEEN AN ELECTRONIC NOSE AND HUMAN OLFACTION IN A
SELECTED CASE STUDY 4C2.04 C. DI NATALE, A. MACAGNANO, F. DAVIDE, A.
D AMICO, R. PAOLESSE AND T. BOSCHI, UNIVERSITY OF ROME TOR VERGATA,
ROMA, ITALY SIMULTANEOUS MEASUREMENT OF CO2 AND HUMIDITY USING A PAIR OF
SAW DEVICES AND CLUSTER-ANALYSIS PATTERN RECOGNITION A. HOYT, A. RICCO,
J. BARTHOLOMEW AND G. OSBOURN, SANDIA NATIONAL LABORATORIES,
ALBUQUERQUE, NM 4C2.0S A NEW STRUCTURE FI J. DU AND S&IIFFL MFTSENSORS
4C2.06P IFIELD, NSW, AUSTRALIA AN ACOUSTIC AUTOMOTIVE ENGINE OIL QUALITY
SENSOR 4C2.07P R. LEE, D. LIBBY, UNIVERSITY OF MAINE, ORONO, ME, AND L.
PRAGER, CONTROL DEVICES, INC., STANDISH, ME ERROR ANALYSIS OF QUARTZ
CRYSTAL RESONATOR APPLICATIONS 4C2.08P R. LUCKLUM, C. BEHLING, P.
HAUPTMANN, OTTO-VON-GUERICKE- UNIVERSITY, MAGDEBURG, GERMANY, R.
CERNOSEK AND S. MARTIN, SANDIA NATIONAL LABORATORIES, ALBUQUERQUE, NM
CHARACTERIZATION OF QCM ODOR SENSORS COATED WITH LB FILMS 4C2.09P A.
SAITOH, S. MUNOZ AND T. MORIIZUMI, TOKYO INSTITUTE OF TECHNOLOGY, TOKYO,
JAPAN DESIGN OF A HYBRID MODULAR SENSOR SYSTEM FOR GAS AND ODOR ANALYSIS
4C2.10P J. MITROVICS, H. ULMER, G. NOETZEL, U. WEIMAR AND W. GOPEL,
UNIVERSITY OF TUBINGEN, TUBINGEN, GERMANY CHEMICAL SENSORS BASED ON
SURFACE PLASMON RESONANCE IN SI GRATING STRUCTURES 4C2.11P P. NIKITIN,
P. ANOKHIN AND A. BELOGLAZOV, GENERAL PHYSICS INSTITUTE, MOSCOW, RUSSIA
DATE: 6/19/97 4D2 NOVEL MATERIALS AND PROCESSES CHONG AHN, UNIVERSITY OF
CINCINNATI SUSUMU SUGIYAMA, RITSUMELKAN UNIVERSITY SELF-ASSEMBLED
FIUOROCARBON FILMS FOR ENHANCED STICTION REDUCTION U. SRINIVASAN, M.
HOUSTON, R. HOWE AND R. MABOUDIAN, UNIVERSITY OF CALIFORNIA AT BERKELEY,
BERKELEY, CA 4D2.01 STUDY OF SELECTIVE AND NON-SELECTIVE DEPOSITION OF
SINGLE- AND POLYCRYSTALLINE SILICON LAYERS IN AN EPITAXIAL REACTOR
4D2.02 M. BARTEK, P. GENNISSEN, P. FRENCH, R. WOLFFENBUTTEL, DELFT
UNIVERSITY OF TECHNOLOGY, DELFT, THE NETHERLANDS, AND P. SARRO, DELFT
INSTITUTE FOR MICROELECTRONICS AND SUBMICRON TECHNOLOGY, DELFT, THE
NETHERLANDS OPERATION OF A (6H)-SIC PRESSURE SENSOR AT 500C 4D2.03 R.
OKOJIE, A. NED AND A. KURTZ, KULITE SEMICONDUCTOR PRODUCTS, LEONA, NJ A
HIGH TEMPERATURE PRESSURE SENSOR WITH B-SIC- PIEZORESISTORS ON
SOI-SUBSTRATES 4D2.04 R. ZIERMANN, J. VON BERG, W. REICHERT AND E.
OBERMEIER, TECHNICAL UNIVERSITY OF BERLIN, BERLIN, GERMANY 20 SILICON
BASED REPLICATION TECHNOLOGY OF 3D-MICROSTRUCTURES BY CONVENTIONAL
CD-INJECTION MOLDING TECHNIQUES 4D2.05 0. LARSSON, INDUSTRIAL
MICROELECTRONICS CENTER, KISTA, SWEDEN, 0. OHMAN, A. BILLMAN, L.
LUNDBLADH, C. LINDELL, TOOLEX ALPHA, SUNDBYBERG-STOCKHOLM, SWEDEN, AND
G. PALMSKOG, ERICSSON COMPONENTS, KRISTA-STOCKHOLM, SWEDEN SIMPLE AND
LOW-COST FABRICATION OF EMBEDDED MICRO- CHANNELS BY USING A NEW
THICK-FILM PHOTOPLASTIC 4D2.06P L. GUERIN, S. CALMES, M. DEMIERRE AND P.
RENAUD, SWISS FEDERAL INSTITUTE OF TECHNOLOGY, LAUSANNE, SWITZERLAND THE
USE OF LIQUID RUBBER IN MICROMACHINING FOCUSSED ON FLEXIBLE LARGE AREA
BIOCOMPATIBLE MEMBRANES 4D2.07P K. VERHAEGEN, P. VAN GERWEN, K. BAERT,
L. HERMANS AND R. MERTENS, IMEC, HEVERLEE, BELGIUM FABRICATION AND
CHARACTERIZATION OF IC-PROCESSED BRIGHTNESS ENHANCEMENT FILMS 4D2.08P L.
LIN, T. SHIA, UNIVERSITY OF MICHIGAN, ML, AND C. CHIU, NATIONAL TAIWAN
UNIVERSITY, TAIPEI, TAIWAN MEMS ON BULK MECHANICAL CONTOUR SUBSTRATES
4D2.09P W. LI AND C. HO, UNIVERSITY OF CALIFORNIA-LOS ANGELES, LOS
ANGELES, CA A NEW FRONTSIDE-RELEASE ETCH-DIFFUSION PROCESS FOR THE
FABRICATION OF THICK SI MICROSTRUCTURES 4D2.10P J.WEIGOLD AND S. PANG,
UNIVERSITY OF MICHIGAN, ANN ARBOR, ML THE INFLUENCE OF CRYSTAL QUALITY
ON THE PIEZORESISTIVE EFFECT OF B-SIC BETWEEN RT AND 450 C MEASURED BY
USING MICROSTRUCTURES 4D2.11P J. STRASS, M. EICKHOFF AND G. KROETZ,
DAIMLER BENZ AG, MUNICH, GERMANY CHARACTERISTICS OF PZT THIN FILMS AS A
FUNCTION OF APPLIED BIAXIAL STRESS 4D2.12P J. SHEPARD, JR., S.
TROLIER-MCKINSTRY, THE PENNSYLVANIA STATE UNIVERSITY, UNIVERSITY PARK,
PA, M. HENDRICKSON AND R. ZETO, THE UNITED STATES ARMY RESEARCH
LABORATORY ELECTROPLATED SOFT MAGNETIC MATERIALS FOR MICROSENSORS AND
MICROACTUATORS 4D2.13 W.TAYLOR AND M. ALLEN, GEORGIA INSTITUTE OF
TECHNOLOGY, ATLANTA, GA 6719/97 4A3 MICRORELAYS DOMINIQUE COTTARD,
UNIVERSITY OF TOKYO CHANG-JIN KIM, UNIVERSITY OF CALIFORNIA - LOS
ANGELES A MICRO VARIABLE INDUCTOR CHIP USING MEMS RELAYS S. ZHOU, X. SUN
AND W. CARR, NEW JERSEY INSTITUTE OF TECHNOLOGY, NEWARK, NJ 4A3.01
NONLINEAR ELECTROMECHANICAL BEHAVIOR OF AN ELECTROSTATIC MICRORELAY
4A3.02 M. GRETILLAT, N. DE ROOIJ, UNIVERSITY OF NEUCHATEL, NEUCHATEL,
SWITZERLAND, Y.YANG, E. HUNG, V. RABINOVICH, S. SENTURIA, MASSACHUSETTS
INSTITUTE OF TECHNOLOGY, AND G. ANANTHASURESH, UNIVERSITY OF
PENNSYLVANIA MEASUREMENT AND MODELING OF ELECTROSTATICALLY ACTUATED,
SURFACE MICROMACHINED SWITCHES S. MAJUMDER, N. MCGRUER, R. MORRISON AND
P. ZAVRACKY, NORTHEASTERN UNIVERSITY, BOSTON, MA 4A3.03 INTEGRATED
MAGNETIC MICRORELAYS: NORMALLY OPEN, NORMALLY CLOSED, AND MULTI-POLE
DEVICES 4A3.04 W. TAYLOR AND M. ALLEN, GEORGIA INSTITUTE OF TECHNOLOGY,
ATLANTA, GA THERMAL BUCKLING ACTUATOR FOR MICRO RELAYS T. SEKI, M.
SAKATA, T. NAKAJIMA AND M. MATSUMOTO, OMRON CORPORATION, IBARAKI, JAPAN
4A3.05 DEVELOPMENT OF MICROMACHINED SWITCHES WITH INCREASED RELIABILITY
4A3.06P K. HILTMANN, B. SCHMIDT, H. SANDMAIER AND W. LANG, HAHN-
SCHICKARD-LNSTITUTE OF MICRO- AND INFORMATIONTECHNOLOGY IMIT,
VILLINGEN-SCHWENNINGEN, GERMANY PARALLEL-RESONATOR HF MICROMECHANICAL
BANDPASS FILTERS F. BANNON III, J. CLARK, A. WONG AND C. NGUYEN,
UNIVERSITY OF MICHIGAN, ANN ARBOR, ML 4A3.07P MICROMECHANICAL RELAY WITH
ELECTROSTATIC ACTUATION 4A3.08P I. SCHIELE, B. HILLERICH, F. KOZLOWSKI,
FRAUNHOFER-LNSTITUTE FOR SOLID STATE TECHNOLOGY, MUNICH, GERMANY, AND C.
EVERS, ROHDE UND SCHWARZ DATE: 6/19/97 4B3 PHYSICAL SENSORS LONG-SHENG
FAN, IBM ALMADEN RESEARCH CENTER MASANORI OKUYAMA, OSAKA UNIVERSITY
OPTICAL MICRO ENCODER USING A TWIN-BEAM VCSEL WITH INTEGRATED
MICROLENSES H. MIYAJIMA, E. YAMAMOTO AND K. YANAGISAWA, OLYMPUS OPTICAL
COMPANY, LTD., TOKYO, JAPAN 4B3.01 MONOLITHIC PYROELECTRIC INFRARED
IMAGE SENSOR USING PVDF THIN FILM 4B3.02 N. FUJITSUKA, J. SAKATA, Y.
MIYACHI, K. MIZUNO, K. OHTSUKA, Y. TAGA, TOYOTA CENTRAL RESEARCH AND
DEVELOPMENT LABORATORIES, INC., AICHI-KEN, JAPAN, AND O.TABATA,
RITSUMEIKAN UNIVERSITY, SHIGA-KEN, JAPAN WAFER-SCALE PROCESSING,
ASSEMBLY, AND TESTING OF TUNNELING INFRARED DETECTORS 4B3.03 J. GRADE,
A. BARZILAI, J. REYNOLDS, C. LIU, A. PARTRIDGE, T. KENNY, STANFORD
UNIVERSITY, STANFORD, CA, AND H. JERMAN, I.C. SENSORS GAS SPECTROMETRY
BASED ON PYROELECTRIC THIN FILM ARRAYS INTEGRATED ON SILICON 4B3.04 B.
WILLING, M. KOHLI, P. MURALT, N. SETTER, ECOLE POLYTECHNIQUE FEDERATE DE
LAUSANNE, LAUSANNE, SWITZERLAND, AND O. OEHLER, OEHLER AND FISCHER AG,
SWITZERLAND MICROMACHINED HOT-FILAMENT LONIZATION PRESSURE SENSOR AND
MAGNETOMETER 4B3.05 K. WILLIAM AND R. MULLER, UNIVERSITY OF CALIFORNIA
AT BERKELEY, BERKELEY, CA A HIGH PERFORMANCE AMORPHOUS SI1-XCX:H
THERMISTOR BOLOMETER BASED ON MICRO-MACHINED STRUCTURE 4B3.06P T.
ICHIHARA, Y. WATABE, Y. HONDA AND K. AIZAWA, MATSUSHITA ELECTRIC WORKS,
LTD., OSAKA, JAPAN A SILICON MICROSYSTEM - MINIATURISED INFRARED
SPECTROMETER 4B3.07P M. BLOMBERG, A. LEHTO, VTT ELECTRONICS, ESPOO,
FINLAND, O. RUSANEN AND K. KERANEN, VTT ELECTRONICS, OULU, FINLAND CMOS
INTEGRATED INFRARED SENSORS D. CHANG, D. CHEN, F. LIN, W. KAISER AND O.
STAFSUDD, UNIVERSITY OF CALIFORNIA, LOS ANGELES, CA 4B3.08P AN
INTEGRATED THERMOPILE STRUCTURE WITH HIGH RESPONSIVITY USING ANY
STANDARD CMOS 4B3.09P Z. OLGUN, O. AKAR, H. KULAH AND T. AKIN, MIDDLE
EAST TECHNICAL UNIVERSITY, ANKARA, TURKEY EPOXY-PROTECTED THERMOPILE AS
HIGH SENSITIVE HEAT FLUX SENSOR V. MEYER, N. SCHNEEBERGER AND B. KELLER,
ETH ZURICH, SWITZERLAND 4B3.10P 21 SINGLE CRYSTAL SILICON MICROMACHINED
PULSED INFRARED LIGHT SOURCE 4B3.11P H. YUASA, S. OHYA, S. KARASAWA,
KANAGAWA INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, KANAGAWA, JAPAN, K.
AKIMOTO, KOMYO RIKAGAKU KOGYO K.K., AND S. KODATO, ANRITSU CORPORATION
TRANSDUCERS 97 1997 INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS AND
ACTUATORS CHICAGO, JUNE 16-19, 1997 MINIATURE OPTICAL SCANNING SENSOR
UTILIZING A SILICON MICROMACHINED SCANNER 4B3.12P H. TOTANI, H. GOTO, M.
IKEDA AND T. YADA, OMRON CORPORATION, IBARAKI, JAPAN NEW STRUCTURE FOR
DC-65GHZ THERMAL POWER SENSOR 4B3.13P S. KODATO, T. WAKABAYASHI, Q.
ZHUANG AND S. UCHIDA, ANRITSU CORPORATION, KANAGAWA, JAPAN A SIMPLE
IONIZING RADIATION SPECTROMETER/DOSIMETER BASED ON RADIATION SENSING
FIELD EFFECT TRANSISTORS (RADFETS) 4B3.14P D. MORENO, R. HUGHES, M.
JENKINS AND C. DRUMM, SANDIA NATIONAL LABORATORIES, ALBUQUERQUE, NM
HUMAN INFORMATION SENSOR 4B3.15P K. MORINAKA, K. HASHIMOTO, M. KAWAGURI
AND N. YOSHIIKE, MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD., OSAKA, JAPAN
PEOPLE COUNT SYSTEM USING MULTI-SENSING APPLICATION 4B3.16P K.
HASHIMOTO, K. MORINAKA, N. YOSHIIKE, MATSUSHITA ELECTRIC INDUSTRIAL
COMPANY, LTD., OSAKA, JAPAN, C. KAWAGUCHI, AND S. MATSUEDA, KYUSHU
MATSUSHITA ELECTRIC COMPANY, LTD. A MICROMACHINED SENSOR FOR IN-SITU
POLYMER BUILDUP MONITORING IN REACTIVE ION ETCHING SYSTEMS 4B3.17P J.
KIM AND K. WISE, UNIVERSITY OF MICHIGAN, ANN ARBOR, ML A NOVEL DETECTION
SCHEME FOR LARGE AREA IMAGING OF LOW ENERGY X-RAYS USING AMORPHOUS
SILICON TECHNOLOGY 4B3.18P K. AFLATOONI, A. NATHAN AND R. HORNSEY,
UNIVERSITY OF WATERLOO, WATERLOO, ONTARIO, CANADA DATE: 6/19/97 4C3 TON
SENSORS ANTONIO RICCO, SANDIA NATIONAL LABORATORIES BYONG-KL SOHO,
KYUNGPOOK NATIONAL UNIVERSITY DEVELOPMENT OF A SOLID-STATE
POTENTIOMETRIC HEPARIN SENSING CARTRIDGE BASED ON PHOTOCROSSLINKED DECYL
METHACRYLATE 4C3.01 T. AMBROSE, R. HOWER, R. BROWN AND M. MEYERHOFF,
UNIVERSITY OF MICHIGAN, ANN ARBOR, MI A DRIFT FREE NERNSTIAN IRIDIUM
OXIDE PH SENSOR 4C3.02 J. HENDRIKSE, W. OLTHUIS AND P. BERGVELD,
UNIVERSITY OF TWENTE, ENSCHEDE, THE NETHERLANDS ISOLATION AND
IDENTIFICATION OF DRIFT SOURCES IN PLANAR ION SENSORS DURING INITIAL
WATER UPTAKE: CORRELATION OF MODELS AND EXPERIMENT 4C3.03 D. HARRISON,
M. ROTHMAIER AND Z. LI, UNIVERSITY OF ALBERTA, EDMONTON, AB, CANADA A
UNIVERSAL COULOMETRIC NANOTITRATOR 4C3.04 O. GUENAT, P. ARQUINT, W.
MORF, B. VAN DER SCHOOT AND N. DE ROOIJ, UNIVERSITY OF NEUCHATEL,
NEUCHATEL, SWITZERLAND A PHYSICALLY-BASED MODEL FOR DRIFT IN AI2O3 PH
ISFETS 4C3.05 S. JAMASB, CIRRUS LOGIC, INC. & UNIVERSITY OF CALIFORNIA,
DAVIS, CA, S. COLLINS AND R. SMITH, UNIVERSITY OF CALIFORNIA, DAVIS, CA
ENZUMATIC SENSORS BASED ON THE ISFETS FOR DETERMINATION OF HEAVY METAL
IONS IN SOME VEGETABLES 4C3.06PL N. STARODUB, V. STARODUB, M. KANJUK,
K.TERNOVOJ, NASU, KIEV, UKRAINE, AND W.TORBICZ, POLISH ACADEMY OF
SCIENCES, WARSAW, POLAND TRANSDUCERS 97 1997 INTERNATIONAL CONFERENCE
ON SOLID-STATE SENSORS AND ACTUATORS CHICAGO, JUNE 16-19, 1997 DATE:
6/19/97 4D3 PRESSURE SENSORS YAO CHENG, SYNCHROTRON RADIATION RESEARCH
CENTER JOSEPH GTACHINO, FORD MOTOR COMPANY A BATCH-PROCESSED
VACUUM-SEALED CAPACITIVE PRESSURE SENSOR 4D3.01 A. CHAVAN AND K. WISE,
THE UNIVERSITY OF MICHIGAN, ANN ARBOR, ML A HIGH DENSITY CAPACITIVE
PRESSURE SENSOR ARRAY FOR FINGERPRINT SENSOR APPLICATION 4D3.02 P. REY,
P. CHARVET, M. DELAYE, LETI (CEA-TECHNOLOGIES AVANCEES), GRENOBLE CEDEX,
FRANCE, AND S. HASSAN, SEPT/PEM, CAEN, FRANCE A NOVEL ELECTROSTATIC
SERVO CAPACITIVE VACUUM SENSOR 4D3.03 Y. WANG AND M. ESASHI, ZHEJIANG
UNIVERSITY, HANGZHOU, CHINA A COMBINED PIEZORESISTIVE/CAPACITIVE
PRESSURE SENSOR WITH SELF-TEST FUNCTION BASED ON THERMAL ACTUATION
4D3.04 R. PUERS, D. DE BRUYKER AND A. COZMA, KATHOLIEKE UNIVERSITEIT
LEUVEN, HEVERLEE, BELGIUM AN INNOVATIVE PIRANI PRESSURE SENSOR 4D3.05 B.
CHOU AND J. SHIE, NATIONAL CHIAO TUNG UNIVERSITY, TAIWAN FABRY-PEROT
PRESSURE SENSOR ARRAYS FOR IMAGING SURFACE PRESSURE DISTRIBUTIONS
4D3.06P M. MILLER, M. ALLEN, PHYSICAL SCIENCES, INC., ANDOVER, MA, E.
ARKILIC, K. BREUER AND M. SCHMIDT, MASSACHUSETTS INSTITUTE OF
TECHNOLOGY, CAMBRIDGE, MA A VERY HIGH DENSITY BULK MICROMACHINED
CAPACITIVE TACTILE IMAGER 4D3.07P R. DE SOUZA AND K. WISE, UNIVERSITY OF
MICHIGAN, ANN ARBOR, ML CAPACITIVE DIFFERENTIAL PRESSURE SENSOR WITH
HIGH OVERLOAD CAPABILITY USING SILICON/GLASS TECHNOLOGY 4D3.08P S. HEIN,
ROBERT BOSCH COMPANY, REUTLINGEN, GERMANY, K. HOLZNER, V. SCHLICHTING,
E. OBERMEIER, TECHNICAL UNIVERSITY OF BERLIN, BERLIN, GERMANY, AND K.
BARTON, ELSAG BAILEY, HARTMANN & BRAUN, GPP A SILICON PRESSURE SENSOR
WITH STAINLESS DIAPHRAGM FOR HIGH TEMPERATURE AND CHEMICAL APPLICATION
4D3.09P H. TERABE, H. ARASHIMA, N. URA, K. SUZUKI, K. OHTA, TOYODA
MACHINE WORKS, LTD., KARIYA, JAPAN, AND M. ISHIDA, TOYOHASHI UNIVERSITY
OF TECHNOLOGY, TOYOHASHI, JAPAN 1 CHIP INTEGRATED SOFTWARE CALIBRATED
CMOS PRESSURE SENSOR WITH MCU, A/D CONVERTER, D/A CONVERTER, DIGITAL
COMMUNICATION PORT, SIGNAL CONDITIONING CIRCUIT AND TEMPERATURE SENSOR
4D3.10P Y. YOSHII, A. NAKAJO, H. ABE, K. NINOMIYA, H. MIYASHITA, N.
SKURAI, M. KOSUGE, NIPPON MOTOROLA, LTD.,SENDAI, JAPAN, AND S. HAO,
MOTOROLA CHINA ELECTRONICS, LTD. A FIBER-OPTIC PRESSURE MICROSENSOR FOR
BIOMEDICAL APPLICATIONS O. TOHYAMA, M. KOHASHI, M. FUKUI AND H. ITOH,
MITSUBISHI CABLE INDUSTRIES, LTD., HYOGO-PREF., JAPAN 4D3.11P ACCURATE,
COST EFFECTIVE ABSOLUTE PRESSURE SENSOR 4D3.12P Y. SUZUKI, T. KUDO AND
K. IKEDA, YOKOGAWA ELECTRIC CORPORATION, NAGANO PREF., JAPAN BULK
MICROMACHINED VACUUM SENSOR 4D3.13P R. GUTIERREZ, T. TANG, C. STELL, V.
VORPERIAN AND K. SCHEGLOV, JET PROPULSION LABORATORY, PASADENA, CA A
VERTICALLY INTEGRATED MEDIA-ISOLATED ABSOLUTE PRESSURE SENSOR 4D3.14P K.
GOLDMAN, G. GRITT, I. BASKETT, K. SOORIAKUMAR, D.WALLACE, D. HUGHES AND
M. SHAH, MOTOROLA SEMICONDUCTOR PRODUCTS SECTOR, PHOENIX, AZ 22
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| title_exact_search | Digest of technical papers June 16 - 19, 1997, Chicago, Illinois, USA |
| title_full | Digest of technical papers June 16 - 19, 1997, Chicago, Illinois, USA 1 Sessions 1A1 - 2D3, papers 1A1.01 - 2D3.14PL 1997 International Conference on Solid State Sensors and Actuators |
| title_fullStr | Digest of technical papers June 16 - 19, 1997, Chicago, Illinois, USA 1 Sessions 1A1 - 2D3, papers 1A1.01 - 2D3.14PL 1997 International Conference on Solid State Sensors and Actuators |
| title_full_unstemmed | Digest of technical papers June 16 - 19, 1997, Chicago, Illinois, USA 1 Sessions 1A1 - 2D3, papers 1A1.01 - 2D3.14PL 1997 International Conference on Solid State Sensors and Actuators |
| title_short | Digest of technical papers |
| title_sort | digest of technical papers june 16 19 1997 chicago illinois usa sessions 1a1 2d3 papers 1a1 01 2d3 14pl |
| title_sub | June 16 - 19, 1997, Chicago, Illinois, USA |
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