Electronic packaging: materials and processes to reduce package cycle time and improve reliability: proceedings of the 7th Electronic Materials and Processing Congress, 24 - 27 August 1992, Cambridge, Massachusetts, USA
Gespeichert in:
| Weitere Verfasser: | |
|---|---|
| Format: | Tagungsbericht Buch |
| Sprache: | English |
| Veröffentlicht: |
Materials Park, Ohio
ASM International
1992
|
| Schlagworte: | |
| Beschreibung: | VIII, 260 S. Ill., graph. Darst. |
| ISBN: | 0871704498 |
Internformat
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| 245 | 1 | 0 | |a Electronic packaging: materials and processes to reduce package cycle time and improve reliability |b proceedings of the 7th Electronic Materials and Processing Congress, 24 - 27 August 1992, Cambridge, Massachusetts, USA |c production manager Linda Kacprzak |
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| genre_facet | Konferenzschrift 1992 Cambridge Mass. |
| id | DE-604.BV023809724 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T21:37:17Z |
| institution | BVB |
| institution_GND | (DE-588)5220111-9 |
| isbn | 0871704498 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-017451893 |
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| physical | VIII, 260 S. Ill., graph. Darst. |
| publishDate | 1992 |
| publishDateSearch | 1992 |
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| publisher | ASM International |
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| spelling | Electronic packaging: materials and processes to reduce package cycle time and improve reliability proceedings of the 7th Electronic Materials and Processing Congress, 24 - 27 August 1992, Cambridge, Massachusetts, USA production manager Linda Kacprzak Materials Park, Ohio ASM International 1992 VIII, 260 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Zuverlässigkeit (DE-588)4059245-5 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Werkstoff (DE-588)4065579-9 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 1992 Cambridge Mass. gnd-content Elektronisches Bauelement (DE-588)4014360-0 s Werkstoff (DE-588)4065579-9 s Zuverlässigkeit (DE-588)4059245-5 s DE-604 Kacprzak, Linda edt Electronic Materials and Processing Congress 7 1992 Cambridge, Mass. Sonstige (DE-588)5220111-9 oth |
| spellingShingle | Electronic packaging: materials and processes to reduce package cycle time and improve reliability proceedings of the 7th Electronic Materials and Processing Congress, 24 - 27 August 1992, Cambridge, Massachusetts, USA Zuverlässigkeit (DE-588)4059245-5 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd Werkstoff (DE-588)4065579-9 gnd |
| subject_GND | (DE-588)4059245-5 (DE-588)4014360-0 (DE-588)4065579-9 (DE-588)1071861417 |
| title | Electronic packaging: materials and processes to reduce package cycle time and improve reliability proceedings of the 7th Electronic Materials and Processing Congress, 24 - 27 August 1992, Cambridge, Massachusetts, USA |
| title_auth | Electronic packaging: materials and processes to reduce package cycle time and improve reliability proceedings of the 7th Electronic Materials and Processing Congress, 24 - 27 August 1992, Cambridge, Massachusetts, USA |
| title_exact_search | Electronic packaging: materials and processes to reduce package cycle time and improve reliability proceedings of the 7th Electronic Materials and Processing Congress, 24 - 27 August 1992, Cambridge, Massachusetts, USA |
| title_full | Electronic packaging: materials and processes to reduce package cycle time and improve reliability proceedings of the 7th Electronic Materials and Processing Congress, 24 - 27 August 1992, Cambridge, Massachusetts, USA production manager Linda Kacprzak |
| title_fullStr | Electronic packaging: materials and processes to reduce package cycle time and improve reliability proceedings of the 7th Electronic Materials and Processing Congress, 24 - 27 August 1992, Cambridge, Massachusetts, USA production manager Linda Kacprzak |
| title_full_unstemmed | Electronic packaging: materials and processes to reduce package cycle time and improve reliability proceedings of the 7th Electronic Materials and Processing Congress, 24 - 27 August 1992, Cambridge, Massachusetts, USA production manager Linda Kacprzak |
| title_short | Electronic packaging: materials and processes to reduce package cycle time and improve reliability |
| title_sort | electronic packaging materials and processes to reduce package cycle time and improve reliability proceedings of the 7th electronic materials and processing congress 24 27 august 1992 cambridge massachusetts usa |
| title_sub | proceedings of the 7th Electronic Materials and Processing Congress, 24 - 27 August 1992, Cambridge, Massachusetts, USA |
| topic | Zuverlässigkeit (DE-588)4059245-5 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd Werkstoff (DE-588)4065579-9 gnd |
| topic_facet | Zuverlässigkeit Elektronisches Bauelement Werkstoff Konferenzschrift 1992 Cambridge Mass. |
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